Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member.

Abstract: There is provided a substrate cleaning apparatus capable of highly effective self-cleaning of a cleaning tool in a short time period. The substrate cleaning apparatus includes a cleaning tool for cleaning a substrate while in contact with a surface of the substrate, a self-cleaning member for self-cleaning the cleaning tool while in contact with the cleaning tool, a rotation mechanism for rotating the cleaning tool, and a holding mechanism for holding the cleaning tool, the holding mechanism being capable of pressing the cleaning tool against the substrate and pressing the cleaning tool against the self-cleaning member.

Abstract: A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that perfo

Abstract: The present invention relates a drone system for transporting liquid or gas from a remote area to a demand area. The drone system (100) includes: a transport pipe (10) for flowing the liquid or the gas; a pump device (201) for suppling the liquid or the gas to the transport pipe (10); a top drone (1) for holding a nozzle (11) coupled to a tip end of the transport pipe (10); a plurality of pump drones (6A, 6B), each of which incorporates a pump (40A, 40B); and a power supply unit (3) for suppling a power to the top drone (1) and the pump drones (6A, 6B) through power cables (5). Each of the pump drones (6A, 6B) has a coupling mechanism (35) for tiltably and rotatably coupling the pump (40A, 40B) to a pump drone body (30).

Abstract: The present disclosure provides a substrate processing apparatus and a protective layer forming method that can protect surfaces of metal regions after a polishing process from oxidation and adhesion of cutting chips and particles caused in a process after polishing. The substrate processing apparatus according to the present disclosure includes a polishing device for polishing a semiconductor substrate, a protective layer forming device for forming a protective layer on a surface of the substrate using a silane coupling agent or a resin protective film agent, and a control device. The control device controls the polishing device and the protective layer forming device such that the protective layer forming device forms the protective layer on the substrate after the polishing device finishes polishing the substrate.

Abstract: Polishing uniformity of a surface to be polished of a substrate is improved by appropriately according with a state of the surface to be polished during polishing. A substrate processing apparatus includes a table 100 for supporting a substrate WF, a pad holder 226 for holding a polishing pad 222 for polishing the substrate WF supported by the table 100, an elevating mechanism for elevating the pad holder 226 with respect to the substrate WF, a swing mechanism for swinging the pad holder 226 in a radial direction of the substrate WF, supporting members 300A and 300B for supporting the polishing pad 222 swung to outside the table 100 by the swing mechanism, and driving mechanisms 310 and 320 for adjusting at least one of a height and a distance to the substrate WF of the supporting member 300 while polishing the substrate WF.

Abstract: As an aspect of the present invention, a cleaning apparatus for cleaning member has a holding part holding a cleaning member assembly having a cleaning member; an inner cleaning liquid supply part; an outer cleaning liquid supply part; and a control part controlling the substrate cleaning apparatus to perform a first process in which the cleaning member is pressed against a dummy substrate at a first pressure and the outer cleaning liquid supply part supplies the cleaning liquid to the dummy substrate, and to perform a second process in which the cleaning member is separated from the dummy substrate or is pressed against the dummy substrate at a second pressure which is equal to or less than the first pressure and the inner cleaning liquid supply part supplies the cleaning liquid.

Abstract: The present invention relates to a pump apparatus for delivering a liquid. The pump apparatus includes a pump (1) having an impeller (5), an electric motor (7) for rotating the impeller (5), and an inverter (10) for driving the electric motor (7) at variable speed. The impeller (5) has a non-limit load characteristic in a predetermined discharge flow-rate range (R). The inverter (10) is configured to drive the electric motor (7) at a preset target operating point (TO) with a rotation speed higher than a rotation speed corresponding to a power frequency of a commercial power source.

Abstract: In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.

Abstract: An output of an eddy current sensor includes an impedance component. A film thickness measuring apparatus obtains film thickness information from the impedance component. Using a non-linear function between the film thickness information and the film thickness, the film thickness is obtained from the film thickness information. When a resistance component and a reactance component of the impedance component are associated with respective axes of a coordinate system having two orthogonal coordinate axes, the film thickness information is a reciprocal of a tangent of an impedance angle which is an angle formed by a straight line connecting a point on the coordinate system corresponding to the impedance component and a predetermined reference point, and a predetermined straight line.

