Patents Assigned to Dowa Electronics Materials Co., Ltd.
  • Publication number: 20170338378
    Abstract: We propose a method of producing a III nitride semiconductor light-emitting device including a p-type semiconductor layer, in which the p-type semiconductor layer is formed by the steps comprising: an electron blocking layer formation step for forming an electron blocking layer made of AlyGa1-yN (b<y?1) on a light emitting layer; and a p-type contact formation step for forming a p-type contact layer which is AlxGa1-xN (0?x?0.1), directly on the electron blocking layer, and in which the electron blocking layer formation step is performed using a carrier gas containing hydrogen as a main component, and the p-type contact formation step is performed using a carrier gas containing nitrogen as a main component.
    Type: Application
    Filed: December 7, 2015
    Publication date: November 23, 2017
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Takehiko FUJITA, Yasuhiro WATANABE
  • Publication number: 20170316857
    Abstract: There is provided a ferrite powder for bonded magnets capable of producing ferrite bonded magnets with high BHmax, excellent in MFR when converted to a compound, with high p-iHc, wherein an average particle size of particles obtained by a dry laser diffraction measurement is 5 ?m or less, a specific surface area is 1.90 m2/g or more and less than 3.00 m2/g, a compression density is 3.40 g/cm3 or more and less than 3.73 g/cm3, and a compressed molding has a coercive force of 2800 Oe or more and less than 3250 Oe.
    Type: Application
    Filed: September 30, 2015
    Publication date: November 2, 2017
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA F-TEC CO., LTD.
    Inventors: Satoru TSUBOI, Yasunobu MISHIMA, Keisuke AYABE, Masayasu SENDA
  • Publication number: 20170309381
    Abstract: A ferrite powder for bonded magnets capable of producing a ferrite bonded magnet having high BHmax, and excellent in fluidity when converted to a compound, and having a high p-iHc value, and a method for producing the same, and a ferrite bonded magnet using the ferrite powder for bonded magnets, wherein an average particle size of particles obtained by a dry laser diffraction measurement is 5 ?m or less; a specific surface area is 1.90 m2/g or more and less than 2.80 m2/g; a compression density is 3.50 g/cm3 or more and less than 3.78 g/cm3, and a compressed molding has a coercive force of 2300 Oe or more and less than 2800 Oe.
    Type: Application
    Filed: September 30, 2015
    Publication date: October 26, 2017
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA F-TEC CO., LTD.
    Inventors: Satoru TSUBOI, Yasunobu MISHIMA, Keisuke AYABE, Masayasu SENDA
  • Publication number: 20170309785
    Abstract: Provided is a III nitride semiconductor light emitting device with improved reliability capable of maintaining light output power reliably as compared with conventional devices, and a method of producing the same. The III-nitride semiconductor light-emitting device comprising: a light emitting layer, a p-type electron blocking layer, a p-type contact layer, and a p-side electrode in this order. The p-type contact layer has a first p-type contact layer co-doped with Mg and Si in contact with the p-type electron blocking layer and a second p-type contact layer doped with Mg in contact with the p-side electrode.
    Type: Application
    Filed: April 17, 2017
    Publication date: October 26, 2017
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventor: Yasuhiro WATANABE
  • Publication number: 20170301440
    Abstract: A ferrite powder for bonded magnets having a high iHc value usable even in a low temperature environment, a method for producing the same, and a bonded magnet using the ferrite powder and having high iHc value which can be used even in a low temperature environment, wherein a specific surface area is 2.20 m2/g or more and less than 3.20 m2/g; a compression density is 3.30 g/cm3 or more and less than 3.60 g/cm3, and a compressed molding has a coercive force of 3250 Oe or more and less than 3800 Oe.
    Type: Application
    Filed: September 30, 2015
    Publication date: October 19, 2017
    Applicants: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA F-TEC CO., LTD.
    Inventors: Satoru TSUBOI, Yasunobu MISHIMA, Keisuke AYABE, Masayasu SENDA
  • Publication number: 20170259334
    Abstract: A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m2/g or more but 2.0 m2/g or less, and wherein a cumulative 50% point of particle diameter (D50) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 ?m or more but 6.0 ?m or less, and a ratio of [(D90?D10)/D5o] is 3.0 or less, where D50 is the cumulative 50% point of particle diameter, D90 is a cumulative 90% point of particle diameter of the silver powder, and D10 is a cumulative 10% point of particle diameter of the silver powder.
    Type: Application
    Filed: July 27, 2015
    Publication date: September 14, 2017
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Taro Nakanoya, Hiroshi Kamiga
  • Patent number: 9741479
    Abstract: Provided is magnetic powder capable of enhancing simultaneously both magnetic characteristics including SNP and durability of a magnetic recording medium. The hexagonal ferrite magnetic powder for a magnetic recording medium has a Ba/Fe molar ratio of 8.0% or more, a Bi/Fe molar ratio of 2.5% or more and an Al/Fe molar ratio of from 3.0 to 6.0%. The magnetic powder preferably has an activation volume Vact of from 1,400 to 1,800 nm3. The magnetic powder particularly preferably has a coercive force Hc of from 159 to 279 kA/m (which is approximately from 2,000 to 3,500 Oe) and a coercivity distribution SFD of from 0.3 to 1.0. The magnetic powder may contain, as an element that substitutes an Fe site of the hexagonal ferrite, at least one kind selected from divalent transition metals M1 and tetravalent transition metals M2.
