Patents Assigned to CO
  • Publication number: 20250117984
    Abstract: A processor-implemented method with image generation includes obtaining a first image, determining predicted texture information of a target image corresponding to the first image through a texture prediction model, based on the first image, determining predicted color information of the target image through a color prediction model, based on the first image, and generating the target image based on the first image, using the predicted texture information and the predicted color information, wherein a format of the target image is different from that of the first image.
    Type: Application
    Filed: October 9, 2024
    Publication date: April 10, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Lu XU, Chao ZHANG, Yasi WANG, Hyong Euk LEE, Qiang WANG
  • Publication number: 20250118086
    Abstract: A passing determination device acquires a first captured image obtained by repeatedly capturing an image of a region including a passing determination position of a trailer from a front of the trailer in a traveling direction of the trailer, and detects the trailer from the first captured image. Further, the passing determination device includes a processor configured to determine that the trailer detected from the first captured image captured at a first time passes through the passing determination position when the trailer is detected from the first captured image captured at the first time and the trailer is not detected from the first captured image captured within a first time period from the first time.
    Type: Application
    Filed: October 2, 2024
    Publication date: April 10, 2025
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Fukino KAZAMI, Takaaki IDERA, Yutaka IKEDA, Takefumi TAKAGI, Takeshi ITO, Kei TAKAMATSU, Akira HAGIHARA, Kazuki KITADA, Hiroki TESHIMA, Takaaki MORIYAMA
  • Publication number: 20250118490
    Abstract: A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, and an additional pattern spaced apart from the internal electrodes may be disposed in at least one of a region between the internal electrodes and the fifth surface or a region between the internal electrodes and the sixth surface.
    Type: Application
    Filed: July 15, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Gyu Tae Byeon, Seung Ho Shin, Ji Yeon Kim, Kyu Oh Jeon
  • Publication number: 20250118496
    Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an interface plating layer disposed on an end of the internal electrode; and an external electrode disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the interface plating layer, and including a conductive resin layer including a conductive metal and a resin.
    Type: Application
    Filed: September 3, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hyeon LEE, Seung Min AHN, Hyung Duk YUN, Chae Min PARK, Joon Hwan KWAG, Byung Jun JEON, Hong Seok KIM
  • Publication number: 20250118600
    Abstract: A method of fabricating a semiconductor device includes forming a dielectric layer on a lower structure. The method includes forming an opening to penetrate through the dielectric layer. The method includes alternately repeating a first operation, in which a first sputtering deposition process is performed to form a first metal pattern in the opening, and a second operation, in which a second sputtering deposition process is performed to form a second metal pattern in the opening, two or more times to form a first metal layer. The method includes forming a second metal layer on the first metal layer in an electroplating manner, and planarizing the first and second metal layers. Moreover, first and second process times, during which the first sputtering deposition process and the second sputtering deposition process, respectively, are performed, are each about five seconds or less.
    Type: Application
    Filed: December 17, 2024
    Publication date: April 10, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Uihyoung Lee, Honyun Park, Jongseok Lee, Sewan Kim, Taesung Lee
  • Publication number: 20250118709
    Abstract: A semiconductor package may include a chip stack, a first semiconductor chip provided on a top surface of the chip stack, outer terminals provided on a bottom surface of the chip stack, and a mold layer provided on a bottom surface of the first semiconductor chip to enclose the chip stack. The chip stack may include a second semiconductor chip including first penetration vias, which are provided in second semiconductor chip and are exposed to an outside of the second semiconductor chip. The chip stack may include third semiconductor chips stacked on a top surface of the second semiconductor chip. Each of the third semiconductor chips may include second penetration vias, which are provided to penetrate the same and are exposed to an outside of the same. The first semiconductor chip may have a width larger than the chip stack, and the first semiconductor chip may include a logic chip.
    Type: Application
    Filed: March 18, 2024
    Publication date: April 10, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Gunho CHANG
  • Publication number: 20250118799
    Abstract: A solid electrolyte material according to an aspect of the present disclosure is represented by the following Compositional Formula (1): Li6-3zYzX6 where 0<z<2 is satisfied; and X represents Cl, wherein the solid electrolyte material includes at least one second crystal phase; and in the second crystal phase, the arrangement of halogen X is the same as that of Cl in Li3ErCl6 having a crystal structure belonging to space group P-3m1, wherein with ILEC(301) denoting an X-ray diffraction intensity of a plane of the second crystal phase corresponding to a (301) plane of the Li3ErCl6 crystal structure and ILEC(110) denoting an X-ray diffraction intensity of a plane of the second crystal phase corresponding to a (110) plane of the Li3ErCl6 crystal structure, ILEC(110)/ILEC(301)<0.3.
