Abstract: One or more aspects of the disclosure pertain to an article including a film disposed on a glass substrate, which may be strengthened, where the interface between the film and the glass substrate is modified, such that the article has an improved average flexural strength, and the film retains key functional properties for its application. Some key functional properties of the film include optical, electrical and/or mechanical properties. The bridging of a crack from one of the film or the glass substrate into the other of the film or the glass substrate can be suppressed by inserting a nanoporous crack mitigating layer between the glass substrate and the film.

Abstract: Pipe insulation assemblies (10) comprising tubular insulation (100) having a longitudinal slit (400), a jacket (110), releasable tape (120), butt sealant strips (600), and/or closing adhesives are disclosed. The jacket (110) overlays the outer surface of the tubular insulation (100). The jacket (110) has an extended lip portion (200) extending beyond the longitudinal slit (400). An adhesive (420) and an internal release liner (130) are located on the extended lip portion (200).

Abstract: One embodiment of the disclosure relates to radio frequency (RF) communication channel reconfiguration in remote antenna unit (RAU) coverage areas in a distributed antenna system (DAS) to reduce RF interferences. In this regard, a spectrum optimization unit dynamically reconfigures RF communication channels employed by RAU coverage areas in a DAS to reduce or avoid adjacent-channel and/or co-channel RF interferences. Each of the RAU coverage areas provides a respective sniffed RF signal to the spectrum optimization unit. The spectrum optimization unit analyzes the respective sniffed RF signal to determine a respective lesser-interfered RF communication channel for an RAU coverage area and dynamically reconfigures the RAU coverage area to communicate on the respective lesser-interfered RF communication channel.

Abstract: An optical fiber connector for external connection to a telecommunications enclosure is described herein. The optical fiber connector has an assembly base having a first end and a second end, an optical connection portion disposed partially within the first end of the assembly base and a strain relief assembly disposed on the second end of the assembly base. The assembly base includes a body portion and a release portion which defines a release mechanism that causes the release portion to move relative to the body portion. The release portion includes at least one cam that is configured to release or disengage the at least one latch element when the release portion moves with respect to the body portion so that the optical fiber connector can be removed from the port of the telecommunication enclosure.

Abstract: An optical fiber for converting a Gaussian laser beam into a Bessel laser beam may include a first segment optically coupled to a second segment with a transition region, the first segment having a first outer diameter greater than a second outer diameter of the second segment. The first segment may include a first core portion with a first cladding portion extending around the first core portion. The second segment may include a second core portion with a second cladding portion extending around the second core portion. The optical fiber may have a non-axisymmetric refractive index profile or may be coupled to an end cap with a non-axisymmetric refractive index profile.

Abstract: A roofing material including a substrate having a top face and a bottom face. The roofing material further includes a non-asphalt coating applied to the substrate and an asphalt layer covering at least a portion of the top face. The bottom face is asphalt-free, or substantially asphalt-free.

Abstract: One embodiment of the disclosure relates to a method of cleaning silica-based soot or an article made of silica-based soot, the method comprising the step of treating silica-based soot or the article made of silica-based soot with at least one of the following compounds: (i) a mixture of CO and Cl2 in a carrier gas such that the total concentration of CO and Cl2 in the mixture is greater than 10% (by volume, in carrier gas) and the ratio of CO:Cl2 is between 0.25 and 5; (ii) CCl4 in a carrier gas, such that concentration CCl4 is greater than 1% (by volume, in carrier gas). Preferably, the treatment by CCl4 is performed at temperatures between 600° C., and 850° C. Preferably, the treatment with the CO and Cl mixture is performed at temperatures between 900° C. and 1200° C. The carrier gas may be, for example, He, Ar, N2, or the combination thereof.

Abstract: Carriers for microelectronics fabrication may include a strengthened substrate formed from glass or glass-ceramic having an average thickness greater than 1.0 mm and less than or equal to 2.0 mm. The strengthened glass substrate may have a single-side surface area greater than or equal to 70,000 mm2. The substrate may also have a compressive stress greater than or equal to 200 MPa and a depth of layer from about 50 ?m to about 150 ?m. The substrate may further include a tensile stress region having a stored elastic energy of less than 40 kJ/m2 providing for a flat fragmentation factor of less than or equal to 5.

Abstract: An exemplary laminated shingle includes an overlay sheet having a top overlay surface, a bottom overlay surface, a headlap portion, and a tab portion arranged between two-cutouts. The shingle also includes an underlay sheet having a top underlay surface and a bottom underlay surface. The overlay sheet is attached to the underlay sheet such that a portion of the top underlay surface is exposed on a first side of the tab portion and a portion of the top underlay surface is exposed on a second side of the tab portion.

Abstract: Embodiments of the disclosure relate to optimizing power efficiency of a power amplifier circuit to reduce power consumption in a remote unit in a wireless distribution system (WDS). A power amplifier circuit is provided in the remote unit to amplify a received input signal associated with a signal channel(s) to generate an output signal at an aggregated peak power. In this regard, a control circuit is configured to analyze at least one physical property related to the signal channel(s) to determine a maximum output power of the power amplifier circuit. Accordingly, the control circuit configures the power amplifier circuit according to the determined maximum output power. By configuring the maximum output power based on the signal channel(s) in the input signal, it may be possible to optimize the power efficiency of the power amplifier circuit, thus helping to reduce the power consumption of the remote unit.

