Abstract: Heat dissipating plate (4) made of copper-base alloy is proposed that exhibits high degree of flatness after joining in the step of assembling power semiconductor modules, IC packages, etc., that will not crack in the solder (3) joint if subjected to heat cycles during joining or in an environment of use, and that has high heat conductivity and cost effectiveness.

Abstract: In a ceramic circuit board having a ceramic substrate and a metal circuit plate bonded to one surface of the ceramic substrate, assuming that the warpage of the ceramic circuit board is a difference in height between the center and edge of the metal circuit plate and is positive (+) when the circuit board warps so as to be concave on the side of the metal circuit plate, the warpage of the ceramic circuit board is in the range of from −0.1 mm to +0.3 mm when the ceramic circuit board is heated to 350° C., and in the range of from +0.05 mm to +0.6 mm when the temperature of the ceramic circuit board is returned to a room temperature after the ceramic circuit board is heated to 350° C. The initial warpage of the ceramic circuit board is in the range of from +0.05 mm to +0.6 mm.

Abstract: A high-purity metal (such as magnesium or zinc) containing Cl, F and S in a respective amount of no more than 0.1 ppm, with the total impurity content being no more than 1 ppm.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: bonding a metal plate 12 of an alloy containing copper and nickel directly to at least one side of a ceramic substrate 10; applying a resist 14 on a predetermined portion of the metal plate 12 to remove an undesired portion of the metal plate 12 by etching; and removing the resist 14 to form a pattern having a predetermined shape of the alloy on the ceramic substrate 10. According to this method, it is possible to reduce the displacement failure of parts to improve productivity and to prevent bonding failure during the mounting of a semiconductor device or the like thereon.

Abstract: A vacuum heat treatment furnace comprising a furnace shell, a casing arranged in an inner side of the furnace shell, a heat insulating layer consisting of a thick plate-like alumina-silica series ceramic fiber blanket and a thin plate-like alumina series ceramic material arranged in an inside of the casing, and a heater arranged in a heating room surrounded by the heat insulating layer.

Abstract: To provide a manufacturing apparatus that is capable of manufacturing metal-ceramic composite members in various shapes with high productivity, and a mold member and a manufacturing method therefor. An apparatus for manufacturing a metal-ceramic composite member was made, the apparatus including: a plurality of process regions, namely, an atmosphere replacing/heating part 11, a molten metal push-out part 21, and a cooling part 31; and a guide 48 for allowing a mold to pass through these plural process regions, molds 60 having ceramic members 86 placed therein are successively inserted into a mold inlet 43 provided in this guide 48 to pass through the guide 48 practically in a shielded state from the atmosphere, a molten metal 53 is poured thereto in the molten-metal push-out part 21, and the molten metal 53 is cooled and solidified in the cooling part 31 to join a metal and a ceramic, thereby manufacturing the metal-ceramic composite member.

Abstract: The present invention provides a Bi2223 based thick film that does not peel off when a thermal or a mechanical shock is applied to a base or an oxide superconductor thick film or the like in the middle of a manufacturing process and a method of manufacturing the same An oxide superconductor paste 1 having a mixing ratio of Bi2212 composition is applied to a base 3, dried, burned, and thereafter burned at a temperature approximate to its melting point to obtain a partially molten layer 4. Next, an oxide superconductor paste 2 having a mixing ratio of Bi2223 composition is applied to the partially molten layer 4, dried, burned, compressed by a CIP, and thereafter repeatedly burned and compressed for a predetermined number of times to obtain the base 3 having a desired superconductor thick film 5 formed thereon.

Abstract: The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2˜5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.

Abstract: A purification apparatus including a vertical stack of a feed heating zone having a feed crucible 1, a condensation zone having a plurality of condensation vapor passage plates 5, a solidification zone having a solidification crucible 2 and an entrapment/solidification zone having a plurality of entrapment/solidification vapor passage plates 7.

Abstract: A maraging steel is subjected to the aging to have a hardness of more than 500 Hv. A nitrided case is formed to have a depth that is about 20% to 50% to a ½ thickness of the maraging steel plate. An endless ring for a metal belt is constructed by the above maraging steel. According to methods of manufacturing the maraging steel and the endless ring, the nitrided case having the depth that is 20% to 50% of a distance from a plate surface to a center can be formed by executing an aging to have the hardness of more than 500 Hv, then executing a nitriding in the nitrogen atmosphere to which organic chloride is added.

