Abstract: An apparatus for testing a package-on-package semiconductor device includes a top cover, a lower base, a heat dissipation module, and a plurality of probes. The lower base is disposed under the top cover so as to form an internal accommodation space for receiving an upper chip. The heat dissipation module includes a heat sink arranged in the internal accommodation space and attached to an upper surface of the upper chip. The probes are arranged in the lower base so as to electrically connect the upper chip with a lower chip. By the heat sink arranged in the internal accommodation space formed of the top cover and the lower base, heat generated from the upper chip during operation of the upper chip can be greatly dissipated so that the performance and the service life of the upper chip can be improved.

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

Abstract: A clock generating device includes a first timing delay module, a multiplexer, and a second timing delay module. The multiplexer is electrically connected to the first timing delay module. The second timing delay module is electrically connected to the multiplexer. The first timing delay module generates a plurality of delayed clock signals based on a reference clock signal. The multiplexer outputs a first delayed clock signal and a second delayed clock signal, among the plurality of delayed clock signals, based on a clock generating signal. The second timing delay module generates an output clock signal based on the clock generating signal, the first delayed clock signal and the second delayed clock signal.

Abstract: A test system with rotational test arms for testing semiconductor components includes a transport device, a first test socket, a second test socket, a first test arm, and a second test arm. The first test socket and the second test socket are electrically connected to different test signals respectively and correspond to the first test arm and the second test arm. The first test arm and the second test arm test arms operate rotationally to carry and place the semiconductor components to the transport device, the first test socket and the second test socket, so the test time is improved.

Abstract: A probe includes a first electrical conductor, a second electrical conductor and a voltage measurer. The first electrical conductor has a first through hole, and the first through hole extends through two ends of the first electrical conductor. The second electrical conductor is detachably disposed on the first electrical conductor, and the second electrical conductor has a working surface and a second through hole. The working surface is located at an end of the second electrical conductor away from the first electrical conductor. Two ends of the second through hole that are opposite to each other are located at the working surface and an end of the first through hole, respectively. The first through hole is communicated with the second through hole. The voltage measurer is penetrating through the first through hole and the second through hole.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Abstract: An apparatus for testing a package-on-package semiconductor device comprises a pick and place device for loading a first chip into or unloading the first chip from a test socket and a lifting and rotating arm for moving a chip placement module which receives a second chip to a position between the pick and place device and the test socket. The pick and place device and the chip placement module are lowered, and then a test process is performed. After the test process is completed, the pick and place device and the chip placement module are lifted, and the lifting and rotating arm moves the chip placement module to one side of the pick and place device. Accordingly, a method for testing the semiconductor device could be performed automatically so as to greatly enhance test efficiency and accuracy and to significantly reduce costs.

Abstract: A temperature control equipment is capable of controlling a tested object to a predetermined temperature. The temperature control equipment includes a thermal conducting plate, a temperature regulating module, a carrier plate, and a thermoelectric cooling module. The temperature regulating module is thermally connected to the thermal conducting plate for regulating the thermal conducting plate to a reference temperature. The carrier plate is used to accommodate the tested object. The thermoelectric cooling module is thermally connected between the thermal conducting plate and the carrier plate for controlling the tested object to the predetermined temperature via the carrier plate based on the reference temperature.

Abstract: A test apparatus includes a test site, a buffer carrying device, a transport carrying device, a handling mechanism and a dry air flow guide mechanism. The test site performs a test procedure on the objects. The buffer carrying device is disposed close to a side of the test site, holds the objects and performs a temperature conditioning process. The transport carrying device is disposed close to another side of the test site, moves back and forth along a transporting direction, transports the objects into and out of the test site, and heats up the objects. The handling mechanism carries the objects among the buffer carrying device, the test site and the transport carrying device. The dry air flow guide mechanism guides a dry air to surround the test site, the buffer carrying device, the transport carrying device and the handling mechanism and generates a dry environment to prevent dew condensation.

Abstract: A testing apparatus for flip chip LEDs includes a transparent substrate, a spacing member, a flexible transparent carrier, and a vacuum generator. The spacing member is configured on a first surface of the transparent substrate. The flexible transparent carrier is removably assembled to the spacing member so that a closed space is formed by the flexible transparent carrier, the spacing member, and the first surface of the transparent substrate. The vacuum generator is connected to the closed space for pumping air out of the closed space, and then a part of the transparent substrate clings to the first surface to form a testing area for loading the flip chip LED.

Abstract: A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature.

Abstract: A test device is provided for testing a bottom chip of a package-on-package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts is installed on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.

