Abstract: A method of forming an interconnection structure is disclosed, including providing a substrate having a first side and a second side opposite to the first side, forming a via hole through the substrate, wherein the via hole has a first opening in the first side and a second opening in the second side, forming a first pad covering the first opening, and forming a via structure in the via hole subsequent to forming the first pad, wherein the via structure includes a conductive material and is adjoined to the first pad.

Abstract: The present disclosure provides a high-voltage isolating device and method. The high-voltage isolating device includes a power module and a shelf. The power module's back panel is provided with a first connecting portion, and the power module's front panel is provided with a first fastening member. The shelf includes a module slot for accommodating the power module. The module slot's rear end is provided with a second connecting portion, and the module slot's front end is provided with a second fastening member. Wherein in a first status, the first connecting portion is matched and connected with the second connecting portion, and the first fastening member is away from the second fastening member, and in a second status, the first connecting portion is disconnected from the second connecting portion, and the first fastening member and the second fastening member are matched and connected together by a padlock.

Abstract: The embodiments of the present disclosure relate to a power package module of multiple power chips and a method of manufacturing a power chip unit. The power package module of multiple power chips includes: a power chip unit including at least two power chips placed in parallel and a bonding part bonding the two power chips; and a substrate supporting the power chip unit and including a metal layer electronically connecting with the power chip unit, wherein the bonding part is made from an insulated material with cohesiveness, the distance of a gap between the two power chips placed in parallel is smaller than or equal to a preset width, and the bonding part is filled in the gap, insulatedly bonding the two power chips placed in parallel, and wherein side surfaces of the two power chips are naked except the portions contacting the bonding part.

Abstract: The present disclosure discloses a gate voltage control circuit of an IGBT and a control method thereof. The gate voltage control circuit of the IGBT comprises a voltage control circuit, an active clamping circuit and a power amplifier circuit. A control voltage outputted by the voltage control circuit indirectly controls a gate voltage of the IGBT, so as to achieve a better control of the gate voltage of the IGBT with a smaller loss. It may prevent the active clamping circuit from a too-early response and may increase the active clamping circuit response speed; and may avoid the voltage oscillation of the collector-emitter voltage Vce and the gate voltage Vge, and may improve the reliability of the IGBTs connected in series.

Abstract: The present disclosure provides a connector which is a combination of at least one power pin, one plastic member, and one signal pin, wherein the power pin includes a columnar metal block, each plastic member is connected to the columnar metal block at side surface, each signal pin is attached to a side surface of the plastic member, and extends to two bottom surfaces of the plastic member to form contact surfaces with predetermined areas on the two bottom surfaces; wherein, the contact surface on first bottom surface of the plastic member is flush with first bottom surface of the metal block, and the contact surface on second bottom surface of the plastic member is flush with second bottom surface of the metal block.

Abstract: A photovoltaic power generation system includes a plurality of photovoltaic arrays, a plurality of shutdown units and an inverter. The shutdown unit is adjacent to the corresponding photovoltaic array, connected in parallel with the corresponding photovoltaic array, and electrically connected to the inverter via high voltage wires; the photovoltaic power generation system further includes a control unit configured to receive a detection signal indicating a state of the AC side of the inverter, monitor whether the AC side of the inverter is in a power-off state according to the detection signal, and generate a first power-off signal when the AC side of the inverter is in the power-off state; and the shutdown units are configured to receive the first power-off signal, and stop a power transmission from the photovoltaic arrays to the inverter according to the first power-off signal.

Abstract: A detection circuit includes: a first switch, a second switch, a first detection resistor and a second detection resistor, wherein the first switch and the first detection resistor are coupled in series to form a first branch, a first end of the first branch is electrically connected with a positive bus of the photovoltaic inverter and a second end of the first branch is electrically connected with a ground; and the second switch and the second detection resistor are coupled in series to form a second branch, a first end of the second branch is electrically connected with a negative bus of the photovoltaic inverter and a second end of the second branch is electrically connected with the ground.

Abstract: In a system for wirelessly transferring power from a primary side across an airgap to a secondary side, the secondary side includes two parallel resonating circuits (27) each including two parallel resonating paths with a series connection of a resonating inductor (28), and a resonating capacitor 29. A rectifier (21) is connected to the output of each resonating path for converting the AC output (12?) of the resonating paths to a DC output (13?). The outputs of the rectifiers (21) are connected in parallel to provide the AC output power (13) to a load such as a battery or the like. Each resonating path further includes a symmetry inductance connected in series to improve current sharing among the resonating paths and to reduce the higher harmonic portion in the resonating paths.

Abstract: The invention concerns a wireless power transfer arrangement (1) including a primary side (2) and a secondary side (3) where the primary side includes an input stage (5) for converting an input power to an AC primary output and a primary resonator (6) for receiving the AC primary output and inducing a magnetic field (9) for wireless power transfer through an air gap (8). The secondary side (3) includes a secondary resonator (10) for converting the power received through the magnetic field (9) to an AC secondary output and an output stage (11) for converting the AC secondary output to a DC secondary output. A controller (15) is adapted to control independently of each other a frequency of the AC primary output to be at a resonance frequency of the resonators and the power transferred from the primary side (2) to the secondary side (3) by controlling the voltage or the current of the AC primary output.

Abstract: A magnetic device includes a housing, a bobbin, at least one coil, and a first magnetic core and a second magnetic core. The housing has at least one side plate and a bottom plate. The side plate stands on the bottom plate and forms a space with the bottom plate. The bobbin is at least partially located in the space. The bobbin has a cylinder. The at least one coil is wound around the cylinder. Each of the first and second magnetic cores includes a center column, a side column, a connecting portion, and a metal clip. The center column is located in the cylinder. The side column is located outside the coil and away from the bottom plate, such that the coil is located between the side column and the bottom plate. The connecting portion connects the center column and the side column.

