Patents Assigned to Corning
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Patent number: 10752879Abstract: The present invention provides a culture method for culturing, in recesses (10), a population including two or more cells including a cell derived from a stem cell and a mesenchymal cell. The cell derived from a stem cell is a cell obtained by differentiating a stem cell in vitro. The cell is a cell of one or more types selected from the group consisting of an endodermal cell, an ectodermal cell, and a mesodermal cell. The population is cultured in the recesses (10) together with a vascular cell or a secretor factor. Each recess (10) includes a space in which cells are movable. When a volume of the space is represented by V mm3 and the number of mesenchymal cells seeded in the space is represented by N, V is 400 or less and N/V is in a range from 35 to 3000.Type: GrantFiled: May 29, 2015Date of Patent: August 25, 2020Assignees: Corning Incorporated, Public University Corporation Yokohama City UniversityInventors: Yoko Ejiri, Hideki Taniguchi, Takanori Takebe
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Patent number: 10756786Abstract: Isolation for antennas in a wireless communication system is achieved between transmit and receive paths for a multiple input multiple output (MIMO) antenna array by separating a first transmit path from an associated receive path to be matched with a second transmit path and matching the first receive path with the second receive path. It is expected that the two transmit paths operate on sufficiently different frequencies that there is minimal interference there and the additional spacing from the transmit path to the receive path will reduce interference therebetween without increasing a footprint of the antenna array.Type: GrantFiled: April 30, 2019Date of Patent: August 25, 2020Assignee: Corning Research & Development CorporationInventor: Dror Ben-Shlomo
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Patent number: 10756455Abstract: A coaxial cable connector for coupling a coaxial cable to an equipment port, the coaxial cable including a center conductor surrounded by a dielectric material, the dielectric material being surrounded by an outer conductor, the coaxial cable connector including: a post including a first end adapted to be inserted into a prepared end of the coaxial cable between the dielectric material and the outer conductor, wherein the post includes a second end including an enlarged shoulder, wherein the enlarged shoulder has a radial face that faces away from the first end of the post, wherein the radial face is substantially flat; a body member adjacent to the post; a coupler including an internally-threaded region for engaging the equipment port; and a grounding member contacting the post and the coupler, wherein the grounding member provides an electrically-conductive grounding path through the post and the coupler while allowing the coupler to rotate, wherein the grounding member includes at least one resilient portiType: GrantFiled: January 28, 2014Date of Patent: August 25, 2020Assignee: Corning Optical Communications RF LLCInventors: Bruce D. Bence, Donald A. Burris, Brian L. Kisling, John A. Kooiman, William B. Lutz, William F. McDade, Thomas D. Miller, Lee Yung Chuan
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Patent number: 10756003Abstract: A process comprises bonding a semiconductor wafer to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. After the bonding, a damage track is formed in the inorganic wafer using a laser that emits the wavelength of light. The damage track in the inorganic wafer is enlarged to form a hole through the inorganic wafer by etching. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer. An article is also provided, comprising a semiconductor wafer bonded to an inorganic wafer. The semiconductor wafer is opaque to a wavelength of light to which the inorganic wafer is transparent. The inorganic wafer has a hole formed through the inorganic wafer. The hole terminates at an interface between the semiconductor wafer and the inorganic wafer.Type: GrantFiled: November 2, 2018Date of Patent: August 25, 2020Assignee: Corning IncorporatedInventors: Daniel Wayne Levesque, Jr., Garrett Andrew Piech, Aric Bruce Shorey
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Patent number: 10753097Abstract: A laminated roofing shingle includes an overlay sheet, an underlay sheet secured to the overlay sheet to define a two-layer portion of the shingle, and a tape member secured on a front surface of the headlap portion of the overlay sheet by an asphalt coating of the overlay sheet, with the tape member being positioned such that at least a portion of the tape member is adhered to a single layer portion of the shingle. The shingle further includes a granular material secured to the front surface of the headlap portion of the overlay sheet, with no granular material adhered to the tape member, such that a portion of the overlay sheet carrying the tape member has a smaller thickness than a portion of the overlay sheet carrying the granular material.Type: GrantFiled: September 24, 2019Date of Patent: August 25, 2020Assignee: Owens Corning Intellectual Capital, LLCInventors: James S. Belt, Bert W. Elliott