Abstract: A 99.99% pure indium feed is charged into a crucible and heated to 1250 ° C. by an upper heater in a vacuum atmosphere at 1×10−4 Torr, whereupon indium evaporates, condenses on the inner surfaces of an inner tube and drips to be recovered into a liquid reservoir in the lower part of a tubular member, whereas impurity elements having a lower vapor pressure than indium stay within the crucible. The recovered indium mass in the liquid reservoir is heated to 1100° C. by a lower heater and the resulting vapors of impurity elements having a higher vapor pressure than indium pass through diffuser plates in an upper part of the tubular member to be discharged from the system, whereas the indium vapor recondenses upon contact with the diffuser plates and returns to the liquid reservoir, yielding 99.9999% pure indium, while preventing the loss of indium.

Abstract: A paste of brazing material of Ag—Cu—Ti—TiO2 system is printed to both sides of an AlN substrate; a copper sheet is then placed on both sides and heated in vacuum to be joined to the substrate. A resist having a desired-circuit pattern is coated on the surface of each copper sheet and etching is performed. A solution containing a mixture of EDTA, ammonia and aqueous hydrogen peroxide is then applied to dissolve away the unwanted brazing material and the like from between the circuit patterns without corroding the ceramic substrate and the metal sheet.

Abstract: An apparatus for leaching zinc concentrates which comprises: a pressure vessel for charging therein a solution containing at least free sulfuric acid and iron ions, a stirrer which is disposed in the pressure vessel, an oxygen gas supply pipe that extends into the pressure vessel from the outside of the pressure vessel, the oxygen gas supply pipe having an oxygen gas inlet port which opens below the stirrer, and a discharge pipe through which an iron-containing, acidic solution or a slurry that results from the reaction of said solution containing at least free sulfuric acid and iron ions is discharged to the outside of the pressure vessel, the discharge pipe having a drain port which is open in a lower part of said pressure vessel.

Abstract: A vacuum heat treatment furnace comprising a furnace shell, a casing arranged in an inner side of the furnace shell, a heat insulating layer consisting of a thick plate-like alumina-silica series ceramic fiber blanket and a thin plate-like alumina series ceramic material arranged in an inside of the casing, and a heater arranged in a heating room surrounded by the heat insulating layer.

Abstract: An ingot of a copper-base alloy containing a total of 0.

Abstract: A sulfurous compound such as a sulfur-rich “float” (concentrate) obtained by flotation of the residue from the leaching of a zinc concentrate is heated at a temperature not lower than the melting point of sulfur but below its boiling point, preferably not higher than 200° C., more preferably not higher than 140° C., and the evolving gas containing sulfur vapor is cooled at a temperature less than the melting point of sulfur, preferably at ordinary temperature, to condense sulfur.

Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.

Abstract: There is provided a metal/ceramic circuit board capable of eliminating discrepancy during mounting of parts to improve the reliability of mounting of the parts. The metal/ceramic circuit board has a ceramic substrate 10, and a metal circuit plate (a copper plate 14) bonded to the ceramic substrate 10, the metal circuit plate having a thickness of 0.1 mm to 0.5 mm, and the metal circuit plate having a skirt spreading length (a dimensional difference between the bottom and top portion of the peripheral edge portion of the metal circuit plate) of less than 50 &mgr;m.

Abstract: A sliding member having excellent seizure resistance comprising a metallic member provided with a sulfide-based solid lubricating layer on the sliding surface thereof is provided, characterized in that the interface of the metallic member in contact with said solid lubricating layer is provided with a surface roughness Rmax of 1 &mgr;m or higher. The sliding member above is obtained by preparing an aqueous solution dissolved therein one or two types or more of thiocyanates or thiosulfates of alkali metals or alkaline earth metals, and by performing electrolytic treatment in which a steel member the surface roughness thereof is controlled is used as the anode. In this manner, an iron sulfide based layer is formed on the surface of the steel member by using the Fe component derived from the steel and the S component from the solution as the reacting agents.

Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed.