Abstract: The present invention relates to a high-voltage submersible motor and a waterproof connector for use in the submersible motor. The submersible motor includes a motor body (36), a power cable (37a), a cable contact (50) electrically connected to the power cable (37a), a cable-side insulating member (49) to which the cable contact (50) is liquid-tightly coupled, a motor contact (42) connected to the cable contact (50), a motor-side insulating member (41) to which the motor contact (42) is liquid-tightly coupled, and an insulating resin (93) that fills an enclosed space (60) formed between the cable-side insulating member (49) and the motor-side insulating member (41). A connecting portion of the cable contact (50) and the motor contact (42) is covered with the resin (93).
Abstract: In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.
Abstract: A substrate processing apparatus is provided with a polishing part that polishes a substrate, a transporting part that transports a substrate before polishing to the polishing part, and a cleaning part that cleans the polished substrate. The cleaning part has a first cleaning unit and a second cleaning unit that are vertically arranged in two stages. The first cleaning unit and the second cleaning unit each have a plurality of cleaning modules that are arranged in series. The transporting part has a slide stage that is disposed between the first cleaning unit and the second cleaning unit, and transports a substrate before polishing along an arrangement direction of the plurality of cleaning modules.
Abstract: A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.
Abstract: A method of monitoring dressing of a polishing pad is provided. The method includes: rotating a polishing table that supports the polishing pad; dressing the polishing pad by pressing a dresser against the polishing pad while causing the dresser to oscillate in a radial direction of the polishing pad; calculating a work coefficient representing a ratio of a frictional force between the dresser and the polishing pad to a force of pressing the dresser against the polishing pad; and monitoring dressing of the polishing pad based on the work coefficient.
Abstract: A resistance measuring module for measuring electric resistance of a substrate holder is provided. The substrate holder has an electric contact configured to feed a current to a held substrate and contactable with the substrate. The substrate holder is able to hold a testing substrate for measurement of electric resistance of the substrate holder, and is configured such that the electric contact comes into contact with the testing substrate in a state where the testing substrate is held. The resistance measuring module includes: a test probe contactable with the testing substrate held in the substrate holder; and a resistance measuring instrument for measurement of a resistance value between the electric contact and the probe via the testing substrate.
Abstract: Various examples, relating to motor attachment, a motor attachment structure, substrate processing apparatus are disclosed. The present disclosure exemplifies a motor attachment bracket including a plate-shaped motor mounting portion which an output shaft insertion hole through which an output shaft of a motor is inserted penetrates, and to which the motor the output shaft of which is inserted through the output shaft insertion hole is fixed. A fluid path in which a cooling fluid is circulated is formed in a metal member formed with the motor mounting portion, a motor attachment structure using the motor attachment bracket, and a substrate processing apparatus.
Abstract: One object is to provide a polishing machine and a polishing method capable of improving a processing accuracy on the surface of an object. A method of polishing an object is provided. Such a method comprises a first step of polishing an object by moving the object and a first polishing pad having a smaller dimension than that of the object relative to each other while the first polishing pad is made to contact the object, a second step of polishing the object, after the first step of polishing, by moving the object and a second polishing pad having a larger dimension than that of the object relative to each other while the second polishing pad is made to contact the object, and a step of detecting the state of the surface of the object before the first step of polishing.
Abstract: The present invention relates to an impeller assembly for centrifugal pumps, comprising a first disk-like element, operatively arranged towards a coaxial inlet, facing a second disk-like element with a smaller diameter, operatively arranged towards the outlet; this second disk-like element is rigidly connected to the first disk-like element through a set of angularly spaced blades, and is centrally provided with fastening means for fastening to a drive shaft. The distinctive feature of the present invention is that the blades comprise appendices, in flat sheet form, adjacent to the second disk-like element, which are essentially located in correspondence with areas subject to lesser axial thrust.
April 27, 2016
Date of Patent:
June 2, 2020
Renato Groppo, Mariano Matteazzi, Dai Sakihama, Fabio Balbo
Abstract: Soluble copper oxide powder capable of preventing a decrease in quality of a copper film formed by plating is disclosed. The copper oxide powder contains copper and impurities including sodium. A concentration of the sodium is not more than 20 ppm. The copper oxide powder is regularly supplied into a plating solution. A voltage is applied between an insoluble anode and a substrate immersed in the plating solution, thereby plating the substrate.
