Abstract: A constant power adaptive current limiting protection circuit includes a switching power supply circuit, a detecting circuit, and a controlling circuit. The switching power supply circuit has at least one power switch assembly and an output terminal. The detecting circuit is coupled to the output terminal of the switching power supply circuit to detect an output voltage and an output current of the power signal. The controlling circuit is coupled to the switching power supply circuit and the detecting circuit. The controlling circuit is configured to output the PWM signal, calculate a current limiting threshold based on a protection power and the output voltage, and selectively execute a protecting action based on comparison between the output current and the current limiting threshold. The protecting action is adjusting the PWM signal, so as to limit the output power of the switching power supply circuit to below the protection power.

Abstract: An inspection system with a thermal interface, and an electronic component inspection device and method are provided. First, a temperature regulator contacts an electronic component to be tested, where there is a thermal interface between the temperature regulator and the electronic component to be tested, and the electronic component to be tested includes a plurality of temperature sensing units. Then, the temperature regulator heats or cools the electronic component to be tested to a specific temperature, and the plurality of temperature sensing units of the electronic component to be tested detect temperatures at locations of the temperature sensing units. In this way, a contact condition between the temperature regulator and the electronic component to be tested, and quality or an aging status of the thermal interface can be determined.

Abstract: A semiconductor package workpress module having pressing blocks is provided. The semiconductor package workpress module includes a base and a plurality of movable pressing blocks. The base includes an internal chamber and a plurality of open slots. The open slots are in communication with the internal chamber. The movable pressing blocks are accommodated in the open slots of the base. The movable pressing blocks correspond to different regions on the semiconductor package. In response to that the internal chamber is filled with high-pressure fluid, the movable pressing blocks generate a pressing force toward the regions. A semiconductor package testing apparatus is also provided. A controller is configured to control the fluid supply unit to supply the high-pressure fluid for the internal chamber of the base and configured to perform a test on the semiconductor package through a testing stage.

Abstract: The present invention relates to an apparatus for testing a package-on-package semiconductor device, mainly comprising a pick-and-place device, a test socket, an upper chip holder, and a main controller. When a first package device is to be tested, the main controller controls the pick-and-place device to load the first package device into the test socket and then controls the pick-and-place device to transfer the upper chip holder and bring the upper chip holder into electrical contact with the first package device on the test socket so that a second package device in the upper chip holder is electrically connected to the first package device for testing. Accordingly, the upper chip holder is an independent component. Only when a test is executed, the pick-and-place device transfers the upper chip holder onto the test socket so that the second package device is electrically connected to the first package device.

Abstract: An adapter bracket includes a holder and a fixing element. The holder includes a first strip-shaped body and a second strip-shaped body. The first strip-shaped body is formed with a plurality of first notches linearly arranged on a first coupling surface of the first strip-shaped body. The second strip-shaped body is formed with a plurality of second notches linearly arranged on a second coupling surface of the second strip-shaped body. The fixing element detachably couples the first strip-shaped body and the second strip-shaped body together, so that the first coupling surface and the second coupling surface are in contact with each other, and the first notches and the second notches are jointly combined into a plurality of fastening holes arranged linearly, and each of the fastening holes can hold an object therein.

Abstract: Provided are a detection system, compensation method and computer-readable recording medium applicable to semiconductor surface morphology to provide feature information corresponding to spectral signals to a neural network model and provide feature information corresponding to spectral signals, a detected height, and an actual height actually measured to another neural network model. The combinational neural network models thus trained and built can generate a compensation value for a to-correct height corresponding to a to-correct spectral signal having variability. The compensation value provides required compensation for height information to not only enhance the precision of the detection of semiconductor surface morphology but also enhance the reliability of the detection system.

Abstract: A source measure device includes a current sampling circuit, a voltage sampling circuit, an overvoltage detecting circuit, and a comparing circuit. The current sampling circuit is configured to sample a current of a device under test. The voltage sampling circuit is configured to sample a voltage of the device under test. The overvoltage detecting circuit is coupled to the current sampling circuit and the voltage sampling circuit, and receives a first operation voltage of the current sampling circuit and a second operation voltage of the voltage sampling circuit so as to generate a detection voltage. The comparing circuit is coupled to the overvoltage detecting circuit, and determines whether the detection voltage is within a voltage range. If the detection voltage is not within the voltage range, the comparing circuit generates an abnormal signal.

