Patents Assigned to Ebara Corporation
  • Patent number: 11400561
    Abstract: According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.
    Type: Grant
    Filed: August 2, 2019
    Date of Patent: August 2, 2022
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Kobayashi, Asagi Matsugu, Makoto Kashiwagi, Manao Hoshina
  • Patent number: 11400406
    Abstract: A wet abatement system which can suppress the accumulation of foreign matters in a treatment gas line is proposed. There is provided a wet abatement system for detoxifying treatment gas by bringing the treatment gas into contact with liquid. The wet abatement system includes an inlet casing having an inlet port from which the treatment gas is let in and an outlet port provided below the inlet port and through which the treatment gas flows, and a liquid film forming device provided between the inlet port and the outlet port and configured to form a liquid film on an inner wall surface of the inlet casing. A heater configured to heat the inlet casing is embedded in an interior of a wall portion of the inlet casing, the wall portion constituting a portion situated above the liquid film forming device.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: August 2, 2022
    Assignee: EBARA CORPORATION
    Inventors: Takanori Inada, Kazumasa Hosotani, Kazutomo Miyazaki, Kohei Matsumoto
  • Publication number: 20220234164
    Abstract: It is possible to save labor, energy, and/or cost for a substrate processing apparatus. It is provided with a sensor installed in a substrate processing apparatus and configured to detect a target physical quantity during processing of a target substrate; and a prediction unit configured to output a polishing end point timing, which is timing of ending polishing, by inputting, to a learned machine learning model, time-series data of the physical quantity detected by the sensor or time-series data obtained by differentiating the time-series data of the physical quantity with respect to time, in which the machine learning model is obtained by machine learning using, as a learning data set, past time-series data of the physical quantity or time-series data obtained by differentiating the past time-series data of the physical quantity with respect to time as input and using the past polishing end point timing as output.
    Type: Application
    Filed: May 20, 2020
    Publication date: July 28, 2022
    Applicant: Ebara Corporation
    Inventors: Tsuneo TORIKOSHI, Masahiro HATAKEYAMA, Ryo NAKAGOMI
  • Patent number: 11396876
    Abstract: A control device that controls a target vacuum pump including a motor, including: a decision unit that decides, using at least one of target state quantities at a time of a past stop process of the target vacuum pump or another vacuum pump wherein the target state quantities are state quantities which fluctuate in accordance with a load at a time of a process of stopping a vacuum pump, a normal fluctuation range or a normal time fluctuation behavior of the target state quantity at the time of the stop process; and a control unit that controls the motor, wherein the control unit compares the target state quantity at the time of the process of stopping the target vacuum pump with the normal fluctuation range or the normal time fluctuation behavior, and changes a method of controlling the motor during the stop process depending on the comparison result.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: July 26, 2022
    Assignee: EBARA CORPORATION
    Inventors: Keiji Maishigi, Tetsuro Sugiura, Atsushi Shiokawa
  • Patent number: 11396082
    Abstract: There is provided a device and method for accurately positioning a substrate on a stage by a simple method using power of a movement mechanism provided for a movable stage. A substrate holding device for holding a substrate is provided. The substrate holding device includes a substrate stage for supporting the substrate, a stage drive mechanism for causing the substrate stage to move, positioning pin for positioning the substrate on the substrate stage, first urging members each urging the positioning pin, and a stopper member capable of applying a force against the urging member to the positioning pin. The positioning pin is configured to move together with the substrate stage by the stage drive mechanism. The positioning pin moving together with the substrate stage allows the substrate to be positioned on the substrate stage.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: July 26, 2022
    Assignee: Ebara Corporation
    Inventor: Hiroaki Nishida
  • Patent number: 11396714
    Abstract: To stably convey a substrate (workpiece) while suppressing the workpiece from bending. A treatment device is provided. This treatment device includes: a conveying part that conveys a workpiece in a state where a flat surface of the workpiece is inclined around a conveying directional axis relative to a horizontal plane; and a treatment part in which at least one of polishing and cleaning is performed on the flat surface of the workpiece, wherein the conveying part has a drive part configured to be brought into physical contact with an end part of the workpiece and apply force in a conveying direction to the workpiece, a first Bernoulli chuck arranged to face the flat surface of the workpiece, and a second Bernoulli chuck arranged to face an end face of an opposite end part to the end part of the workpiece.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: July 26, 2022
    Assignee: EBARA CORPORATION
    Inventors: Kenya Ito, Hirohiko Ueda
  • Patent number: 11391940
    Abstract: Provided are various devices, systems and methods for observing pumps and the like. Provided is an industrial endoscope including an imaging device, a flexible holding member configured to hold the imaging device, and one or a plurality of nozzles fixed to the holding member and which injects a fluid.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: July 19, 2022
    Assignee: EBARA CORPORATION
    Inventors: Motohiko Nohmi, Yumiko Sekino
  • Patent number: 11384447
    Abstract: Provided is a substrate holder including a first holding member and a second holding member configured to sandwich and fix a substrate, wherein the first holding member includes a first holding member body, and a clamp provided on the first holding member body, the clamp being rotatable about a shaft extending parallel to a surface of the first holding member body, or being reciprocable in a direction intersecting with the surface of the first holding member body, the second holding member includes a second holding member body, and the clamp is capable of engaging with the second holding member in a state where the first holding member body and the second holding member body are brought into contact with each other, to fix the second holding member to the first holding member.