    Type: Grant
    Filed: October 31, 2014
    Date of Patent: August 22, 2017
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., FUJIFILM CORPORATION
    Inventors: Kenji Masada, Hirohisa Omoto, Futoshi Nagashima, Daisuke Abe, Toshio Tada, Norihito Kasada
  • Patent number: 9740129
    Abstract: Ferrite particles have, as a main component, a material represented by a composition formula MxFe3?xO4 (where M is at least one type of metal selected from a group made of Mg, Mn, Ca, Ti, Cu, Zn, Sr and Ni, 0<x<1), where the maximum height Rz of the particles falls within a range of 1.40 ?m to 1.90 ?m, and the degree of distortion Rsk of the particles falls within a range of ?0.25 to ?0.07. In this way, when the ferrite particles are used as the carrier of an electrophotographic image forming apparatus, even if an image formation speed is increased, the occurrence of a failure is reduced for a long period of time.
    Type: Grant
    Filed: October 29, 2014
    Date of Patent: August 22, 2017
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Shinya Sasaki, Yohei Ishikawa, Haruka Seki
  • Publication number: 20170232510
    Abstract: There is provided a silver-coated copper powder, which has excellent storage stability (reliability), and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a gold plating solution, which is a potassium gold cyanide solution (to which at least one of tripotassium citrate monohydrate, anhydrous citric acid and L-aspartic acid is preferably added), to cause 0.01 wt % or more (with respect to the silver-coated copper powder) of gold to be supported on the surface of the copper powder coated with the silver containing layer.
    Type: Application
    Filed: August 21, 2015
    Publication date: August 17, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Noriaki Nogami, Hiroshi Kamiga
  • Patent number: 9732236
    Abstract: After there is prepared a conductive paste which contains fine copper particles having an average particle diameter of 1 to 100 nm, each of the fine copper particles being coated with an azole compound, coarse copper particles having an average particle diameter of 0.3 to 20 ?m, a glycol solvent, such as ethylene glycol, and at least one of a polyvinylpyrrolidone (PVP) resin and a polyvinyl butyral (PVB) resin and wherein the total amount of the fine copper particles and the coarse copper particles is 50 to 90% by weight, the weight ratio of the fine copper particles to the coarse copper particles being in the range of from 1:9 to 5:5, the conductive paste thus prepared is applied on a substrate by screen printing to be preliminary-fired by vacuum drying, and then, fired with light irradiation by irradiating with light having a wavelength of 200 to 800 nm at a pulse period of 500 to 2000 ?s and a pulse voltage of 1600 to 3800 V to form a conductive film on the substrate.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: August 15, 2017
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Shuji Kaneda, Hidefumi Fujita, Daisuke Itoh
  • Publication number: 20170216913
    Abstract: A silver powder, wherein the silver powder satisfies D50-IPA>D50-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D50-IPA (?m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D50-W (?m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.
    Type: Application
    Filed: September 25, 2015
    Publication date: August 3, 2017
    Applicant: DOWA Electronics Materials Co., Ltd.
    Inventors: Naoki TAHARA, Noriaki NOGAMI, Hiroshi KAMIGA
  • Patent number: 9721694
    Abstract: A method suitable for mass production of nanoparticles with a uniform particle diameter is provided. It is an object to provide a powder of the nanoparticle obtained by this method, a dispersion containing the nanoparticles, and a paste containing the nanoparticles. There is provided a method for manufacturing silver particles including the step of reducing silver in a silver solution containing a protective agent composed of an organic material and a copper component in an amount of 1 to 1,000 ppm relative to the amount of silver to obtain particles having an average particle diameter (DTEM) of 5 to 100 nm as measured using a transmission electron microscope.
    Type: Grant
    Filed: April 3, 2015
    Date of Patent: August 1, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shuji Kaneda, Kimikazu Motomura, Tatsuya Kariyasu, Yutaka Hisaeda, Kosuke Iha
  • Publication number: 20170206998
    Abstract: There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.