January 30, 2020
May 28, 2020
MASASHI SHIMOYAMA, JUMPEI FUJIKATA, FUMITOSHI NISHIURA, TAKASHI KISHI
Abstract: A substrate cleaning apparatus capable of removing fine particles from a substrate, such as a wafer, without using a chemical liquid is disclosed. The substrate cleaning apparatus includes: a substrate supporting structure for supporting the substrate; a vibration device secured to the substrate supporting structure; a vibration controller configured to cause the vibration device to vibrate at a natural frequency of the substrate; and a cleaning liquid supply nozzle configured to supply a cleaning liquid onto the substrate.
Abstract: A polishing apparatus capable of accurately measuring a film thickness by regulating a quantity of light illuminating a wafer is disclosed. The polishing apparatus includes: a light source; an illuminating fiber having distal ends arranged at different locations in the polishing table; and a light-receiving fiber having distal ends arranged at the different locations in the polishing table. The illuminating fiber includes a first illuminating fiber and a second illuminating fiber. A first dimmer is attached to the first illuminating fiber and the second illuminating fiber, and a second dimmer is attached to at least one of the first illuminating fiber and the second illuminating fiber.
Abstract: A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.
Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.
Abstract: There is disclosed a polishing-surface cleaning apparatus to which a polishing liquid, such as slurry, is less likely to be attached. The polishing-surface cleaning apparatus includes an arm having a fluid passage, a nozzle communicating with the fluid passage, and a weld material securing the nozzle to the arm. The weld material fills a gap between a bottom surface of the arm and an edge of a front-end surface of the nozzle.
Abstract: A substrate holder capable of being used in both single-side plating and double-side plating is required. Disclosed is a substrate holder for holding a substrate to be plated. The substrate holder includes a first frame having a first opening for exposing one surface of the substrate and a second frame having a second opening for exposing the other surface of the substrate, and the substrate is sandwiched between the first frame and the second frame. The substrate holder further includes a dummy substrate which is detachably disposed between the first frame and the substrate and formed of a material that at least direct current does not substantially flow therein. At least a part of the dummy substrate is in contact with at least a part of the one surface of the substrate, and the dummy substrate protects the one surface of the substrate from a plating solution.
Abstract: A method for holding a substrate on the substrate holder is provided, and in this method, the substrate holder includes a front frame, a rear frame, a clamper for clamping the front frame and the rear frame; and seals configured to come into contact with the substrate and one of the front frame and the rear frame when the front frame and the rear frame are clamped. The method includes pressing at least one of the front frame and the rear frame toward another one to press the seals against the substrate, and compressing the seals; and clamping the front frame and the rear frame by the clamper in a state that the seals are compressed. During the seals being compressed, a place where a force is applied to at least one of the front frame and the rear frame is a position closer to the clamper than the seals.
Abstract: Provided is a supply-liquid producing apparatus capable of producing a supply liquid by an amount needed at a use point. A supply-liquid producing apparatus includes a mixer that mixes water and ozone gas to produce ozone water; a booster pump that increases the pressure of the water supplied to the mixer; a gas-liquid separation tank that separates the ozone water produced by the mixer into ozone water to be supplied to a use point and exhaust gas to be discharged from an exhaust port; a flowmeter that measures the flow rate of the ozone water supplied from the gas-liquid separation tank to the use point; a flow control unit that adjusts the (flow rate of the water supplied to the mixer by controlling the booster pump in response to the flow rate of the ozone water measured by the flowmeter; and an exhaust pressure control unit that controls the exhaust pressure to keep constant the water level in the gas-liquid separation tank.
Abstract: A shaft seal device is fixed to a container that separates a high-pressure fluid and a low-pressure fluid from each other, and seals a shaft-penetrated portion of the container through which a rotational shaft extends. This shaft seal device includes: a seal casing having a through-hole through which the rotational shaft extends, the seal casing having a seal chamber which communicates with the through-hole and into which the high-pressure fluid flows; and a disk-shaped seal body which is housed in the seal chamber, the seal body being rotatable together with the rotational shaft and having an annular surface perpendicular to an axis of the rotational shaft. An inner surface of the seal casing, which faces the annular surface of the seal body and defines the seal chamber, is a flat surface perpendicular to the axis of the rotational shaft.