Patents Assigned to Cooler Master Co., Ltd.
  • Patent number: 11662155
    Abstract: A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: May 30, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Jen-chih Cheng
  • Patent number: 11655844
    Abstract: A multi-material boss, configured for fastening of a fastener thereto, being a feature of a die cast part, comprising a boss cylinder, an augmenting cylinder, and a filler metal layer is provided. The boss cylinder is made of the same material as the die cast part having a first hardness, and has a first interior. The augmenting cylinder is made of an augmenting material having a second hardness, is fixedly secured in the first interior of the boss cylinder, and has a second interior defined by a second cylindrical shaped wall, a base rim, and a second opening. The second hardness is greater than the first hardness. The fastener is fastened to the multi-material boss via the second opening of the augmenting cylinder having the higher liquidus temperature and greater hardness.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: May 23, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Zhang Qing Song, Zhu Zhong Long, Tu Po-Wen
  • Patent number: 11659690
    Abstract: A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: May 23, 2023
    Assignee: Cooler Master Co., Ltd.
    Inventors: Jen-Chih Cheng, Shui-Fa Tsai
  • Patent number: 11635263
    Abstract: A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: April 25, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Chi-Lung Chen
  • Patent number: 11627686
    Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: April 11, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shui-Fa Tsai
  • Patent number: 11622472
    Abstract: A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 4, 2023
    Assignee: Cooler Master Co., Ltd.
    Inventor: Shui-Fa Tsai
  • Patent number: 11598588
    Abstract: A method includes providing a first metal sheet and a second metal sheet, printing a plurality of channels on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other to obtain a fin body, bending a first portion of the fin body to be transverse to a second portion of the fin body, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: March 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11602076
    Abstract: The disclosure provides a liquid-cooling heat dissipation device. The liquid-cooling heat dissipation device is configured to be in thermal contact with an expansion card. The liquid-cooling heat dissipation device includes a base plate, a thermally-conductive component and a heat exchanger. The base plate is configured to be mounted on the expansion card. The thermally-conductive component is mounted on the base plate. The thermally-conductive component and the base plate together form a liquid chamber therebetween. The heat exchanger is mounted on the base plate and connected to the liquid chamber.
    Type: Grant
    Filed: January 29, 2020
    Date of Patent: March 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Tung-Yang Shieh
  • Patent number: 11599165
    Abstract: A heat dissipation device for electronic device, a heat dissipation assembly, an air pipe assembly and a table. The heat dissipation device includes a refrigerator, an air pipe assembly and a heat dissipation assembly. The refrigerator has a cool air opening. The air pipe assembly has a first and second end portions, the first end portion detachably connects to the cool air opening. The heat dissipation assembly has a base body detachably connected to the refrigerator and a supporting plate pivoted to the base body. When the supporting plate is in a first position, the supporting plate has a first angle with a bottom plate of the base body. When the supporting plate is in a second position, the supporting plate has a second angle with the bottom plate. The second end portion is detachably connected to the supporting plate and is movably disposed in the air permeable.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: March 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Wen-Hsien Lin
  • Patent number: 11598587
    Abstract: A method includes providing a first metal sheet and a second metal sheet, printing a channel pattern on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other, forming a plurality of channels by introducing a fluid between the first metal sheet and the second metal sheet, introducing working fluid in the plurality of channels, sealing the first metal sheet and the second metal sheet, and forming a plurality of through holes in locations where the first metal sheet and the second metal sheet are bonded to each other. The plurality of through holes are arranged in a plurality of rows, each row including at least two through holes, and each location where the first metal sheet and the second metal sheet are bonded to each other includes a single through hole of the plurality of through holes.
    Type: Grant
    Filed: May 27, 2022
    Date of Patent: March 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Publication number: 20230063953
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.
    Type: Application
    Filed: November 8, 2022
    Publication date: March 2, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen CHEN, Shan-Yin CHENG
  • Publication number: 20230055907
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.
    Type: Application
    Filed: November 8, 2022
    Publication date: February 23, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen CHEN, Shan-Yin CHENG
  • Publication number: 20230035497
    Abstract: This disclosure relates to a thin pump including a case, a rotor, and a stator. The case has a bottom surface, a lower chamber, an upper chamber, and an accommodation space. The upper chamber is located further away from the bottom surface than the lower chamber. The upper chamber has two opposite ends respectively in fluid communication with the lower chamber and the accommodation space. The rotor includes an impeller and a magnet. The impeller is rotatably disposed in the lower chamber of the case. The magnet is disposed on the impeller. The stator is disposed in the case. The stator corresponds to the magnet of the rotor so as to drive the rotor to rotate with respect to the case.
    Type: Application
    Filed: October 6, 2022
    Publication date: February 2, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chiu Yu YEH, Wen-Hsien LIN, Wen-Hung CHEN, Chia-Hao SUNG
  • Publication number: 20230019711
    Abstract: A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flow in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved due to the lower operating speeds required.
    Type: Application
    Filed: August 25, 2022
    Publication date: January 19, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa TSAI, Ting-Chun HUANG
  • Publication number: 20230007812
    Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.
    Type: Application
    Filed: April 27, 2022
    Publication date: January 5, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa TSAI, Tsung-Wei LIN, Yu-Jyun CHEN
  • Patent number: 11530879
    Abstract: A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: December 20, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chia Yu Lin, Shan-Yin Cheng
  • Patent number: 11525632
    Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: December 13, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Kui-Yen Chen, Shan-Yin Cheng
  • Patent number: 11493280
    Abstract: A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: November 8, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chien-Hung Sun, Te-Hsuan Chin
  • Patent number: 11493047
    Abstract: A thin pump includes a casing, a rotor, and a stator. The casing has a bottom surface, an outer surface, a lower chamber, an upper chamber, an inlet channel, and an outlet channel. The outer surface is connected to the bottom surface. The upper chamber and the lower chamber connected to each other are surrounded by the outer surface. The upper chamber is located further away from the bottom surface than the lower chamber. The inlet channel and the outlet channel are located on the outer surface. The inlet channel and the outlet channel are respectively connected to the upper chamber and the lower chamber. The rotor includes an impeller rotatably disposed in the lower chamber and a magnetic component disposed on the impeller. The stator disposed in the casing corresponds to the magnetic component so as to drive the rotor to rotate with respect to the casing.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: November 8, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Chiu Yu Yeh, Wen-Hsien Lin, Wen-Hong Chen, Chia-Hao Sung
  • Patent number: 11497138
    Abstract: The disclosure provides a liquid storage device configured for storing a working liquid and including a casing and a liquid driving device. The casing includes a reservoir and an accommodation part detachably disposed on the reservoir. The reservoir has a reservoir chamber. The liquid driving device is disposed in the accommodation part and forms a liquid chamber. The liquid driving device includes an impeller located in the liquid chamber and configured to force the working liquid to flow towards the liquid chamber from the reservoir chamber.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: November 8, 2022
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Tsung-Wei Lin