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Patent number: 10752536Abstract: According to one embodiment, a glass-ceramic composition may include from about 60 mol. % to about 75 mol. % SiO2; from about 5 mol. % to about 10 mol. % AI2O3; from about 2 mol. % to about 20 mol. % alkali oxide R2O, the alkali oxide R2O including Li2O and Na2O; and from 0 mol. % to about 5 mol. % alkaline earth oxide RO, the alkaline earth oxide RO including MgO. A ratio of Al2O3 (mol. %)) to the sum of (R2O (mol. %)+RO (mol. %)) may be less than 1 in the glass-ceramic composition. A major crystalline phase of the glass-ceramic composition may be Li2Si2O5. A liquidus viscosity of the glass-ceramic composition may be greater than 35 kP. The glass-ceramic composition may be used to form the glass clad layer(s) of a laminated glass article.Type: GrantFiled: October 29, 2015Date of Patent: August 25, 2020Assignee: Corning IncorporatedInventors: Heather Debra Boek, Natesan Venkataraman, Mark Owen Weller
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Patent number: 10746937Abstract: Assemblies, optical connectors, and methods for bonding optical elements to a substrate using a laser beam are disclosed. In one embodiment, a method of bonding an optical element to a substrate includes disposing a film layer on a surface of the substrate, disposing the optical element on a surface of the film layer, and directing a laser beam into the optical element. The method further includes melting, using the diameter laser beam, a material of the substrate to create a bond area between the optical element and the surface of the substrate. The film layer is capable of absorbing a wavelength of the laser beam to melt the material of the substrate at the bond area. The bond area includes laser-melted material of the substrate that bonds the optical element to the substrate.Type: GrantFiled: October 25, 2019Date of Patent: August 18, 2020Assignee: Corning IncorporatedInventors: Douglas Llewellyn Butler, Stephan Lvovich Logunov, Mark Alejandro Quesada, Alexander Mikhailovich Streltsov, James Scott Sutherland
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Patent number: 10744675Abstract: An in situ inspection system and method to inspect a honeycomb body (122) skin in a skinning system. The inspection system includes a line illuminator (148) to generate a line illumination on the skin (136) perpendicular to an axial direction (112) of the honeycomb body travel, and a detector (152) to detect the line illumination scattered from the skin (136) and generate a signal based on the detected line illumination. A controller (184) is configured to receive the signal generated by the detector (152), compare the received signal to a previously stored defect free signal in real-time, and control at least one skinning process parameter based on the comparison. The method includes in situ inspecting the skin (136) and controlling at least one skinning process parameter based on the inspection. In the method, the in situ inspection includes illuminating a line of the skin (136) perpendicular to the axial direction (112) and detecting the illuminated line scattered from the skin (136).Type: GrantFiled: March 18, 2015Date of Patent: August 18, 2020Assignee: Corning IncorporatedInventors: Joseph Henry Citriniti, Parasuram Padmanabhan Harihara, Kevin Lee Wasson
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Patent number: 10745312Abstract: Disclosed herein are apparatuses for producing a glass ribbon, the apparatuses comprising a forming body comprising an upper trough-shaped portion comprising two trough walls and a trough bottom; a lower wedge-shaped portion; a delivery end comprising a first recess; and a compression end comprising a second recess; and first and second supports coupled to the first and second recesses, wherein at least a portion of the first or second support surfaces are non-planar and in continuous contact with at least a portion of the respective first or second recess surfaces. Also disclosed herein are methods for producing a glass ribbon using such apparatuses.Type: GrantFiled: December 16, 2015Date of Patent: August 18, 2020Assignee: Corning IncorporatedInventor: Timothy L Lansberry
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Patent number: 10750442Abstract: Power management for remote units in a distributed communication system. Power can be managed for a remote unit configured to power modules and devices that may require more power to operate than power available to the remote unit. For example, the remote unit may be configured to include power-consuming remote unit modules to provide distributed antenna system-related services. As another example, the remote unit may be configured to provide power through powered ports in the remote unit to external power-consuming devices. Depending on the configuration of the remote unit, the power-consuming remote unit modules and/or external power-consuming devices may demand more power than is available at the remote unit. In this instance, the power available at the remote unit can be distributed to the power-consuming modules and devices based on the priority of services desired to be provided by the remote unit.Type: GrantFiled: August 7, 2019Date of Patent: August 18, 2020Assignee: Corning Optical Communications LLCInventors: Christian Heidler, Jonathan Richard Hull, Jessica Joy Kedziora, Michael Sauer, Wolfgang Gottfried Tobias Schweiker
