Patents Assigned to CelLink Corporation
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Publication number: 20240154277Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Brown, Paul Tsao
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Patent number: 11979976Abstract: Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.Type: GrantFiled: July 22, 2021Date of Patent: May 7, 2024Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Dongao Yang, Michael Lawrence Miller, Paul Henry Lego
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Patent number: 11950377Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge.Type: GrantFiled: April 14, 2023Date of Patent: April 2, 2024Assignee: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Casey Anderson, Will Findlay, Gabrielle Tate, Shawn D'Gama, Arturo Cantu-Chavez
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Publication number: 20240098873Abstract: Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.Type: ApplicationFiled: November 28, 2023Publication date: March 21, 2024Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Parker Brown, Dongao Yang, Michael Lawrence Miller, Paul Henry Lego
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Publication number: 20240088585Abstract: A connector for connecting a flexible interconnect circuit includes a base, having a first set of protrusions and a second set of protrusions. The first set of protrusions and the second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further includes a cover piece configured to secure the flexible interconnect circuit in the arched configuration.Type: ApplicationFiled: November 22, 2023Publication date: March 14, 2024Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Emily Hernandez, Mark Terlaak
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Patent number: 11894580Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.Type: GrantFiled: July 14, 2023Date of Patent: February 6, 2024Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Brown, Paul Tsao
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Patent number: 11888180Abstract: Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity.Type: GrantFiled: July 14, 2023Date of Patent: January 30, 2024Assignee: CelLink CorporationInventors: Will Findlay, Mark Terlaak, Kevin Michael Coakley, Malcolm Parker Brown, Emily Hernandez
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Patent number: 11876312Abstract: A connector for connecting a flexible interconnect circuit includes a base, having a first set of protrusions and a second set of protrusions. The first set of protrusions and the second set of protrusions are configured to secure the flexible interconnect circuit at a first set of apertures and a second set of apertures of the flexible interconnect circuit, respectively. The first set of protrusions may be positioned at a first distance from the second set of protrusions on the base. The first set of apertures may be positioned on the flexible interconnect circuit at a second distance, greater than the first distance, from the second set of apertures. The base causes the flexible interconnect circuit into an arched configuration when the apertures are secured to the respective protrusions. The connector further includes a cover piece configured to secure the flexible interconnect circuit in the arched configuration.Type: GrantFiled: September 28, 2021Date of Patent: January 16, 2024Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Emily Hernandez, Mark Terlaak
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Publication number: 20230402776Abstract: Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g.Type: ApplicationFiled: August 28, 2023Publication date: December 14, 2023Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Emily Hernandez, Mark Terlaak, Malcom Parker Brown
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Publication number: 20230371174Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: ApplicationFiled: July 12, 2023Publication date: November 16, 2023Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Publication number: 20230369731Abstract: Provided are interconnects for interconnecting a set of battery cells, assemblies comprising these interconnects, methods of forming such interconnects, and methods of forming such assemblies. An interconnect includes a conductor comprising two portions electrically isolated from each other. At least one portion may include two contacts for connecting to battery cells and a fuse forming an electrical connection between these two contacts. The interconnect may also include an insulator adhered to the conductor and mechanically supporting the two portions of the conductor. The insulator may include an opening such that the fuse overlaps with this opening, and the opening does not interfere with the operation of the fuse. In some embodiments, the fuse may not directly interface with any other structures. Furthermore, the interconnect may include a temporary substrate adhered to the insulator such that the insulator is disposed between the temporary substrate and the conductor.Type: ApplicationFiled: July 14, 2023Publication date: November 16, 2023Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Brown, Paul Tsao