Abstract: A method for manufacturing a stack structure comprises: providing a lead frame having a metal frame, at least two metal plate portions and a plurality of connection ribs, the connection ribs each comprises a first end, a second end and a connection portion; directly mounting electronic components for constructing two modules on the metal plate portions; packaging the electronic components of the first module, the first ends of the metal connection components which are electrically connected to the first module and the first ends of the part of the connection ribs which are electrically connected to the first module are packaged therein; removing the metal frame and part or whole of the connection ribs, the remaining connection ribs forms pins; and bending the metal connection component so that the two modules connected by the metal connection components are stacked one upon the other, to form the stack structure.

Abstract: A power supply converter and a method for manufacturing the same are provided. The power supply converter includes an inductance component and a power component, wherein the inductance component includes: a first magnetic substrate, provided with a first via, the first magnetic substrate including a first surface and a second surface, and a first pin being provided on the first surface; a second magnetic substrate, provided with a second via, and having a second surface provided with a second pin; an inductance coil, provided between the first surface and the second surface and having a first end and a second end formed at the vias and connected to the first and second pin, respectively; and a filling part, at least partly filling the vias, wherein the power component and the inductance component are stacked, are in contact and are coupled to each other.

Abstract: The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

Abstract: The present disclosure relates to a magnetic component, a converter and an inductor. The magnetic component includes a magnetic core including a first winding window, a second winding window and a third winding window; and a winding including a first winding, a second winding and a third winding, which are wound in the first winding window, the second winding window and the third winding window, respectively, wherein when an alike current flows through the first winding, a second winding and the third winding, magnetic fluxes respectively generated in magnetic core units forming the first winding window and the second winding window are superposed on a first common magnetic column therebetween, and magnetic fluxes respectively generated in magnetic core units forming the second winding window and the third winding window are superposed on a second common magnetic column therebetween.

Abstract: A high voltage transformer apparatus, including: a tank; a high voltage transformer, disposed upright on one side within the tank, including a first transformer unit configured to generate a positive voltage and a second transformer unit configured to generate a negative voltage; a positive high voltage terminal and a negative high voltage terminal respectively disposed on the other side within the tank opposite to the first transformer unit and the second transformer unit; a first circuit board disposed between the first transformer unit, the first side wall, and the positive high voltage terminal; and a second circuit board disposed between the second transformer unit, the second side wall, and the negative high voltage terminal; wherein the first and second circuit boards are respectively configured to rectify, filter and sample the positive and negative voltages.

Abstract: A multiple parallel-connected resonant converter, an inductor-integrated magnetic element and a transformer-integrated magnetic element are provided. The multiple parallel-connected resonant converter includes a first and a second converters. The first converter having a first input and output end includes a first inductor, a first transformer and a first capacitor connected in series. The second converter having a second input and output end includes a second inductor, a second transformer and a second capacitor connected in series. The second output end is connected with the first output end in parallel. The first and second inductor are integrated in a first magnetic element, the first magnetic element includes a first and second side column, and a first and second central column. The first inductor includes a first coil positioned around the first central column and the second inductor includes a second coil positioned around the second central column.

Abstract: The present disclosure provides a heat dissipation structure for a magnetic component and a magnetic component having the same. The magnetic component includes a plurality of heat dissipation pins, which are disposed on the winding of the magnetic component, wherein the magnetic component has one or more windings. The heat dissipation structure includes a circuit board on which a plurality of heat dissipation channels are disposed, and the heat dissipation pins of the windings are in contact with the heat dissipation channels; a plurality of heat conduction portions are disposed correspondingly under the heat dissipation channels of the circuit board; a heat conduction layer is arranged under the heat conduction portions and contacts with the heat conduction portions; and a heat dissipation layer is arranged under the heat conduction layer and contacts with the heat conduction layer.

Abstract: A power converter and a method of controlling the power converter are provided. The power converter includes a PFC rectifier module and a DC-DC converter module. When the output voltage of the power converter is greater than or equal to a minimum limit value of the bus voltage output by the PFC rectifier module, the DC-DC converter module is operated in a constant-on mode in which the DC-DC converter module does not perform voltage conversion and the PFC rectifier module outputs the bus voltage which is adjusted according to the output voltage of the power converter. When the output voltage of the power converter is less than the minimum limit value, the DC-DC converter module is operated in a voltage-regulation mode in which the DC-DC converter module converts the bus voltage into the output voltage of the power converter, and the bus voltage is a constant value.

Abstract: The invention provides a water-cooling power supply module, comprising: a water-cooling plate; a power supply module disposed on the water-cooling plate, comprising: a capacitor module, a power module, a plurality of inductor modules and input/output filter module arranged in sequence on the surface of the water-cooling plate, and a control module disposed above the capacitor module or the power module at least used for controlling the power module; wherein water channels in the water-cooling plate are designed such that the cooling water flows through the power module, the inductor modules and the input/output filter module in sequence.

Abstract: A power supply module having two output voltages includes an inductor module and a main board. The inductor module includes a first magnetic core, a second magnetic core, an intermediate magnetic core disposed therebetween, a first winding and a second winding. The first winding is disposed on one of a magnetic column of the first magnetic core and a magnetic column of the intermediate magnetic core to form a first inductor. The second winding is disposed on one of a magnetic column of the second magnetic core and a magnetic column of the intermediate magnetic core to form a second inductor. There is no air gap at a portion of the intermediate magnetic core where magnetic paths of the first and second inductors pass through together. The inductor module is disposed on the main board. The first winding and the second winding are electrically connected with the main board.