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Patent number: 10737962Abstract: A system includes an overflow distributor and a support member. The overflow distributor includes a first sidewall, a second sidewall opposite the first sidewall, and a floor extending between the opposing first and second sidewalls. Interior surfaces of the first sidewall, the second sidewall, and the floor cooperatively define a trough configured to receive molten glass. Exterior surfaces of the first sidewall and the second sidewall are configured to direct molten glass that overflows the trough. The support member is disposed between the opposing first and second sidewalls of the overflow distributor and abutting an exterior surface of the floor of the overflow distributor.Type: GrantFiled: February 3, 2016Date of Patent: August 11, 2020Assignee: Corning IncorporatedInventors: Frank Coppola, John Michael Feenaughty, Vladislav Yuryevich Golyatin, John Jerry Kersting, Steven Michael Milillo, Eric James Nichols, Nikolay Anatolyevich Panin
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Patent number: 10739541Abstract: Optical cable assemblies with variable output current limits are disclosed. In one embodiment, an active optical cable assembly includes a cable having at least one electrical conductor, a host connector coupled to a first end of the cable, and a device connector coupled to a second end of the cable. The host connector includes a host circuit that determines a current limit of one or more devices coupled to the active optical cable assembly and produces a transmitted voltage in accordance with the current limit on the at least one electrical conductor. The device connector includes a device circuit that detects the transmitted voltage on the at least one electrical conductor and limits a current configured to be provided to a device coupled to the device connector based on the transmitted voltage.Type: GrantFiled: September 7, 2018Date of Patent: August 11, 2020Assignee: Corning Research & Development CorporationInventor: Wojciech Piotr Giziewicz
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Patent number: 10739394Abstract: Disclosed herein are apparatuses and methods for measuring electrostatic charge on a surface of a substrate. The apparatuses comprise a substrate mounting platform, a substrate contacting component, and at least one voltage sensor, wherein the apparatus is programmed to independently control the rotational and translation velocity of a roller and/or to measure a voltage of the substrate at multiple points to produce a two-dimensional map of voltage for at least a portion of the substrate.Type: GrantFiled: November 30, 2016Date of Patent: August 11, 2020Assignee: Corning IncorporatedInventors: Gabriel Pierce Agnello, Peter Knowles, Correy Robert Ustanik
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Patent number: 10738486Abstract: A machine for distributing insulation material from a package of compressed insulation material is provided. The machine includes a chute having an inlet end and outlet end. The inlet end is configured to receive the package of compressed insulation material. The chute further has a removable hose hub configured for wrapping with a distribution hose. The removable hose hub is further configured for engagement with opposing flange assemblies such that rotation of the hose hub results in rotation of the flange assemblies. A lower unit is configured to receive the compressed insulation material exiting the outlet end of the chute. The lower unit includes a plurality of shredders and a discharge mechanism. The discharge mechanism is configured to discharge conditioned insulation material into an airstream.Type: GrantFiled: November 18, 2016Date of Patent: August 11, 2020Assignee: Owens Corning Intellectual Capital, LLCInventors: David M. Cook, Brandon Robinson, Christopher M. Relyea
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Patent number: 10737476Abstract: Disclosed herein are methods for transferring a graphene film onto a substrate, the methods comprising applying a polymer layer to a first surface of a graphene film, wherein a second surface of the graphene film is in contact with a growth substrate; applying a thermal release polymer layer to the polymer layer; removing the growth substrate to form a transfer substrate comprising an exposed graphene surface; and contacting the exposed graphene surface with a target substrate. Transfer substrates comprising a graphene film, a thermal release polymer layer, and a polymer layer are also disclosed herein.Type: GrantFiled: August 30, 2016Date of Patent: August 11, 2020Assignee: Corning IncorporatedInventors: Benedict Yorke Johnson, Xinyuan Liu, Prantik Mazumder