Abstract: A glass-ceramic includes SiO2 from about 50 mol % to about 80 mol %, Al2O3 from about 0.3 mol % to about 15 mol %, B2O3 from about 5 mol % to about 40 mol %, WO3 from about 2 mol % to about 15 mol %, and R2O from about 0 mol % to about 15 mol %, wherein R2O is one or more of Li2O, Na2O, K2O, Rb2O and Cs2O. A difference in the amount of the R2O and the Al2O3 ranges from about ?12 mol % to about 2.5 mol %.

Abstract: An article that includes: a glass, glass-ceramic or ceramic substrate comprising a primary surface; at least one of an optical film and a scratch-resistant film disposed over the primary surface; and an easy-to-clean (ETC) coating comprising a fluorinated material that is disposed over an outer surface of the at least one of an optical film and a scratch-resistant film. The at least one of an optical film and a scratch-resistant film comprises an average hardness of 12 GPa or more. Further, the outer surface of the at least one of an optical film and a scratch-resistant film comprises a surface roughness (Rq) of less than 1.0 nm. Further, the at least one of an optical film and a scratch-resistant film comprises a total thickness of about 500 nm or more.

Abstract: A glass element having a thickness from 25 ?m to 125 ?m, a first primary surface, a second primary surface, and a compressive stress region extending from the first primary surface to a first depth, the region defined by a compressive stress ?I of at least about 100 MPa at the first primary surface. Further, the glass element has a stress profile such that it does not fail when it is subject to 200,000 cycles of bending to a target bend radius of from 1 mm to 20 mm, by the parallel plate method. Still further, the glass element has a puncture resistance of greater than about 1.5 kgf when the first primary surface of the glass element is loaded with a tungsten carbide ball having a diameter of 1.5 mm.

Abstract: Optical assemblies and lensed connector ferrule assemblies having one or more optical fibers aligned to one or more lenses of a lens substrate and methods of their manufacture are disclosed. In one embodiment, an optical assembly includes a ferrule and a mirror surface. The ferrule includes a lens holder having a lens substrate cavity and an engagement surface. The ferrule further includes a lens substrate disposed within the lens substrate cavity. The lens substrate has at least one lens. The mirror surface is coupled to the engagement surface such that the at least one lens is offset from the mirror surface by an offset distance.

Abstract: A high-density optical fiber cable interconnect includes a fiber ribbon or fiber ribbon cable having at least one fiber ribbon and first and second ends. The fiber ribbon is formed from small diameter optical fibers arranged in at least one row, with each fiber having a glass section and a non-glass coating section surrounding the glass section. The diameter of the non-glass coating section can be less than 205 microns. A matrix layer encapsulates the small diameter optical fibers to define the fiber ribbon. A first optical connector terminates the first end of the fiber ribbon or fiber ribbon cable and has a first fiber pitch correspond to a standard optical fiber connector. A second optical connector terminates the second end of the fiber ribbon or fiber ribbon cable and has a second fiber pitch less than that of a standard optical fiber connector.

Abstract: Embodiments of the disclosure relate to partitioning a time-division-based communications link for communicating multiple types of communications signals in a wireless distribution system (WDS). A WDS is configured to communicate multiple types of communications signals over a time-division-based communications link. For example, the WDS may be configured to communicate a digital baseband signal as a first type of communications signal and an Ethernet signal as a second type of communications signal. In this regard, a protocols division routing circuit(s) is provided in the WDS and configured to partition the time-division-based communications link between multiple types of communications signals based on a link configuration ratio.

Abstract: A new and distinct Dionea cultivar named ‘FLEXX’ characterized by its small plant size, measuring about 3 to 10 cm high at maturity. Plants are well-filled in and full, producing a large quantity of long-lasting traps having a unique red-purple interior color.

Abstract: A multimode optical fiber transmission system that employs an optical fiber with at least one modal-conditioning fiber is disclosed. The system includes a single-mode transmitter that generates modulated light having a wavelength between 800 nm and 1600 nm; an optical receiver configured to receive and detect the modulated light; a multimode optical fiber that defines an optical path between the single-mode transmitter and the optical receiver, the multimode optical fiber having a core with a diameter D40 and a refractive index profile configured to optimally transmit light at a nominal wavelength of 850 nm; and at least one modal-conditioning fiber operably disposed in the optical path to perform at least one of modal filtering and modal converting of the optical modulated light.

Abstract: According to at least one embodiment a glass comprises: a refractive index N of greater than 1.65 at a wavelength ?, where ?=587.6 nm; a glass density of not more than 4.2 g/cm3; Abbe number Vd greater than 30; the glass comprising greater than 0.03 wt % of rare earth oxide with an atomic number of 58 or higher.

Abstract: Methods of processing a first substrate bonded to a second substrate include moving a wire along an interface to propagate a debonding front and debond the first substrate from the second substrate. In some embodiments, the first substrate includes a thickness less than or equal to about 300 ?m. In further embodiments, the wire includes a tensile strength less than a critical failure stress of the first substrate. In still further embodiments, the wire is configured to conform to a shape of the debonding front during the step of moving the wire such that one or more edges of the first substrate are debonded from the second substrate prior to a debonding of a corresponding interior portion of the first substrate from the second substrate.