Abstract: A method for mounting a fin system in a power module includes: sintering a fin system to a first base substrate, the fin system comprising a plurality of fins attached to and extending away from a base plate; sintering a first power switch component to the first base substrate; sintering a second power switch component to a second base substrate; and soldering a heat dissipation element to the second base substrate.

Abstract: A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including a drain terminal and a source terminal; one or more phase switches configured to control a current flow between the drain terminal and the source terminal; and a point-of-use controller including two or more thermal sensors on the point-of-use controller, the point-of-use controller configured to determine a temperature of the one or more phase switches using the two or more thermal sensors.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and one or more controllers configured to: receive one or more signals related to an operation of the power switch, update one or more state definitions based on the received one or more signals, and control a gate control signal to the gate terminal based on the updated one or more state definitions.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first decoupling capacitor configured to be connected to a positive connection of the battery and a negative connection of the battery; and a first power module including: a first upper phase switch configured to control a first upper phase flow of current between the positive connection of the battery and a first phase connection of the motor, and a first lower phase switch configured to control a first lower phase flow of current between a negative connection of the battery and the first phase connection of the motor.

Abstract: A system comprises an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: an upper phase controller configured to store upper phase data; a lower phase controller configured to store lower phase data; and a data coherence interface providing a communication interface between the upper phase controller and the lower phase controller for data coherence between the stored upper phase data and the stored lower phase data.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a power switch including a semiconductor die, the power switch being coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the power switch being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate; a first electrically conductive spacer coupled to inner surface of the first substrate and to the inner surface of the second substrate; and a flex circuit coupled to the power switch.

Abstract: A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a point-of-use controller configured to: detect a fault; determine a fault type of the detected fault from among n fault types; determine a fault response group to which the determined fault type belongs from among m fault response groups; encode the determined fault response group; and transmit the encoded fault response group via a communication interface; and a phase controller configured to: receive the encoded fault response group from the point-of-use controller via the communication interface; determine the fault response group; decode the determined fault response group; and output the decoded fault response group.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a first power module, the first power module including: a first substrate including a first conductive layer; a second substrate including a second conductive layer; a power switch between the first conductive layer and the second conductive layer, the power switch including a gate connection, wherein the power switch is configured to selectively electrically connect the first conductive layer to the second conductive layer based on a signal to the gate connection; and a point-of-use controller between the first conductive layer and the second conductive layer, the point-of-use controller configured to provide the signal to the gate connection to control the power switch.

Abstract: A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and one or more controllers configured to detect a voltage from the gate terminal to the source terminal of the power switch as a gate-to-source voltage, and control a gate control signal to the gate terminal based on the detected gate-to-source voltage.

Abstract: A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; a gate driver configured to provide a signal to the gate terminal, the gate driver including one or more of a resistive gate driver with variable resistance or a current gate driver with variable current; and one or more controllers configured to detect a voltage from the gate terminal to the source terminal of the power switch, and control the gate driver based on the detected voltage.

Abstract: A system includes a power module, wherein the power module includes an interlocking feature on a first surface of the power module; and at least one heat sink, wherein the surface of the at least one heat sink includes a layer of thermal interface material.

Abstract: A system includes: an inverter including: a first galvanic interface to separate a first high voltage area from a low voltage area; a first low voltage controller in the low voltage area, the first low voltage controller configured to send a first control signal using the first galvanic interface to a first high voltage controller in the first high voltage area; a second galvanic interface to separate a second high voltage area from the low voltage area; and a second low voltage controller in the low voltage area, the first low voltage controller configured to send a second control signal using the second galvanic interface to a second high voltage controller in the second high voltage area, wherein the second low voltage controller is configured to provide an output latch signal to the first low voltage controller and receive an input latch signal from the first low voltage controller.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.

Abstract: A system includes: an inverter, wherein the inverter includes: a power module including: a flex layer including a gate trace, a first substrate, a second substrate including a source plane and a gate plane separated from the source plane by a full trench, the source plane including a step trench, and the gate plane including an electrical connection through the gate trace of the flex layer to a gate input connection of the power module, a semiconductor die disposed between the first substrate and the second substrate, the step trench formed in a portion of the source plane corresponding to at an edge of the semiconductor die, and the semiconductor die including a gate connected to the gate plane, and a sinter element disposed between the semiconductor die and the second substrate to connect the semiconductor die to the second substrate; a battery; and a motor.

Abstract: A system comprises: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power switch including a drain terminal, a source terminal, and a gate terminal; and a controller configured to detect a change in current at the source terminal of the power switch using a complex impedance of a metal trace connected to the source terminal of the power switch, and control a gate control signal to the gate terminal based on the detected change in current.

Abstract: A system includes: an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a power module including: a first phase switch including one or more first phase power switches; a second phase switch including one or more second phase power switches; and one or more controllers configured to detect a gate open condition of the first phase switch or the second phase switch.

Abstract: A power module, includes: one or more power switches; a passive heat dissipation element in contact with and facing a first surface of the one or more power switches, the passive heat dissipation element having a first planar surface and a second planar surface; and an active heat dissipation element in contact with and facing a second surface of the one or more power switches, wherein the active heat dissipation element is positioned opposite the passive heat dissipation element relative to the one or more power switches and is in thermal contact with the passive heat dissipation element.

Abstract: A system comprises an inverter configured to convert DC power from a battery to AC power to drive a motor, wherein the inverter includes: a galvanic isolator separating a high voltage area from a low voltage area; a low voltage phase controller in the low voltage area, the low voltage phase controller configured to receive a pulse width modulation (PWM) signal from an inverter controller and adjust the received PWM signal based on a feedback signal; and a high voltage phase controller in the high voltage area, the high voltage phase controller configured to receive the adjusted PWM signal from the low voltage phase controller, provide the adjusted PWM signal to a phase switch, and provide the feedback signal based on an on-time measurement of the phase switch.

Abstract: A subassembly for an electrical component includes: a first plate including: a wall, stepped walls extending from opposite sides of the wall, flange elements extending outwardly from the stepped walls, each flange element defining an engagement slot; a first heatsink positioned on the wall between the stepped walls; a second heatsink; a power module between the first heatsink and the second heatsink; and a second plate including: a plate wall extending across the second heatsink, transition walls extending from opposite sides of the plate wall, and prongs extending from the transition walls toward the first plate and substantially perpendicular to an inner surface of the plate wall in contact with the second heatsink, wherein the prongs are aligned with and configured to engage the engagement slots.

Abstract: A power module includes: a first substrate having an outer surface and an inner surface; a semiconductor die coupled to the inner surface of the first substrate; a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate; and a flex circuit coupled to the semiconductor die.