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Patent number: 10730790Abstract: Optically transparent articles and structures that include or are otherwise disposed on a substantially transparent substrate. These articles and structures also include a stack of N (N>2) bi-layers on the substrate, the stack having a thickness of at least 5 nm. Each bi-layer is defined by (a) a first layer; and (b) a second layer disposed on the first layer, the layers having at least one of different compositions and different microstructures. The stack has a stack refractive index between about 1.2 and about 2.2 or between about 100% and about 150% of a refractive index of the substrate, and a stack hardness of 15 GPa or greater when measured with a Berkovich Indenter Hardness Test along an indentation depth in the range from about 10% to about 50% of the thickness of the stack disposed on a glass test substrate having a hardness between 6.5 and 8 GPa.Type: GrantFiled: February 25, 2016Date of Patent: August 4, 2020Assignee: Corning IncorporatedInventor: Charles Andrew Paulson
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Patent number: 10730125Abstract: An apparatus and method to machine cavities in die blanks having little to no taper. The apparatus includes an electrode tool (200) including intersecting walls coated with electrically insulating coating (258), an erosion face (204) comprising a cross section of the walls exposed through the electrically insulating coating, and a channel formed by the walls to supply electrolyte to the erosion face, the channels defined by interior surfaces of the walls and having an opening formed by edges of the erosion face. The method includes pulsed electrochemical machining a work piece with the electrode tool.Type: GrantFiled: November 20, 2015Date of Patent: August 4, 2020Assignee: Corning IncorporatedInventors: Dominick John Forenz, Mark Lee Humphrey, Kenneth Richard Miller, John Charles Rector, Gregg Lee Shugars
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Patent number: 10730800Abstract: A composition for applying to a honeycomb body includes a refractory filler, an organic binder, an inorganic binder, and a liquid vehicle, wherein the refractory filler, the particle size distribution of the refractory filler, the organic binder, and the inorganic binder are selected such that, when the composition is applied to plug a plurality of channels of the honeycomb body, the plug depth variability is reduced.Type: GrantFiled: February 26, 2018Date of Patent: August 4, 2020Assignee: Corning IncorporatedInventors: Colby William Audinwood, Anthony Joseph Cecce, Toka Marie Culbertson, Courtney Spencer Warren
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Patent number: 10732126Abstract: A method of inspecting defects on a transparent substrate may include: selecting a gradient of an illumination optical system so that light incident on the transparent substrate has a first angle; selecting a gradient of a detection optical system so that an optical axis of the detection optical system located over the transparent substrate has a second angle, which is equal to or less than the first angle; adjusting a position of at least one of the illumination optical system, the transparent substrate, and the detection optical system so that a field-of-view of the detection optical system covers a first region where the light meets a first surface of the transparent substrate and does not cover a second region where light meets a second surface of the transparent substrate, the second surface being opposite to the first surface; illuminating the transparent substrate; and detecting light scattered from the transparent substrate.Type: GrantFiled: October 31, 2017Date of Patent: August 4, 2020Assignee: Corning IncorporatedInventors: Chong Pyung An, Uta-Barbara Goers, En Hong, Sung-chan Hwang, Ji Hwa Jung, Tae-ho Keem, Philip Robert LeBlanc, Hyeong-cheol Lee, Michal Mlejnek, Johannes Moll, Rajeshkannan Palanisamy, Sung-jong Pyo, Amanda Kathryn Thomas, Correy Robert Ustanik
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Patent number: 10730783Abstract: A method for laser processing a transparent workpiece includes forming a contour line that includes defects, by directing a pulsed laser beam output by a beam source through an aspheric optical element positioned offset in a radial direction from the beam pathway and into the transparent workpiece such that the portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece that produces a defect within the transparent workpiece. The portion of the pulsed laser beam directed into the transparent workpiece includes a wavelength ?, an effective spot size wo,eff, and a non-axisymmetric beam cross section having a minimum Rayleigh range ZRx,min in an x-direction and a minimum Rayleigh range ZRy,min in a y-direction. Further, the smaller of ZRx,min and ZRy,min is greater than F D ? ? ? ? w 0 , eff 2 ? , where FD is a dimensionless divergence factor comprising a value of 10 or greater.Type: GrantFiled: September 28, 2017Date of Patent: August 4, 2020Assignee: Corning IncorporatedInventors: Ravindra Kumar Akarapu, Garrett Andrew Piech, Sergio Tsuda, James Andrew West