Abstract: A fan device comprises a processor, a fan motor and a light emitting element. The processor comprises an input terminal, a first and a second output terminals. An initial mode of the processor is in one of a rotation speed control mode and a light emission control mode. The input terminal is configured to receive an input instruction, and the input instruction comprises a first characteristic. The fan motor is electrically connected to the first output terminal, and the light emitting element is electrically connected to the second output terminal. When a value of the first characteristic is within a characteristic value range, the processor is switched from the initial mode to the other of the rotation speed control mode and the light emission control mode. When the value of the first characteristic is not within the characteristic value range, the initial mode of the processor is maintained.

Abstract: This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

Abstract: A cooling device includes a fan frame including a bottom plate and a base part disposed on the bottom plate, a stationary pillar coupled to the fan frame, and a fan assembly that is rotatably disposed about the stationary pillar. The fan assembly is supported on the stationary pillar by at least one bearing positioned between the fan assembly and the stationary pillar. The cooling device also includes a decorative plate coupled to the stationary pillar. The decorative plate has an identifying indicia that permits at least some light to pass therethrough. The cooling device further includes a light emitting assembly disposed on the fan frame and configured to emit light that is directed toward the identifying indicia.

Abstract: A cooling device includes a fan frame including a bottom plate and a base part disposed on the bottom plate, a stationary pillar coupled to the fan frame, and a fan assembly that is rotatably disposed about the stationary pillar. The fan assembly is supported on the stationary pillar by at least one bearing positioned between the fan assembly and the stationary pillar. The cooling device also includes a decorative plate coupled to the stationary pillar. The decorative plate has an identifying indicia that permits at least some light to pass therethrough. The cooling device further includes a light emitting assembly disposed on the fan frame and configured to emit light that is directed toward the identifying indicia.

Abstract: A vapor chamber having a working fluid therein, includes a first and second casing, together forming an evaporator section having a plurality of first support structures therein, a condenser section having a plurality of second support structures therein, and a vapor flow chamber extending from the evaporator section to the condenser section is provided. The evaporator section further includes a plurality of extended heat transfer structures therein, contacting a first inner surface of the evaporator section of the first casing and being perpendicular thereto. The vapor flow chamber includes as least one evaporator vapor flow area. The first inner surface, second inner surface of the first and second casings, plurality of extended heat transfer structures, and at least one of a plurality of first support structures include evenly distributed and substantially the same thickness sintered powdered wick structures thereon.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

Abstract: A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flak in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved die to the lower operating speeds required.

Abstract: A radiator includes a main body, two connecting members and two taps. The two connecting members are disposed on opposite sides of the main body. Each of the two taps is rotatably connected to one of the two connecting members, such that the two taps are rotatably disposed on opposite sides of the main body.

Abstract: A single-phase immersion cooling system, comprising a fluid-tight containment vessel, dielectric thermally conductive fluid, at least a heat-generating electronic device, and heat exchanger system is provided. The heat exchanger system comprises a pump, heat exchanger, at least a first conduit, and at least a second conduit. The at least a first and second conduits have first and second modifiable portions comprising first and second openings submerged within the dielectric thermally conductive fluid, respectively. The at least one of the first conduit or second conduit circulates dielectric thermally conductive fluid from a heat exchanger outlet into the fluid-tight containment vessel and the other, circulates dielectric thermally conductive fluid from the fluid-tight containment vessel to a heat exchanger inlet via the pump. The first and second openings are disposed near to greatest opposing ends of the dielectric thermally conductive fluid contained within the fluid-tight containment vessel.

Abstract: A computer includes a casing, an electronic assembly, and a water cooling assembly. The casing, forms an accommodation space. The casing has an interior fluid channel located at at least one side of the casing, and a fluid inlet and a fluid outlet which are in fluid communication with the interior fluid channel. The electronic assembly is located in the accommodation space. The water cooling assembly includes a first water block and a radiator. The first water block is in thermal contact with the electronic assembly, the first water block, the radiator, and the interior fluid channel located at the at least one side of the casing are in fluid communication with each other so as to form a circulation channel, and the fluid inlet and the fluid outlet of the casing are respectively in fluid communication with the radiator and the first water block.

Abstract: This disclosure relates to a fin structure including a main body and at least one minor structure. The main body includes a main plate and two side plates. The main plate has at least one through hole. The two side plates are respectively connected to two opposite sides of the main plate and protrude from the main plate. The at least one minor structure protrudes from the main plate and is located at a side of the main plate. The at least one minor structure is spaced apart from the two side plates. The at least one minor structure partially covers the at least one through hole. The at least one minor structure has a length, in a longitudinal direction of the main plate, less than a length of the at least one through hole of the main plate.

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source. The heat dissipation device includes a heat dissipation body and a cover plate. The heat dissipation body has at least one vertical channel. The heat dissipation body is configured to be in thermal contact with the heat source. The cover plate includes a first layer and a second layer that are stacked on each other. The first layer is stacked on the heat dissipation body and covers the at least one vertical channel. A thermal conductivity of the first layer is larger than a thermal conductivity of the second layer. The cover plate has at least one first through hole penetrating through the first layer and the second layer and connecting to the at least one vertical channel.

Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.

Abstract: A method includes providing a first metal sheet and a second metal sheet, printing patterns of a plurality of obstructers, a plurality of channels, an evaporator channel, a condenser channel, and a connecting channel on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, the evaporator channel, the condenser channel, and the connecting channel by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

Abstract: A heat sink is provided. The heat sink includes a cylindrical body and a plurality of fins. The fins are connected to and protruding from the cylindrical body. At least a part of the plurality of fins each include a first protrusion portion and a second protrusion portion, a distal edge of the first protrusion portion is located farther away from a central axis of the cylindrical body than a distal edge of the second protrusion portion. In addition, the disclosure also provides a heat dissipation device having the heat sink.

Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.

Abstract: A liquid supply device adapted to a liquid cooling system includes a casing, a cover, a plunger, a driving unit and a sensing unit. The casing has a liquid outlet. The cover is connected to the casing. A chamber is formed between the casing and the cover and contains a cooling liquid. The chamber communicates with the liquid outlet. The plunger is movably disposed in the chamber. The driving unit is disposed in the chamber and used for driving the plunger to move. The sensing unit is selectively disposed on one of the casing and the plunger. The sensing unit senses a liquid level of the cooling liquid and outputs a sensing signal with a predetermined status as the liquid level is equal to or lower than a predetermined height.

Abstract: A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.

Abstract: A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.