Abstract: A tray for placing a plurality of pouch-type batteries is provided. The tray includes a frame, at least a drive shaft, a plurality of fixed plates and a plurality of movable plates. The drive shaft is slidably fixed to the frame along a drive axis, where the drive shaft has a positioning device for fixing a relative position of the drive shaft with respect to the frame. The fixed plates are perpendicular to the drive axis, and are arranged in order along the drive axis and fixed within the frame. The movable plates are also perpendicular to the drive axis, and are arranged in order along the drive axis within the frame, and the movable plates are interlaced with the fixed plates. The movable plates are moved together with the drive shaft, and each of the movable plates and each of the fixed plates define a receiving space for receiving the pouch-type battery, and are used for clamping each of the pouch-type batteries.

Abstract: A temperature controller for controlling a thermal module that raises or lowers the temperature of a thermal control platform that includes a reading interface and a control unit. The reading interface is used for reading parameters of the thermal control platform that are stored in a memory module. The control unit is connected to the reading interface for receiving the parameters read by the reading interface and for sending a control signal to the thermal module according to the corresponding parameters. The thermal module then raises or lowers the temperature according to the control signal. Accordingly, the temperature controller automatically adjusts the temperature control to different thermal control platforms.

Abstract: A testing system for testing semiconductor package stacking chips is disclosed. The system includes a testing socket, a testing arm, and a testing mechanism. The testing mechanism includes a probe testing device. The probe testing device has a testing chip inside and a plurality of testing probes electrically connected to the testing chip. The plurality of testing probes extends toward the testing socket for contacting a chip-under-test loaded on the testing socket. When the testing mechanism moves to an upper position between the testing socket and the testing arm, the testing arm moves downward in the vertical direction and presses down the testing mechanism thereby coercing the plurality of testing probes in the testing mechanism to closely abut against the chip-under-test, so that the testing chip inside the testing mechanism can electrically connect to the chip-under-test for forming a test loop.

Abstract: A solar cell testing system includes a multifunctional testing light source, a measuring unit, and an arithmetic unit. The multifunctional testing light source is configured to be switched to output a simulated solar light to a solar cell or asynchronously output a plurality of narrowband lights to the solar cell. The measuring unit is coupled to the solar cell and measures the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights. The arithmetic unit is coupled to the multifunctional testing light source and the measuring unit; it determines the solar cell's conversion efficiency and spectral response based on the solar cell's response to the simulated solar light and response to the asynchronously outputted narrowband lights.

Abstract: A light-emitting module and a driving method thereof are disclosed. In this method, P light-emitting units are selected as a target group, wherein each of the P light-emitting units has N different power parameters corresponding to N sub-bands. P evaluated current values corresponding to the P light-emitting units are computed according to a target spectrum and the N×P power parameters corresponding to the P light-emitting unit in the target group. An emission-spectrum error is computed according to the target spectrum, the N×P power parameters, and the P evaluated current values. It is determined whether the emission-spectrum error conforms with the determining criteria. When the emission-spectrum error conforms with determining criteria, the P evaluated current values are set to be P driving current values corresponding to the P light-emitting units.

Abstract: An apparatus for testing a package-on-package semiconductor device includes a top cover, a lower base, a heat dissipation module, and a plurality of probes. The lower base is disposed under the top cover so as to form an internal accommodation space for receiving an upper chip. The heat dissipation module includes a heat sink arranged in the internal accommodation space and attached to an upper surface of the upper chip. The probes are arranged in the lower base so as to electrically connect the upper chip with a lower chip. By the heat sink arranged in the internal accommodation space formed of the top cover and the lower base, heat generated from the upper chip during operation of the upper chip can be greatly dissipated so that the performance and the service life of the upper chip can be improved.

Abstract: A radiator module system for automatic test equipment, wherein the automatic test equipment comprises at least one test arm, with the front end of the test arm being configured with a test head, and a closed-loop circulating cooling device is installed on the test arm. The closed-loop circulating cooling device includes a conduit which is in contact with the cooling device, internally contains an working fluid and is connected to the test head, a cooling device, a set of fans and a driving source for driving the working fluid. The closed-loop circulating cooling device can operate to circulate and exchange heat energy generated by a device under test (DUT) tightly stressed by downward pressure applied with the test arm, and brings up airflows by means of the fans to perform heat exchange on the cooling device thereby dissipating the generated heat energy.

Abstract: A surface pattern detecting method includes: capturing a surface image of a sample element to be detected, wherein the surface image containing N grayscale pixels and wherein the N is a positive integer; selecting f×N pixels with small grayscale value based on a selection ratio f in order to define a pattern zone and further calculating a pattern mean of the pattern zone based on pixel amount and grayscale value of the pattern zone; selecting f×N pixels with big grayscale value in order to define a background zone and further calculating a background mean of the background zone based on pixel amount and grayscale value of the background zone; and determining whether the surface image has a defect based on the pattern means of the pattern zone and the background mean of the background zone.