Patents Assigned to Ebara Corporation
  • Publication number: 20190143479
    Abstract: There is provided a device and method for accurately positioning a substrate on a stage by a simple method using power of a movement mechanism provided for a movable stage. A substrate holding device for holding a substrate is provided. The substrate holding device includes a substrate stage for supporting the substrate, a stage drive mechanism for causing the substrate stage to move, positioning pin for positioning the substrate on the substrate stage, first urging members each urging the positioning pin, and a stopper member capable of applying a force against the urging member to the positioning pin. The positioning pin is configured to move together with the substrate stage by the stage drive mechanism. The positioning pin moving together with the substrate stage allows the substrate to be positioned on the substrate stage.
    Type: Application
    Filed: November 12, 2018
    Publication date: May 16, 2019
    Applicant: Ebara Corporation
    Inventor: Hiroaki NISHIDA
  • Publication number: 20190134599
    Abstract: The present invention provides a composition that includes a silicotitanate that has a sitinakite structure, the composition having higher cesium adsorptivity than conventional compositions. The present invention also provides a production method for the composition that includes a silicotitanate that has a sitinakite structure. The production method does not require the use of hazardous or deleterious materials, can generate a product using a compound that is easily acquired, and can use a general-purpose autoclave. Also provided is a silicotitanate composition that has higher strontium adsorptivity than the present invention. Provided is a silicotitanate composition that contains niobium and a silicotitanate that has a sitinakite structure, the composition having at least two or more diffraction peaks selected from the group consisting of 2?=8.8°±0.5°, 2?=10.0°±0.5°, and 2?=29.6°±0.5°.
    Type: Application
    Filed: January 3, 2019
    Publication date: May 9, 2019
    Applicants: TOSOH CORPORATION, EBARA CORPORATION
    Inventors: Yoju SHIMIZU, Hajime FUNAKOSHI, Keisuke TOKUNAGA, Shigeru HIRANO, Takashi SAKUMA, Makoto KOMATSU, Takeshi IZUMI
  • Patent number: 10273594
    Abstract: Provided is a plating apparatus for plating a substrate by using a substrate holder including an elastic projection that seals a to-be-plated surface of the substrate, the plating apparatus comprising a measurement device configured to measure a deformed state of the elastic projection by measuring at least either one of a compression amount of the elastic projection and load applied to the elastic projection at a time when the substrate physically contacts the elastic projection of the substrate holder; and a controlling device configured to make a judgment on the basis of the measured deformed state as to whether sealing by the elastic projection is normal.
    Type: Grant
    Filed: June 2, 2017
    Date of Patent: April 30, 2019
    Assignee: EBARA CORPORATION
    Inventor: Jumpei Fujikata
  • Patent number: 10259098
    Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: April 16, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Hisanori Matsuo
  • Publication number: 20190105689
    Abstract: Provided is a substrate cleaning method capable of maintaining a substrate and a cleaning tank in a clean condition after cleaning. In this method, a substrate holder holding the substrate is immersed in a rinsing liquid in the cleaning tank. While a flow of a cleaning liquid is formed on the substrate, the substrate holder and an inner surface of the cleaning tank, the rinsing liquid is discharged from the cleaning tank. While the flow of the cleaning liquid is formed on the substrate, the substrate holder and the inner surface of the cleaning tank, the rinsing liquid is supplied into the cleaning tank, and the substrate holder is immersed in the rinsing liquid. The substrate holder is pulled up from the rinsing liquid.