Abstract: The impeller (1) includes a main plate (3) formed from a metal plate; and vanes (5) each formed from a metal plate. Each of the vanes (5) has a three-dimensional portion (5A) having a surface inclined with respect to a rotation axis (CA) of the impeller (1) and a two-dimensional portion (5B) having a surface parallel to the rotation axis (CA) of the impeller (1), and the two-dimensional portion (5B) is fixed to the main plate (3) by a first weld (10) formed by projection welding.

Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

Abstract: A metal-supported nonwoven fabric is provided which enables effective synthesis of a target product when used as a catalyst in a flow reaction. The metal-supported nonwoven fabric comprises a nonwoven fabric containing polyolefin fibers or PET fibers, and metal particles. The nonwoven fabric has grafted side chains bound thereto formed of polyvinylpyrrolidone, polyacrylic acid, or a polymer containing functional groups with unshared electron pairs. The metal particles are supported by the grafted side chains via pyrrolidone groups of the polyvinylpyrrolidone, carboxy groups of the polyacrylic acid, or the functional groups with unshared electron pairs.

Abstract: To improve uniformity in polishing of a polished surface of a substrate regardless of a tolerance of a diameter of the substrate. A substrate processing apparatus includes a table 100, a pad holder 226, a swing mechanism, a supporting member 300A, 300B, a measuring instrument 400, and a driving mechanism 320. The table 100 supports a substrate WF. The pad holder 226 holds a polishing pad 222. The polishing pad 222 polishes the substrate WF supported to the table 100. The swing mechanism swings the pad holder 226. The supporting member 300A, 300B supports the polishing pad 222 swung to outside the table 100 by the swing mechanism. The measuring instrument 400 is configured to measure a diameter of the substrate WF. The driving mechanism 320 adjusts a position of the supporting member 300A, 300B with respect to the substrate WF supported to the table 100 according to the diameter of the substrate WF measured by the measuring instrument 400.

Abstract: A substrate cleaning method and a substrate cleaning apparatus are provided. The substrate cleaning method includes a first step of applying a chemical solution to a lower surface of a substrate, and a second step of subsequently applying a bubble-containing liquid to the lower surface of the substrate.

Abstract: In a substrate polishing apparatus where a polishing liquid passes through inside a rotary joint, the rotary joint requires maintenance. There is provided a substrate polishing apparatus that includes: a polishing head for holding a substrate; a rotary table that has a surface to which a first opening portion is provided; a polishing liquid discharge mechanism disposed to the rotary table; and a controller configured to control at least the polishing liquid discharge mechanism. The polishing liquid discharge mechanism includes a first cylinder, a first piston, and a driving mechanism that drives the first piston. The first opening portion is communicated with a liquid holding space defined by the first cylinder and the first piston. The controller controls the driving of the first piston by the driving mechanism to increase and decrease a volume of the liquid holding space.

Abstract: Provided are an alloy powder having excellent environmental resistance even in an environment where corrosion and wear are active simultaneously, and an alloy coating using the powder. A Ni—Fe base alloy powder comprising Cr of 15% by mass or more and 35% by mass or less, Fe of 10% by mass or more and 50% by mass or less, Mo of 0% by mass or more and 5% by mass or less, Si of 0.3% by mass or more and 2% by mass or less, C of 0.3% by mass or more and 0.9% by mass or less, B of 4% by mass or more and 7% by mass or less, and a balance of Ni and incidental impurities.

Abstract: The present invention relates to a sealing system for a pump configured to pressurize a volatile liquid, such as liquid ammonia. The sealing system (2) includes a stuffing box (35) forming a barrier chamber (30) and a pump-side seal chamber (43), a mechanical seal (20) arranged in the barrier chamber (30), and a barrier-gas supply system (32) for supplying a barrier gas into the barrier chamber (30). The barrier gas has a pressure higher than a pressure of the volatile liquid in the pump-side seal chamber (43). The pump-side seal chamber (43) is located between an impeller (7) of the pump (1) and the mechanical seal (20). The barrier-gas supply system (32) includes a pressure control valve (50) configured to maintain a constant difference between pressure in the barrier chamber (30) and pressure in the pump-side seal chamber (43).