    Type: Application
    Filed: July 24, 2015
    Publication date: July 20, 2017
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yoshiyuki Michiaki, Hiroshi Kamiga
  • Patent number: 9708221
    Abstract: Provided are an inexpensive brick, etc., naturally exhibiting excellent radiation shielding effects, demonstrating high strength while being chemically stable and not including harmful substances, and also being suitable for use in facility in which devices affected by magnetic fields are installed. Manufactured are a brick, etc., for constructing a ?-shielding structure or constructing an X-ray shielding structure, in which a molding material including hematite in a ratio of at least 90% by mass is molded into a predetermined shape to obtain a molded article, and the molded article is fired, whereby the fired molded article is endowed with a bulk density of at least 2.8 g/cm3, and the fired molded article is endowed with a residual magnetization of 1.0 A·m2·g?1 or less.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: July 18, 2017
    Assignees: MITSUISHI TAIKA RENGA CO., LTD., DOWA F-TEC CO., LTD., DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Yasumichi Miyao, Toshiya Kitamura, Yasunobu Mishima
  • Patent number: 9682426
    Abstract: An aliphatic amine having a carbon number of not less than 6, such as octylamine, hexylamine or oleylamine, serving as an organic protective material is added to water serving as a solvent so that the molar ratio of the aliphatic amine with respect to silver of a silver compound is in the range of 0.05 to 6, a reducing agent, such as hydrazine or NaBH4, being added thereto so that the molar ratio of the reducing agent with respect to silver of the silver compound is in the range of 1 to 6, and the silver compound, such as a silver salt or a silver oxide, being added thereto so that the concentration of silver ions in the aqueous reaction solution is in the range of 0.01 to 1.0 mol/L, and then, the silver compound is reduced at a temperature of 10 to 50° C. to produce fine silver particles having an average primary particle diameter of 10 to 200 nm. Thus, there is provided a method for producing fine silver particles, the method being capable of inexpensively producing fine silver particles in a short time.
    Type: Grant
    Filed: September 20, 2013
    Date of Patent: June 20, 2017
    Assignee: Dowa Electronics Materials Co., Ltd.
    Inventors: Tomonori Shibayama, Takashi Hinotsu, Tatuya Kariyasu
  • Patent number: 9662748
    Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200° C. or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: May 30, 2017
    Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Keiichi Endoh, Hiromasa Miyoshi, Takashi Hinotsu, Satoru Kurita, Yoshiko Kohno
  • Publication number: 20170137302
    Abstract: A magnetic ?-form iron oxide nanopowder is a novel magnetic iron oxide nanopowder having magnetic polarization and spontaneous electric polarization and having physical properties similar to those of half-metals; and a process produces the magnetic nanopowder. The magnetic powder has a composition represented by Fe2O3 and has a crystal structure belonging to the monoclinic system.
    Type: Application
    Filed: June 18, 2015
    Publication date: May 18, 2017
    Applicants: THE UNIVERSITY OF TOKYO, DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Shin-ichi OHKOSHI, Marie YOSHIKIYO, Asuka NAMAI, Hiroko TOKORO, Waka TARORA, Tomomichi NASU, Takayuki YOSHIDA, Manabu TANAKA
  • Patent number: 9651886
    Abstract: This invention is directed to a method for manufacturing carrier core particles for electrophotographic developer containing iron, manganese, and calcium as a core composition. The method includes (A) a mixing step of mixing an iron-containing raw material, a manganese-containing raw material, and a calcium-containing raw material to prepare a mixture thereof, (C) a granulation step of granulating the mixture after the mixing step, and (D) a firing step of firing a powdery material, which is obtained by granulating the mixture in the granulation step, at a predetermined temperature to form a magnetic phase. The calcium-containing raw material is provided in a granular form, and primary particles of the calcium-containing raw material have a volume mean diameter of 1 ?m or less.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: May 16, 2017
    Assignees: DOWA ELECTRONICS MATERIALS CO., LTD., DOWA IP CREATION CO., LTD.
    Inventors: Takeshi Kawauchi, Tomohide Iida
  • Publication number: 20170120395
    Abstract: A bonding material of a silver paste contains: fine silver particles having an average primary particle diameter of 1 to 200 nm, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as sorbic acid; and a solvent mixed with the fine silver particles, wherein a diol, such as an octanediol, is used as the solvent and wherein a triol having a boiling point of 200 to 300° C., a viscosity of 2,000 to 10,000 mPa·s at 20° C. and at least one methyl group, such as 2-methylbutane-2,3,4-triol or 2-methylbutane-1,2,4-triol, is mixed with the solvent as an addition agent.
    Type: Application
    Filed: May 29, 2015
    Publication date: May 4, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Satoru Kurita, Takashi Hinotsu, Keiichi Endoh, Hiromasa Miyoshi
  • Publication number: 20170113278
    Abstract: There is prepared a silver-coated copper powder wherein the surface of a copper powder having an average particle diameter of 0.1 to 100 ?m is coated with 5% by weight or more of silver, and the silver-coated copper powder is sprayed into the tail flame region of a thermal plasma to cause silver on the surface of the copper powder to diffuse in the grain boundaries of copper on the inside of the copper powder to produce a metal composite powder wherein the percentage of the area occupied by silver on a cross section of the metal composite powder is 3 to 20%.
    Type: Application
    Filed: October 24, 2016
    Publication date: April 27, 2017
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Hiroaki Koubu, Noriaki Nogami