    Type: Application
    Filed: October 5, 2018
    Publication date: April 11, 2019
    Applicant: EBARA CORPORATION
    Inventors: Makoto KUBOTA, Taiki ISHITSUKA
  • Patent number: 10256104
    Abstract: The present invention relates to a film-thickness measuring method for detecting a film thickness by analyzing optical information contained in a reflected light from a substrate. The film-thickness measuring method includes producing a spectral waveform indicating a relationship between intensity and wavelength of reflected light from a substrate; performing Fourier transform processing on the spectral waveform to determine strengths of frequency components and corresponding film thicknesses; determining local maximum values (M1, M2) of the strengths of the frequency components; and selecting, according to a preset selection rule, one film thickness from film thicknesses (t1, t2) corresponding respectively to the local maximum values (M1, M2). The selection rule is either to select an N-th largest film thickness or to select an N-th smallest film thickness, and N is a predetermined natural number.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: April 9, 2019
    Assignee: EBARA CORPORATION
    Inventor: Toshifumi Kimba
  • Patent number: 10240247
    Abstract: To provide an anode holder and a plating apparatus including the same, the anode holder being configured to prevent additives and black films from spreading by moving between an internal space in which an anode is provided and an external space. An anode holder 60 according to the present invention includes: an internal space 61 that houses an anode therein; a diaphragm configured so as to cover a front face of the internal space 61; a hole 71 that is formed on an external surface of the anode holder and which communicates with the internal space 61; and a valve 91 that seals the hole 71 shut.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: March 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Mitsutoshi Yahagi, Masaaki Kimura, Junichiro Tsujino
  • Patent number: 10232315
    Abstract: A seawater desalination system for desalinating seawater by removing salinity from the seawater and an energy recovery apparatus which is preferably used in the seawater desalination system. The energy recovery apparatus includes a cylindrical chamber being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port for supplying and discharging the concentrated seawater, a seawater port for supplying and discharging the seawater, a flow resistor provided at a concentrated seawater port side in the chamber, and a flow resistor provided at a seawater port side in the chamber. Each of the flow resistor provided at the concentrated seawater port side and the seawater port side comprises at least one perforated circular plate, and each perforated circular plate has a plurality of holes formed in an outer circumferential area outside a circle having a predetermined diameter on the perforated circular plate.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: March 19, 2019
    Assignee: EBARA CORPORATION
    Inventors: Akira Goto, Tamami Takahashi, Motohiko Nohmi, Masanori Goto
  • Patent number: 10229841
    Abstract: A wafer drying apparatus capable of preventing formation of a watermark is disclosed. The wafer drying apparatus includes: a conveying mechanism configured to convey a wafer in a drying chamber; an inert-gas jet nozzle disposed above the conveying mechanism and configured to form a descending jet of an inert gas; and a liquid suction nozzle disposed upstream of the inert-gas jet nozzle with respect to a conveying direction of the wafer. A distance between the liquid suction nozzle and a surface of the wafer when the wafer is being conveyed by the conveying mechanism is in a range of 1 mm to 2 mm.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: March 12, 2019
    Assignee: EBARA CORPORATION
    Inventors: Masayoshi Imai, Satomi Hamada
  • Patent number: 10227926
    Abstract: An exhaust gas abatement system includes an exhaust gas abatement section configured to abate exhaust gases by utilizing thermal energy and to cool the abated gases by using a liquid, a circulating section configured to circulate the liquid within a circulation path as a circulating liquid, a heat exchange tube configured to cool the circulating liquid and to executes a heat exchange between a cooling liquid which flows in an interior of the heat exchange tube and the circulating liquid which flows outside the heat exchange tube, and a circulating liquid storage portion configured to store the circulating liquid. The heat exchange tube is disposed in a heat exchange tube installation space which is in at least part of an interior of the circulating liquid storage portion.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: March 12, 2019
    Assignee: EBARA CORPORATION
    Inventors: Kazumasa Hosotani, Makoto Kashiwagi, Toyoji Shinohara, Kohtaro Kawamura
  • Publication number: 20190060864
    Abstract: The present invention provides a treatment method of a radioactive iodine-containing fluid, comprising passing the radioactive iodine-containing fluid through an adsorbent for iodine consisting of a silver-containing binderless zeolite molded body having a silver content of 50 mass % or less, to adsorb the radioactive iodine on the adsorbent for iodine.
    Type: Application
    Filed: February 23, 2017
    Publication date: February 28, 2019
    Applicants: Ebara Corporation, Tosoh Corporation
    Inventors: Takashi SAKUMA, Makoto KOMATSU, Takeshi IZUMI, Keisuke TOKUNAGA, Shigeru HIRANO
  • Patent number: 10213896
    Abstract: An elastic membrane capable of precisely controlling a polishing profile in a narrow area of a wafer edge portion is disclosed. The elastic membrane includes a contact portion to be brought into contact with a substrate; a first edge circumferential wall extending upwardly from a peripheral edge of the contact portion; and a second edge circumferential wall having a horizontal portion connected to an inner circumferential surface of the first edge circumferential wall. The inner circumferential surface of the first edge circumferential wall includes an upper inner circumferential surface and a lower inner circumferential surface, both of which are perpendicular to the contact portion. The upper inner circumferential surface extends upwardly from the horizontal portion of the second edge circumferential wall, and the lower inner circumferential surface extends downwardly from the horizontal portion.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Makoto Fukushima, Hozumi Yasuda, Keisuke Namiki, Osamu Nabeya, Shingo Togashi, Satoru Yamaki, Shintaro Isono
  • Patent number: 10215407
    Abstract: A hybrid stepping motor has a connector housing formed integrally with an insulator having an upper insulator and a lower insulator. The hybrid stepping motor includes a stator core and output terminals concentrically disposed outside the stator core. A wiring pattern serving as the output terminals has connector pins and land portions disposed eccentrically with respect to one another. The land portions are formed on an outer edge side of the wiring pattern. A surface, which is an uppermost surface of the wiring pattern, is located below a lowermost surface, in which jumper wires and lead wires pass, of the lower insulator. The lead wires are pulled out from a lower side, and are pulled out to guiding grooves.