    Type: Grant
    Filed: September 7, 2017
    Date of Patent: July 12, 2022
    Assignee: EBARA CORPORATION
    Inventors: Matsutaro Miyamoto, Yoshitaka Mukaiyama
  • Patent number: 11382412
    Abstract: A PVA brush cleaning method includes immersing a PVA brush in a cleaning solution containing an organic matter, thereby removing a siloxane compound in the PVA brush; and applying vibration to the PVA brush, thereby removing impurities in the PVA brush.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: July 12, 2022
    Assignees: EBARA CORPORATION, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG
    Inventors: Jin-Goo Park, Jung Hwan Lee, Satomi Hamada
  • Patent number: 11383345
    Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: July 12, 2022
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Keisuke Kamiki, Shuji Uozumi
  • Patent number: 11385125
    Abstract: A leak check method includes: performing a first inspection of measuring a pressure in an internal space formed by a seal of the substrate holder, while evacuating the internal space, and detecting that the pressure reaches a first pressure threshold value within a predetermined first inspection time; performing a second inspection of closing the internal space that has been evacuated, measuring the pressure in the closed internal space, and detecting that the pressure in the closed internal space does not exceed a second pressure threshold value within a predetermined second inspection time; and performing a third inspection of measuring a pressure difference between the pressure in the closed internal space and a vacuum pressure in a master container, and detecting that an amount of increase in the pressure difference within a predetermined third inspection time is kept equal to or below a pressure difference threshold value.
    Type: Grant
    Filed: December 12, 2019
    Date of Patent: July 12, 2022
    Assignee: EBARA CORPORATION
    Inventors: Kiyoshi Suzuki, Jumpei Fujikata
  • Patent number: 11380559
    Abstract: An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: July 5, 2022
    Assignees: EBARA CORPORATION, HIRATA CORPORATION
    Inventors: Yohei Eto, Junji Kunisawa, Teruaki Hombo, Keiji Kanazawa
  • Patent number: 11378084
    Abstract: A turbo pump acts on a liquid, and an apparatus and a method suppresses or alleviates a cavitation surge which is a unique phenomenon occurring in a turbo pump for a liquid. A method of operating a turbo pump while suppressing cavitation, includes: measuring a flow rate upstream of the turbo pump and a flow rate downstream of the turbo pump for delivering a liquid and comparing the flow rates with each other; if the upstream flow rate is lower than the downstream flow rate, reducing a pressure in a pump suction section to increase an upstream flow velocity while reducing a pressure in a pump discharge section to lower a downstream flow velocity; and if the downstream flow rate is lower than the upstream flow rate, increasing the pressure in the pump discharge section to increase the downstream flow velocity while increasing the pressure in the pump suction section.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: July 5, 2022
    Assignee: EBARA CORPORATION
    Inventor: Motohiko Nohmi
  • Patent number: 11376704
    Abstract: To specify a trajectory of an eddy current sensor provided on a polishing table of a substrate polishing apparatus, disclosed is a method of identifying a trajectory of an eddy current sensor as seen from a substrate in a substrate polishing apparatus having a polishing table and a polishing head. The method includes: obtaining a sensor output map as three-dimensional data; polishing the substrate; obtaining a profile of the real-time polishing signal as two-dimensional data; and extracting a trajectory having a profile most similar to the profile of the real-time polishing signal as two-dimensional data from the sensor output map as three-dimensional data and identifying the extracted trajectory as a trajectory of the eddy current sensor as seen from the substrate.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: July 5, 2022
    Assignee: EBARA CORPORATION
    Inventor: Akira Nakamura
  • Patent number: 11380561
    Abstract: A cleaning device is described. In one embodiment, the cleaning device includes a cleaning member; a moving portion, a measurement portion, and a controller. The controller performs a reset operation in which the cleaning member is pressed against the reference member before cleaning, a cleaning member is moved in a direction away from the reference member after the measured value of the measurement portion reaches a predetermined reset load, when the measurement values of the measurement portion for each unit movement amount of the cleaning member become equal to each other at least twice consecutively, a position of the cleaning member at the time is set as a reference position of the cleaning member at the time of cleaning, and the measurement value of the measurement portion at the time is set as a pressing reference value at the time of cleaning.
    Type: Grant
    Filed: May 2, 2018
    Date of Patent: July 5, 2022
    Assignee: EBARA CORPORATION
    Inventors: Hidetatsu Isokawa, Mitsuhiko Inaba, Haiyang Xu
  • Patent number: 11370080
    Abstract: To reduce a risk generated at a time of collision of a substrate with a retainer. According to one embodiment, a head for holding a polygonal substrate as a polishing object of a polishing apparatus is provided. The head includes a substrate holding surface configured to hold a substrate and a retainer positioned outside the substrate holding surface. The retainer has an end region. The end region is arranged adjacent to a corner portion of the substrate held onto the head. The end region has an end surface on a side of the substrate holding surface. The end surface is configured to increase in distance from the substrate holding surface with approaching an end portion in a longitudinal direction of the retainer.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: June 28, 2022
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Kobayashi, Makoto Kashiwagi
  • Patent number: 11371155
    Abstract: A method which can perform a soft pre-wetting treatment of a substrate, such as a wafer, with use of a pre-wetting liquid in a smaller amount. This method includes: holding a substrate between a first holding member and a second holding member, with the surface of the substrate being exposed through an opening of the second holding member, and pressing a sealing ridge of the substrate holder against a peripheral portion of the substrate; pressing a sealing block against the substrate holder; forming a vacuum in an external space; performing a seal inspection to check a sealed state provided by the sealing ridge based on a change in pressure in the external space; and performing a pre-wetting treatment by supplying a pre-wetting liquid to the external space while evacuating air from the external space to bring the pre-wetting liquid into contact with the exposed surface of the substrate.
    Type: Grant
    Filed: November 12, 2019
    Date of Patent: June 28, 2022
    Assignee: EBARA CORPORATION
    Inventors: Takahisa Okuzono, Jumpei Fujikata
  • Patent number: 11373894
    Abstract: A substrate processing apparatus which can remove foreign matters attached to the entire upper surface of a substrate such as a wafer is disclosed. The substrate processing apparatus includes: a substrate holding apparatus; and a processing head configured to scrub an upper surface of a substrate. The substrate holding apparatus includes: a substrate holder configured to hold the substrate; and a substrate rotating mechanism configured to rotate the substrate held by the substrate holder. The substrate holder is disposed below the upper surface of the substrate so as not to project above the upper surface of the substrate in a state where the substrate is held by the substrate holder.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: June 28, 2022
    Assignee: EBARA CORPORATION
    Inventors: Kenichi Kobayashi, Tetsuji Togawa
  • Patent number: 11367629
    Abstract: A cleaning apparatus for cleaning a cleaning tool that scrub-cleans a substrate includes a cleaning body. The cleaning body includes a contact portion configured to come into contact with the cleaning tool, and the contact portion includes a suction area configured to remove foreign matter from the cleaning tool.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: June 21, 2022
    Assignee: EBARA CORPORATION
    Inventor: Hideaki Tanaka
  • Patent number: 11358253
    Abstract: A cleaning liquid supply device for supplying a cleaning device with cleaning liquid includes a chemical liquid inlet portion and a dilution water inlet portion, a first chemical liquid control unit fluidically connected to the chemical liquid inlet portion and the dilution water inlet portion, and a second chemical liquid control unit fluidically connected to the chemical liquid inlet portion and the dilution water inlet portion. The first chemical liquid control unit includes a first chemical-liquid-flow-rate control unit, a first dilution-water-flow-rate control unit, and a first mixing portion. The second chemical liquid control unit includes a second chemical-liquid-flow-rate control unit, a second dilution-water-flow-rate control unit, and a second mixing portion.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: June 14, 2022
    Assignee: EBARA CORPORATION
    Inventors: Haiyang Xu, Fujihiko Toyomasu