    Type: Application
    Filed: December 2, 2024
    Publication date: April 10, 2025
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tetsuya ASANO, Akihiro SAKAI, Satoru OHUCHI, Masashi SAKAIDA, Akinobu MIYAZAKI, Shinya HASEGAWA
  • Publication number: 20250119123
    Abstract: A radio frequency (RF) switch circuit and a method for operation of a RF switch circuit. The RF switch circuit may include a first switch connected between a first port and an antenna port, a second switch connected between a second port and the antenna port, a third switch connected between the antenna port and ground, a fourth switch connected between the antenna port and the ground, and a switch control circuit configured to control the first switch, the second switch, and the third switch to be turned off and the fourth switch to be turned on in a low power mode.
    Type: Application
    Filed: March 13, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Byeonghak JO, Wonsun HWANG, Shinhaeng HEO, Dongil KANG
  • Publication number: 20250119986
    Abstract: An induction heating device including a first burner; a first working coil for the first burner; a second burner; a second working coil for the second burner; an inverter including a plurality of switches, the plurality of switches being configured to perform switching so that a current flows through the first working coil and the second working coil; and a processor configured to control the switching by the plurality of switches so that the first working coil has a first operating frequency due to an inductance value of the first working coil and the current flowing through the first working coil, the second working coil has a second operating frequency due to an inductance value of the second working coil and the current flowing through the second working coil, and the first operating frequency differs from the second operating frequency by a predetermined frequency value or more.
    Type: Application
    Filed: November 1, 2024
    Publication date: April 10, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hongjoo KANG, Eundae BAE, Namju PARK, Jiwoong CHOI
  • Publication number: 20250120082
    Abstract: A semiconductor memory device includes a stacked structure on a substrate and a vertical structure penetrating the stacked structure. The stacked structured includes a plurality of conductive lines stacked on the substrate. The vertical structure may include a vertical insulating pattern and a channel film extending along sidewalls of the vertical insulating pattern. The vertical insulating pattern may include an inner region and an outer region. The outer region of the vertical insulating pattern may be placed between the channel film and the inner region of the vertical insulating pattern, and the outer region of the vertical insulating pattern may include a diffused metal.
    Type: Application
    Filed: December 17, 2024
    Publication date: April 10, 2025
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Byung Chul JANG, Sang-Yong PARK, Jae Duk LEE
  • Publication number: 20250120240
    Abstract: A chip structure includes a chip wafer unit and a color conversion substrate unit disposed on a light-exit side of the chip wafer unit. The chip wafer unit includes a light-emitting layer and an electrode layer sequentially stacked in a first direction. The light-emitting layer includes light-emitting portions. Each light-emitting portion includes at least two light-emitting sub-portions. The electrode layer includes a cathode, connection electrodes, and anodes in one-to-one correspondence with the light-emitting portions. The at least two light-emitting sub-portions are sequentially connected through at least one connection electrode. Among the at least two light-emitting sub-portions sequentially connected, a first one light-emitting sub-portion is a first selected light-emitting sub-portion, and a last one light-emitting sub-portion is a second selected light-emitting sub-portion.
    Type: Application
    Filed: January 3, 2023
    Publication date: April 10, 2025
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Wei LI, Mingxing WANG, Zhiqiang JIAO, Qian SUN, Huajie YAN, Yichi ZHANG
  • Publication number: 20250120266
    Abstract: A display substrate and a display device are provided. The display substrate includes a base substrate and a plurality of pixel circuits, the plurality of pixel circuits are arranged on the base substrate in an array, the plurality of pixel circuits include a plurality of active patterns, each of the plurality of active patterns extends along a first direction, the plurality of active patterns are arranged along a second direction, adjacent active patterns are spaced apart from each other in the second direction, and at least one of the plurality of active patterns comprises at least one disconnection position to form a plurality of active sub-patterns independent of each other.
    Type: Application
    Filed: May 31, 2022
    Publication date: April 10, 2025
    Applicants: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Tiaomei ZHANG, Gukhwan SONG, Jianpeng WU, Quanyong GU, Hong YI, Zhengkun LI
  • Publication number: 20250120329
    Abstract: A new Campanula plant particularly distinguished by an upright to outwardly, dense and bushy plant habit, very high and freely branching with compact habit, early flowering habit; and Campanulate-shaped flowers with dark purple violet colored petals, is disclosed.
    Type: Application
    Filed: July 19, 2024
    Publication date: April 10, 2025
    Applicant: KLEMM + SOHN GMBH & CO. KG
    Inventor: Raffaele Langella
  • Publication number: 20250115442
    Abstract: A lifting basket, a lifting basket guiding mechanism and a lifting basket-type sample cryogenic storage device are provided. The guiding mechanism includes a storage member, an auxiliary guiding member and a driving member. The storage member is placed into a liquid nitrogen tank, provided with an opening at an upper end and sleeved onto an exterior of the lifting basket for restricting removal of a cryogenic vial storage member or a cryogenic vial stored inside the lifting basket. The auxiliary guiding member is arranged above the storage member and slidably connected to the storage member, and the auxiliary guiding member is sleeved onto the exterior of the lifting basket and is in contact with the lifting basket to perform relative sliding motion through a guiding structure. The auxiliary guiding member performs vertical motion relative to a storage frame and the lifting basket under the control of the driving member.