    Type: Grant
    Filed: November 6, 2015
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Kazutomo Miyazaki, Tetsuo Komai, Toyoji Shinohara, Seiji Kashiwagi
  • Patent number: 10214830
    Abstract: A substrate holder for holding a substrate, such as a wafer, is disclosed. The substrate holder includes a seal ring which can be brought into contact with a peripheral portion of the substrate, a support ring supporting the seal ring, and a fixing ring pressing the seal ring against the support ring. The fixing ring includes an annular portion having an inner circumferential surface and an outer circumferential surface, each of which is constituted by a tapered surface. The fixing ring further includes a seal-ring pressing portion connected to the annular portion, and a regulation ring projecting radially inwardly from the seal-ring pressing portion. The regulation ring has an inside diameter which is smaller than an inside diameter of the seal ring.
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: February 26, 2019
    Assignee: EBARA CORPORATION
    Inventors: Mitsutoshi Yahagi, Masaaki Kimura, Yusuke Tamari
  • Publication number: 20190054594
    Abstract: A method and an apparatus which can efficiently polish an entirety of a back surface, including an outermost area thereof, of a substrate while the back surface of the substrate faces downward are disclosed. The method includes rotating a substrate by rotating a plurality of rollers about their respective own axes while the rollers contact a periphery of the substrate with a back surface of the substrate facing downward; and polishing an entirety of the back surface of the substrate by moving a polishing tool relative to the substrate while supplying a liquid onto the back surface of the substrate and while placing the polishing tool in contact with the back surface of the substrate, the polishing tool being located at a lower side of the substrate.
    Type: Application
    Filed: June 8, 2018
    Publication date: February 21, 2019
    Applicant: Ebara Corporation
    Inventors: Masayuki NAKANISHI, Yu ISHII, Kenya ITO, Keisuke UCHIYAMA, Makoto KASHIWAGI
  • Publication number: 20190054589
    Abstract: The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape. The polishing apparatus includes a substrate holder (1) configured to hold and rotate a substrate (W), and a polishing unit (7) configured to polish an edge portion of the substrate (W) with use of a polishing tape (5). The polishing unit (7) includes: a disk head (12) having a circumferential surface for supporting the polishing tape (5); and a head moving device (50) configured to move the disk head (12) in a tangential direction of the substrate (W) and to bring the polishing tape (5) on the circumferential surface of the disk head (12) into contact with the edge portion of the substrate (W).
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Applicant: Ebara Corporation
    Inventors: Masaya SEKI, Manao HOSHINA
  • Patent number: 10207224
    Abstract: An energy recovery apparatus which is used in a seawater desalination system includes a cylindrical chamber (CH) being installed such that a longitudinal direction of the chamber is placed in a vertical direction, a concentrated seawater port (P1) for supplying and discharging the concentrated seawater, a seawater port (P2) for supplying and discharging the seawater, a flow resistor (23) provided at a concentrated seawater port (P1) side in the chamber (CH), and a flow resistor (23) provided at a seawater port (P2) side in the chamber (CH). The flow resistor (23) provided at the concentrated seawater port (P1) side and the flow resistor (23) provided at the seawater port (P2) side comprise at least one perforated circular plate, and the perforated circular plate has holes formed at an outer circumferential area outside a predetermined diameter of the circular plate.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: February 19, 2019
    Assignee: EBARA CORPORATION
    Inventors: Tamami Takahashi, Masanori Goto, Akira Goto, Motohiko Nohmi, Kazuya Hirata
  • Patent number: D845568
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: April 9, 2019
    Assignee: EBARA CORPORATION
    Inventors: Yu Ishii, Kenya Ito, Hirohiko Ueda
  • Patent number: D845907
    Type: Grant
    Filed: October 19, 2017
    Date of Patent: April 16, 2019
    Assignee: EBARA CORPORATION
    Inventor: Kiyoshi Suzuki
  • Patent number: D847762
    Type: Grant
    Filed: May 15, 2018
    Date of Patent: May 7, 2019
    Assignee: EBARA CORPORATION
    Inventor: Matsutaro Miyamoto