Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member.

Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member.

Abstract: One object of this application is to provide an advanced substrate holder including a clamper. A substrate holder for holding a substrate by interposing the substrate between frames is disclosed. The substrate holder includes a front frame, a rear frame, and one or a plurality of clampers. Each of the clampers includes a hook portion including a hook base and a hook main body, and a plate including at least one claw. At least one of the clampers includes the plate including a first claw for a lock and a second claw for a semi-lock.

Abstract: An end point detection method is provided for detecting and end point based on a drive current supplied to a drive unit that rotates and drives one of a polishing table and a holding unit. The end point detection method includes: a step (S102) of determining whether a polishing condition of a polishing process to be executed coincides with a preset specific polishing condition; a step (S103) of adjusting a current control parameter in a drive control unit that controls the drive current, the current control parameter related to a change in the drive current with respect to a change in a driving load of the drive unit, if it is determined that the polishing condition coincides with the specific polishing condition; and a step (S105) of detecting the drive current supplied to the drive unit based on the adjusted current control parameter.

Abstract: A technology that can clean a bottom surface of a dresser while inhibiting a cleaning solution discharged from a cleaning nozzle from splashing in a direction of a polishing pad. A polishing apparatus 1 includes a polishing table 2, a top ring 3, a dresser 10, at least one cleaning nozzle 20, and a dresser rotation mechanism 32. The at least one cleaning nozzle discharges a cleaning solution Lq in a fan shape and in a direction away from a polishing pad Pd, and an intersection point IP where a discharge central axis XL2 of the cleaning solution intersects with a bottom surface 11 of the dresser is positioned closer to the at least one cleaning nozzle than a center line CL1 of the bottom surface of the dresser. The at least one cleaning nozzle discharges the cleaning solution such that a part of the cleaning solution discharged from the cleaning nozzle and contacting the bottom surface of the dresser moves and passes through the center C1 of the bottom surface of the dresser.

Abstract: The information processing apparatus (5) includes an information acquisition section (500) configured to acquire operating condition information including operation conditions of a substrate processing apparatus (2) including a substrate holder (241); and a state prediction section (501) configured to predict substrate-holding-mechanism state information corresponding to the operating condition information by inputting the operating condition information to a learning model that has been generated by machine learning that causes the learning model to learn a correlation between the operating condition information and the substrate-holding-mechanism state information indicating a state of the substrate holding mechanism (241a, 241c, 241e) when the substrate processing device (2) operates under the operating conditions indicated by the operating condition information.

Abstract: A plating apparatus that allows shielding a specific portion of a substrate at a desired timing is achieved. The plating apparatus includes a plating tank 410 for housing a plating solution, an anode 430 arranged in the plating tank 410, a substrate holder 440 for holding a substrate Wf with a surface to be plated facing downward, a rotation mechanism 447 for rotating the substrate holder 440, and a shielding mechanism 460 moving a shielding member 482 between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.

Abstract: An optimal number of modules for use is accurately estimated in a semiconductor manufacturing apparatus. Provided is a method applied to a semiconductor manufacturing apparatus including one or a plurality of substrate processing modules each including a plurality of submodules. The present method includes a step of estimating the optimal number of the submodules for use, based on a target production amount and predicted production amount of substrates and a use rate of the substrate processing module, a step of preparing, based on the estimated optimal number for use, a schedule to process a substrate with the optimal number of the submodules for use, a step of updating, based on the prepared schedule, the predicted production amount and the use rate, and a step of repeating the estimating step by use of the updated predicted production amount and use rate, to update the optimal number of the submodules for use.

Abstract: A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

Abstract: A gas solution supply device 1 includes: a first gas-liquid separator 8 in which gas solution is stored; a second gas-liquid separator 16 provided at a stage subsequent to the first gas-liquid separator 8 and in which gas solution to be supplied to a use point is stored; an intermediate line 17 provided between the first gas-liquid separator 8 and the second gas-liquid separator 16; a pressure booster pump 18 provided on the intermediate line 17 and increases a pressure of gas solution being supplied from the first gas-liquid separator 8 to the second gas-liquid separator 16; a gas supply line 2 that supplies gas as a material of the gas solution; and a gas dissolving unit 20 provided on the intermediate line 17 and dissolves the gas supplied from the gas supply line 2 in the gas solution supplied from the first gas-liquid separator 8.

