Abstract: Various embodiments provide for circuit design routing based on parallel run length (PRL) rules. In particular, a plurality of PRL rules is accessed and used to generate a set of additional routing blockages around an existing routing blockage of the circuit design. The additional routing blockages can be positioned relative to the existing routing blockage. During routing, the set of additional routing blockages can be modeled into a capacity map, which is then used by global to generate routing guide(s) between at least two nodes of the circuit design. In doing so, the various embodiments can assist in routing a wire while avoiding violation of the plurality of PRL rules with respect to the existing blockage, can speed up performance of global routing, can make it easier for detailed routing to honor routing guides produced by global routing, and can speed up performance of detailed routing in resolving DRC violations.

Abstract: Various techniques implement an electronic design with physical simulations using layout artwork. The approximate behaviors of the electronic design are determined. A region in the electronic design is identified. A first three-dimensional model is identified, if pre-existing, or generated, if non-existing, for the region in the electronic design. The behaviors of the region is determined using at least physics-based techniques or methodologies that are preconditioned upon at least a portion of the approximate behaviors determined for the electronic design.

Abstract: The present disclosure relates to a computer-implemented method for use in design for manufacturing associated with a die or package. Embodiments may include providing, using a processor, an electronic design and displaying, at a graphical user interface, at least a portion of a layout associated with the electronic design. Embodiments may also include determining an expected thermal or centrifuge force manufacturing variation associated with the electronic design. Embodiments may further include allowing a user to insert, at the graphical user interface prior to signoff, a copper pillar bump or solder bump on at least a portion of the layout based upon, at least in part, the determined expected thermal or centrifuge force manufacturing variation. Embodiments may further include displaying the copper pillar bump or the solder bump on the layout at the graphical user interface.

Abstract: Disclosed are methods, systems, and articles of manufacture for binding and annotating an electronic design with a schematic driven extracted view. These techniques identify a schematic design and an extracted view of an electronic design and bind the schematic design with the extracted view. The resulting binding information concerning binding the schematic design with the extracted view is stored in a data structure. The schematic design may be annotated with extracted view information pertaining to the extracted view based at least in part upon the binding information. A response to a user action may be automatically generated based in part or in whole upon the extracted view information or the binding information.

Abstract: A method includes receiving a first list including a plurality of first curves defining a first boundary set and a second list including a plurality of second curves defining a second boundary set. The first and second curves are indicative of features in an integrated circuit based on parametric values. The method includes determining intersections between pairs of curves from the first and the second lists, assigning a node to each intersection point of a pair of curves, and determining curve sections between the intersection points for each intersected curve. The method includes determining a successor of each curve section, determining boundaries formed by the curve sections, performing the Boolean operation between the boundaries to obtain the one or more features in the integrated circuit from the two or more boundaries, and generating a layout of the integrated circuit including the features for manufacturing a mask for reproducing the features.

Abstract: The present embodiments relate to providing an overlap view of external and internal components of all instance circuit cells related to a master circuit cell in a same layout view. A layout of a circuit having a plurality of instance circuit cells of a master circuit cell is provided. Further, a graphical user interface including a user selectable option for an overlay view is provided. In addition, responsive to the selection of the overlay view, the plurality of instance circuit cells of the master circuit cell is determined. In addition, a plurality of sets of circuit elements, each set of circuit elements including external circuit elements that overlap with a corresponding instance circuit cell of the plurality of instance circuit cells is determined. Further, the plurality of sets of circuit elements overlaid on the master circuit cell is displayed on the layout view.

Abstract: A delay line can include a number of delay elements connected in series, each selected to impart an overall delay to an input signal. The delay line can include delay selection logic to select a subset of the delay elements to delay the input signal. The delay line can include delay element enable logic to enable the selected subset of the delay elements to delay the input signal. Further, the remaining delay elements can be disabled from contributing any delay to the input signal, and a respective periodic signal can be provided to at least one of the remaining delay elements to cause the at least one remaining delay elements to output an output signal that is a function of the respective periodic signal and that has a frequency less than that of the input signal. This configuration can reduce asymmetric aging effects on the delay line.

Abstract: A computer executable tool analyzes Boolean logic in a gate-level netlist responsible for generating false Xs due to X-pessimism in logic simulation to produce a compact fix that corrects the X-pessimism problem. The fix restores logic simulation value from X to hardware-accurate non-X value and solves X-pessimism issues in logic simulation.

Abstract: The present embodiments relate to buffering signals between disjointed power domains with similar power profiles in an integrated circuit. According to some aspects, embodiments relate to a method in which an electronic design automation (EDA) tool displays a schematic including a plurality of first power domains having a first power profile and a plurality of second power domains having a second power profile. The EDA tool generates graph including a plurality of points and a plurality of edges connecting the points, where the points are located on the plurality of second power domains. The EDA tool selects one route from a plurality of routes from a start node on the graph to an end node on the graph and determines a number of buffers located on the route based on associated distance values and a design violation values.

Abstract: The present disclosure relates to a system and method for use in an electronic design environment. Embodiments may include receiving, using at least one processor, an electronic design and generating a unique name for each hardware state element associated with the electronic design. Embodiments may further include generating a unique name for each software state element associated with the electronic design. Embodiments may also include combining a plurality of unique names into an arbitrary expression, wherein the plurality of unique names includes at least one software state unique name and at least one hardware state unique name. Embodiments may further include evaluating the arbitrary expression at one or more discrete time points. Embodiments may also include recording an evaluated expression in an electronic design database.

Abstract: An approach is described for determining waiver applicability conditions and applying the conditions to multiple errors or warnings in physical verification tools. According to some embodiments, the approach includes identification of a waiver of an error or warning, registration of one or more condition sets for waiver of an error or warning, waiver of multiple errors or warnings that match the registered one or more condition sets, and further comprise any or all of the following: receiving or retrieving a circuit design, analyzing the circuit design to identify errors and warnings, and displaying identified errors and warnings where errors and warnings matching a registered condition set are waived. This approach provides for a 1-to-many relationship between identification of a waiver and application of waivers.

Abstract: Various embodiments provide for a multi-channel memory interface capable of supporting a multi-channel memory module (e.g., DIMM) that combines different memory types, such as DDR4/DDR5, DDR5/LPDDR5, or LPDDR4/LPDDR5, through a single physical layer (PHY) interface.

Abstract: Systems, methods, media, and other such embodiments described herein relate to generation of routing trees. One embodiment involves accessing a circuit design comprising an irregular sink arrangement. Different grid templates may be identified for assisting with balanced routings at different levels of a routing tree to connect the sinks of the circuit design. As part of such operations, costs for different routings using the different grid templates are calculated and compared. A lowest cost routing for each grid template are identified. These costs are normalized across different grid templates, and a lowest cost routing across all grid templates is selected. In various embodiments, various costs values based on sink pairing, isolated sinks, and node position for a next level of a routing tree are considered.

Abstract: The present disclosure relates to a computer-implemented method for electronic circuit design awareness. Embodiments may include providing, using a processor, an electronic design having a package layout and a die layout associated therewith. Embodiments may also include displaying at a graphical user interface, the package layout and allowing, at the graphical user interface, a user to edit the package layout. Embodiments may further include determining, using the processor, an impact of the edit on the die layout and in response to the edit, mirroring the edit at the die layout.

Abstract: Devices, methods, computer readable media, and other embodiments are described for design and verification of safety critical electronic systems. Some embodiments integrate functional safety (FS) data with circuit design data for use in electronic design automation (EDA) operations. One embodiment involves a device accessing FS and circuit design data; automatically analyzing register transfer level (RTL) design data using the FS data to perform one or more FS quality checks; and placing and routing the circuit design using the RTL design data and the set of FS data to perform FS-aware placement and routing. In some embodiments, failure modes and associated safety mechanisms to improve safety metrics associated with failure modes are automatically added to the circuit design during EDA operations. In other embodiments, additional FS-aware operations are performed. In some embodiments, the FS data is structured as a single Unified Safety Format (USF) file.

Abstract: Electronic design automation systems, methods, and media are presented for view pruning to increase the efficiency of computing operations for analyzing and updating a circuit design for an integrated circuit. One embodiment involves accessing a circuit design stored in memory that is associated with a plurality of views, selecting a first view of the plurality of view for view pruning analysis, and identifying a plurality of input values for the first view of the plurality of views. Random nets are generated based on the views, view inputs, and pruning thresholds. Certain views are then selected as dominant based on a comparison of the output slews different nets and views. Subsequent analysis is then performed and used to update the design without using the pruned views (e.g., using the selected dominant views).

Abstract: Various embodiments described herein provide for grouping read-modify-writes (RMWs) such that multiple RMW command sequences can be executed (or rearranged in the command queue) in an interleaved manner rather than being executed in order. In particular, various embodiments described herein split the read and write components (commands) of multiple RMW command sequences, group the read components in the command queue to execute consecutively, and group the write components in the command queue to execute consecutively.

Abstract: Embodiments included herein are directed towards a system and method for implementing an IC package design with an IC package design estimator. Embodiments may include estimating a number of layers for an integrated circuit (IC) package design that includes a plurality of IC die designs. Embodiments may further include determining whether the estimated number of layers can accommodate routing demands for interconnections between the IC package design and each of the plurality of IC die designs. Embodiments may also include identifying a number of layers required to perform routing between each of the plurality of IC die designs. Embodiments may further include determining a power layer or ground layer based upon, at least in part, one or more factors and generating an output for the IC package design based upon, at least in part, the estimated number of layers and the power layer or ground layer.

Abstract: Embodiments include herein are directed towards a method for electronic circuit design and more specifically towards determining return path quality in an electrical circuit. Embodiments may include providing, using a processor, an electronic circuit design and identifying at least one net associated with the electronic circuit design. Embodiments may further include extracting an ideal loop inductance for the at least one net and extracting a real loop inductance for the at least one net. Embodiments may also include calculating a return path quality factor based upon, at least in part, the ideal loop inductance and the real loop inductance.

Abstract: Various techniques implement an electronic design with hybrid analysis techniques. An activity map is identified or generated for an electronic design. The electronic design is reduced into a reduced electronic design at least by applying a plurality of reduction processes to different portions of the electronic design based in part or in whole upon the activity map. Transient behaviors of the electronic design may be determined or predicted at least by performing one or more transient analyses on a representation of the electronic design with a simulation start point based in part or in whole upon the activity map. The electronic design may then be implemented for manufacturing at least by modifying or correcting the electronic design based at least in part upon the transient behaviors.