    Type: Application
    Filed: April 21, 2023
    Publication date: April 10, 2025
    Applicant: SHANGHAI ORIGINCELL BIOLOGICAL CRYO EQUIPMENT CO., LTD.
    Inventors: Jianguo QU, Yunxin CAO
  • Publication number: 20250115784
    Abstract: A thermally conductive silicone composition comprising (A) a crosslinked silicone gel, (B) a silicone oil containing neither an aliphatic unsaturated bond nor an SiH group, (C) a thermally conductive filler having an average particle diameter of 0.01-100 ?m, the amount of which is 10-2,000 parts by mass per 100 parts by mass of the sum of the (A) and (B) components, and (D) gallium or a gallium alloy having a melting point of ?20 to 100° C., the amount of which is 1,000-10,000 parts by mass per 100 parts by mass of the sum of the (A) and (B) components. The thermally conductive silicone composition has a high thermal conductivity and is excellent in terms of applicability and dislocation resistance.
    Type: Application
    Filed: January 16, 2023
    Publication date: April 10, 2025
    Applicant: SHIN-ETSU CHEMICAL CO., LTD.
    Inventor: Kunihiro YAMADA
  • Publication number: 20250117016
    Abstract: A electronic device comprising a sensor unit, a memory, and at least one processor that: obtains, by the sensor unit, first sensing data including an image captured at the location; obtains map information on the basis of the first sensing data; combines the first sensing data and the second sensing data to obtain first mapping information and stores same in the memory; obtains second mapping information by removing data corresponding to a pre-configured condition corresponding from the stored first mapping information; identifies spatial information including feature data corresponding to a space included in the map information on the basis of the second mapping information; and controls traveling of the electronic device on the basis of the map information and the spatial information.
    Type: Application
    Filed: December 17, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Injoo KIM, Kyongsu KIM, Hankyeol KIM, Dongmin SHIN, Sangwuk CHAE, Junu HONG
  • Publication number: 20250117927
    Abstract: Provided is a method and apparatus for measuring fat content using a computed tomography (CT) image. The fat content measurement apparatus trains a fat prediction model by using learning data including a CT image or noise image for learning and generates a fat distribution image to be used for fat content measurement by the fat prediction model having completed learning upon receiving a CT image for diagnosis.
    Type: Application
    Filed: October 10, 2023
    Publication date: April 10, 2025
    Applicant: MEDICALIP CO., LTD.
    Inventors: Sang Joon PARK, Jong Min KIM, Han Jae CHUNG
  • Publication number: 20250118268
    Abstract: A display device including a display panel including data lines, gate lines, power lines, and sub-pixels; a gate driver to supply a gate signal to the gate lines; a data driver configured to supply a data voltage to the data lines during a refresh frame period prior to a hold frame period; and a compensation voltage generator configured to during the hold frame period, output a first compensation voltage to the data lines instead of the data voltage supplied by the data driver, and output a second compensation voltage and a third compensation voltage to the power lines connected to the sub-pixels, and during the refresh frame period, output the second compensation voltage and the third compensation voltage to the power lines without outputting the first compensation voltage.
    Type: Application
    Filed: August 23, 2024
    Publication date: April 10, 2025
    Applicant: LG Display Co., Ltd.
    Inventors: Woo Kyu SANG, Moon Soo CHUNG, Tae Hun KIM
  • Publication number: 20250118473
    Abstract: A magnetic component includes a magnetic body, wherein the magnetic body includes a plurality of magnetic particles including an Fe-based alloy, at least a portion of magnetic particles, among the plurality of magnetic particles, include a first layer disposed on surfaces of the at least a portion of magnetic particles and a second layer disposed on a surface of the first layer, the first layer includes an Fe oxide component and has an average thickness of less than 5 nm, and the second layer includes an Si oxide component and has an average thickness of 5 nm or more.
    Type: Application
    Filed: September 18, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyo Ki HONG, Su Rim BAE, Seok Hee LEE, Min Seon KWON, Woong Sup LEE, Ji Min KIM, Joong Won PARK, Il Jin PARK, Jung Wook SEO, Jae Hee JU
  • Publication number: 20250118815
    Abstract: The present disclosure relates to a battery cell formation device, and more particularly, to a serial battery cell formation device that reduces the length and number of power cables in a device that performs charging and discharging by connecting a plurality of battery cells in series, thereby minimizing power cable loss and reducing cost.
    Type: Application
    Filed: December 17, 2024
    Publication date: April 10, 2025
    Applicant: GREEN POWER CO., LTD.
    Inventors: Jung Goo CHO, Kyu Min CHO, Jin Sik PARK