Abstract: Provided is a plating apparatus that allows suppressing a substrate sticking to a back plate assembly. A plating apparatus includes a plating tank configured to house a plating solution, a substrate holder configured to hold a substrate Wf with a surface to be plated Wf-a facing downward, and an elevating mechanism configured to move up and down the substrate holder. The substrate holder includes a supporting mechanism 460 configured to support an outer peripheral portion of the surface to be plated Wf-a of the substrate Wf, a back plate assembly 470 arranged on a back surface side of the surface to be plated Wf-a of the substrate Wf and configured to sandwich the substrate Wf with the supporting mechanism 460, and a removing mechanism 471 configured to provide a force that removes the substrate Wf from the back plate assembly 470 to a back surface of the surface to be plated Wf-a of the substrate Wf.

Abstract: A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.

Abstract: A cleaning apparatus performing cleaning treatment for a washing tool used for substrate washing by causing the washing tool to contact with a cleaning member while supplying a washing liquid to the washing tool includes a liquid extraction unit that extracts the washing liquid remaining in the washing tool or the washing liquid flowing out from the washing tool in the cleaning treatment, a color reaction unit that applies an iodine color reaction to the washing liquid extracted by the liquid extraction unit, and a determination unit that detects a coloration degree of the washing liquid subjected to the iodine color reaction and determines whether or not cleaning of the washing tool is completed based on the detected coloration degree.

Abstract: An abrasion detection device is provided, including: one or more sensors, outputting a measurement value in accordance with abrasion of a substrate cleaning tool; a pressing mechanism, pressing the substrate cleaning tool against the sensor; and a determination part, performing a determination on whether it is necessary to replace the substrate cleaning tool in accordance with the measurement value from the sensor.

Abstract: Provided is a technique that ensures suppressed deterioration of plating quality of a substrate due to a process gas that remains on a lower surface of a membrane. A plating apparatus 1000 includes a plating tank 10 and a substrate holder 30. The plating tank includes an anode 11 arranged in an anode chamber 13. The substrate holder is arranged above the anode chamber and configured to hold a substrate Wf as a cathode. The anode has a cylindrical shape extending in a vertical direction. The plating apparatus further includes a gas accumulation portion 60 and a discharge mechanism 70. The gas accumulation portion is disposed in the anode chamber so as to have a space between the anode and the gas accumulation portion. The gas accumulation portion covers an upper end, an outer peripheral surface, and an inner peripheral surface of the anode to accumulate a process gas generated from the anode.

Abstract: A cleaning apparatus for performs a cleaning process on a washing tool for substrate washing by supplying a washing liquid to the washing tool and bringing the washing tool into contact with a cleaning member. The cleaning apparatus includes: a liquid extraction part that extracts a washing liquid remaining inside the washing tool or a washing liquid flowing out from the washing tool during the cleaning process; a fluorescence analysis part that performs fluorescence analysis on the washing liquid extracted by the liquid extraction part and measures a fluorescence intensity of the washing liquid for an excitation light of a predetermined wavelength; and a judgement part that judges, based on the measured fluorescence intensity, whether or not the cleaning of the washing tool has been completed.

Abstract: A electron beam irradiation apparatus 1 includes a helping column determination unit 11 that determines, as a helping column, a column having a main irradiation area that is not included in a target irradiation area to be irradiated with an electron beam from among a plurality of columns 2 when information on the target irradiation area is input, and a helped column determination unit 12 that determines, as a helped column for the determined helping column, a column that is adjacent to the helping column and has a main irradiation area included in the target irradiation area from among the plurality of columns 2. A beam scanner 5 of the helping column performs a helping irradiation control for performing electron beam irradiation in the sub-irradiation area of the helping column, thereby irradiating the target irradiation area of the helped column with an electron beam.

Abstract: There is provided a detection signal processing circuit and a detection signal processing method for an eddy current sensor that are less easily influenced by a change in ambient environment than conventional technologies. A detection signal processing apparatus includes a converter configured to convert a first analog signal output by a detection coil into a first digital signal, a converter configured to convert a second analog signal output by a dummy coil into a second digital signal, and a detector which is a digital signal processing circuit configured to detect the first digital signal and the second digital signal.

Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

Abstract: The present invention constructs, in an AM system, such an environment that fine particles are prevented from scattering from an area where the fine particles such as a powder material can be present to another area. According to one aspect, an AM system configured to manufacture a fabrication object is provided. This AM system includes a fabrication chamber in which an AM apparatus is disposed, and a buffer chamber in communication with the fabrication chamber. The buffer chamber includes an entrance in communication with a surrounding environment, an exit in communication with the fabrication chamber, a grating floor, and an exhaust port. The AM system further includes a first gate configured to be able to open and close the entrance of the buffer chamber, and a second gate configured to be able to open and close the exit of the buffer chamber.