Abstract: An On-board charge test method includes: providing, according to one of a plurality of test parameter sets, a corresponding charging environment by a power supply to detect the state of an on-board charger in a corresponding first stage of a plurality of stages of a charging process, wherein the stages correspond to the test parameter sets and a plurality of stage enter condition; detecting a control pilot feedback signal generated by the on-board charger in each of the stages; and after the on-board charger enters the first stage for a period of time, providing, according to the one or another one of the test parameter sets, the corresponding charging environment to detect the state of the on-board charger in a corresponding second stage behind the first stage of the stages when the signal parameter of the control pilot feedback signal meets the stage enter condition corresponding to the first stage.

Abstract: An electronic device and a method for predicting dust accumulation in a cooling vent thereof are provided. The electronic device includes a housing, a power supply board, an environmental temperature sensing module, a work area temperature sensing module, a storage, and a processor. The environmental temperature sensing module is configured to measure an environmental temperature inside the housing. The work area temperature sensing module is configured to measure a working temperature of a work area. The processor is configured to respectively calculate an average environmental temperature and an average working temperature based on a plurality of environmental temperatures and a plurality of working temperatures in an analysis period, and calculate an estimated value of dust accumulation in the cooling vent. The processor is configured to send a warning signal when the estimated value of dust accumulation is greater or equal to a dust accumulation warning value.

Abstract: An electronic element testing device with a fastening-based depressing mechanism includes a carrier platform, a support frame, a depressing mechanism, a displacement adjustment module, and a test socket. The support frame is arranged on the carrier platform. The depressing mechanism is connected to the support frame. The depressing mechanism includes a lifting module, a depressing head, and a fastening module. The depressing head is connected to the lifting module. The lifting module is configured to drive the depressing head to move toward or away from the carrier platform. The fastening module is configured to fasten the lifting module. The displacement adjustment module is arranged above the carrier platform. The test socket includes a slot for accommodating an electronic element. The test socket is connected to the displacement adjustment module. The displacement adjustment module is configured to adjust displacement of the test socket in at least one axial direction.

Abstract: The present invention discloses a detection device and a probe module thereof, wherein an electrical connection path between a battery detection frame and a battery under test is provided via the probe module. The probe module includes a base, a first polarity plate, a second polarity plate, a first upper connection group, a second upper connection group, a first lower connection member and a second lower connection member. Via the first polarity plate, the first upper connection group is correspondingly coupled to the battery detection frame, and the first lower connection member is correspondingly coupled to the battery under test. Via the second polarity plate, the second upper connection group is correspondingly coupled to the battery detection frame, and the second lower connection member is correspondingly coupled to the battery under test. Thus, it is not necessary to process a cable having been fixed on the battery detection frame when the probe module is replaced.

Abstract: A power transceiver device includes a housing, a circuit module and an electrical connector. The circuit module is located within the housing. The electrical connector includes a terminal base and two conductive terminals. The terminal base is fixed on one side surface of the housing. Each of the conductive terminals includes a sheet, an extending portion and an opening. One end of the sheet extends through a front face of the terminal base, another end thereof is electrically connected to the circuit module. The extending portion extends transversely from the end of the sheet, the opening is firmed on the extending portion, and a virtual axis of the opening passes through the front lateral face of the terminal base. The conductive terminals are switchably electrically connected to each other.

Abstract: An electronic component testing apparatus includes a controller, a transferring device, a testing socket, a workpress, and a testing board. The testing socket loads an electronic component. The controller is electrically connected to the transferring device, the workpress, and the testing board. In response to the transferring device transferring the testing socket to a testing area, the controller controls the workpress to press against the testing socket, and controls a locking mechanism of the workpress to lock the testing socket. In response to the locking mechanism locking the testing socket, the controller controls the workpress to move the testing socket on the testing board.

Abstract: The present invention relates to a pogo pin cooling system and a pogo pin cooling method and an electronic device testing apparatus having the system. The system uses a cooling fluid supply module for the cooling of the pogo pin, and the cooling fluid may be either a coolant or a cooling gas. When an electronic device is accommodated in the chip socket, the cooling fluid supply module supplies a cooling fluid into the chip socket through the cooling fluid supply channel and the inlet, and the cooling fluid passes through the pogo pins and then flows into the cooling fluid discharge channel through the outlet. In the present invention, the cooling fluid is mainly used to cool not only the pogo pins in the chip socket but also the bottom surface of the electronic device and the solder ball contacts on the bottom surface.

Abstract: A composite calibration plate includes a control board, a light detection board, a diffusion board, a light-emitting sheet, and a fluorescent sheet. The control board has a first setting surface and a second setting surface. The light detection board is stacked on the first setting surface. The diffusion board is stacked on the light detection board. The light-emitting sheet is stacked on the second setting surface and includes a plurality of self-luminous sources. The fluorescent sheet is optionally stacked on the light-emitting sheet or the diffusion board, and has a plurality of fluorescent chips. When calibrating the lighting device, the fluorescent sheet is disposed on the light-emitting sheet; and, when calibrating the imaging device, the fluorescent sheet is disposed on the light-emitting sheet, such that the fluorescent sheet is located at a focus position of an optical imaging path.

Abstract: An automated optical measurement system and method for a near eye display are provided. A controller first controls the near eye display to display a specific pattern, then controls a displacement generation module to drive an image sensing module toward or away from an imaging module, and controls the image sensing module to capture the specific pattern to obtain focus images; and the controller performs focusing according to the focus images. Finally, the controller measures an optical characteristic of the near eye display. Accordingly, the focusing method used is to capture the specific pattern displayed by the near eye display while moving the image sensing module, and perform automatic focusing by comparing the capture results.

Abstract: The present invention relates to a quick release assembly for a pressing head and an electronic device testing apparatus having the same. The quick release assembly comprises an upper base, an actuator and a lower base. When the lower base is to be mounted on the upper base, the actuator drives a movable head to a first position; the movable head passes through an open slot of the lower base; then, the actuator drives the movable head to a second position so that the lower base is retained by the movable head. The open slot of the lower base is firstly fitted on the movable head of the actuator located on the upper base. At this time, the actuator is controlled to drive the movable head to the second position from the first position.

Abstract: The present invention provides a two-way AC power conversion device configured to input or output a first AC power. The two-way AC power conversion device comprises a digital control module and a power conversion module. The digital control module generates a control signal. The power conversion module sets the first AC power to be input or output according to the control signal. Wherein when the digital control module determines a real-time voltage signal of the first AC power is abnormal, the power conversion module switches to provide a ground voltage according to the control signal.

Abstract: An electronic load device and an operating method thereof are provided. The operating method for the electronic load device includes operating a power module to control a load current drawn from a device under test as a first current signal according to a resistance parameter and an output voltage signal detected from the device under test, where the initial phase of the first current signal is the same as the initial phase of the output voltage signal; inputting the output voltage signal to a phase lock loop model for the signal locking; and generating a first pulse width modulation signal according to the received current parameter when the signal locking is completed, so that a switching load of the power module controls the load current to switch from the first current signal to a second current signal according to the first pulse width modulation signal.

Abstract: A power busbar device includes two output contacts, a plurality of insulation layers, a plurality of trace layers, a plurality of power supply contact groups, and a plurality of switching contact groups. The trace layers and the insulation layers are arranged in an interleaved stack. Each of the switching contact groups includes a first switching contact, a second switching contact, and a switch. The first switching contact, the second switching contact, and the power supply contact groups extend through the insulation layers and the trace layers. The switch enables connection or disconnection between the first switching contact and the second switching contact based on a switching state thereof. Each of the trace layers distributes traces connected to the output contacts, the switching contact groups and the power supply contact groups, to connect the power supply contact groups in series or in parallel based on the switching state of the switch.