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Publication number: 20230361434Abstract: Provided are multilayered flexible battery interconnects for interconnecting batteries in battery packs and methods of fabricating thereof. A multilayered flexible battery interconnect comprises insulating layers and two conductive layers, stacked together and positioned between the insulating layers. One conductive layer is thicker than the other. The thinner conductive layer comprises flexible tabs for connecting to batteries and, in some examples, comprises voltage sense traces. The smaller thickness of these flexible tabs ensures welding quality and allows using less energy during welding. The battery cell contacts, to which these flexible tabs are welded, can be significantly thicker. Furthermore, the smaller thickness enables fusible link integration into flexible tabs. At the same time, the two conductive layers collectively conduct current within the interconnect, with the thicker layer enhancing the overall current-carrying capacity.Type: ApplicationFiled: July 14, 2023Publication date: November 9, 2023Applicant: CelLink CorporationInventors: Will Findlay, Mark Terlaak, Kevin Michael Coakley, Malcolm Parker Brown, Emily Hernandez
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Patent number: 11791577Abstract: Described herein are circuit assemblies comprising flexible interconnect circuits and/or other components connected to these circuits. In some examples, conductive elements of different circuits are connected with support structures, such as rivets. Furthermore, conductive elements of the same circuit can be interconnected. In some examples, a conductive element of a circuit is connected to a printed circuit board (or other devices) using a conductor-joining structure. Interconnecting different circuits involves stacking these circuits such that the conductive element in one circuit overlaps with the conductive element in another circuit. A support structure protrudes through both conductive elements and any other components positioned in between, such as dielectric and/or adhesive layers. This structure electrically connects the conductive elements and also compresses the conductive elements toward each other. For example, a rivet is used with the rivet heads contacting one or two conductive elements, e.g.Type: GrantFiled: October 1, 2021Date of Patent: October 17, 2023Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Emily Hernandez, Mark Terlaak, Malcolm Parker Brown
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Patent number: 11751328Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: GrantFiled: February 22, 2023Date of Patent: September 5, 2023Assignee: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Publication number: 20230269870Abstract: Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.Type: ApplicationFiled: February 22, 2023Publication date: August 24, 2023Applicant: CelLink CorporationInventors: Jean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
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Publication number: 20230116550Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: ApplicationFiled: October 31, 2022Publication date: April 13, 2023Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay
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Publication number: 20230101123Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.Type: ApplicationFiled: November 30, 2022Publication date: March 30, 2023Applicant: CelLink CorporationInventors: Kevin Michael Coakley, Malcom Parker Brown, Mark Terlaak, Will Findlay
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Patent number: 11545773Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector for connecting to a flexible interconnect circuit comprises a base comprising a housing chamber defined by at least a first side wall and a second side wall that are oppositely positioned about the base. A circuit clamp is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. A cover piece is coupled to the base via a second hinge, and is configured to move between an open position and a closed position. The circuit clamp is configured to secure the flexible interconnect circuit between the base and the circuit clamp in the clamped position. One or more protrusions on the circuit clamp are each configured to interface with a socket within the first or second side wall to secure the circuit clamp in the clamped position.Type: GrantFiled: July 27, 2020Date of Patent: January 3, 2023Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Mark Terlaak, Will Findlay
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Patent number: 11532902Abstract: Provided are terminal-free connectors for flexible interconnect circuits. A connector comprises a housing chamber defined by at least a first side wall and a second side wall oppositely positioned about the base. An edge support is positioned at each of the first side wall and the second side wall. The edge supports allow for precise placement of the flexible interconnect circuit inside the housing chamber. A cover piece is coupled to the base via a first hinge, and is configured to move between a released position and a clamped position. The cover piece includes a clamp portion securing the flexible interconnect circuit against the edge supports in the clamped position. A slider may be configured to move between an extended position and an inserted position within the housing chamber, and may include a convex upper surface configured to urge the flexible interconnect circuit upwards in the inserted position.Type: GrantFiled: July 22, 2021Date of Patent: December 20, 2022Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Mark Terlaak, Will Findlay
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Patent number: 11516904Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.Type: GrantFiled: November 17, 2021Date of Patent: November 29, 2022Assignee: CelLink CorporationInventors: Kevin Michael Coakley, Malcolm Parker Brown, Jose Juarez, Emily Hernandez, Joseph Pratt, Peter Stone, Vidya Viswanath, Will Findlay