Abstract: A substrate processing apparatus includes a first processing unit and a second processing unit placed in upper and lower two stages. Each processing unit has: a plurality of processing tanks arranged in series; a partition wall defining a conveyance space extending along an arrangement direction outside the plurality of processing tanks; a conveyance mechanism placed in the conveyance space and being configured to convey a substrate between the processing tanks along the arrangement direction; and an air guide duct provided to extend along the arrangement direction in the conveyance space. The air guide duct is connected with a fan filter unit. Each of the processing tanks is connected with an exhaust duct. An opening is formed in each of parts facing the processing tank in the air guide duct. The conveyance spaces of the first and second processing units are separated into upper and lower segments by the partition wall.

Abstract: In a plating apparatus, a short circuit of a wiring between a rectifier and a plating device is detected without using a substrate in vain. In the plating apparatus that supplies a current from the rectifier to the substrate to plate the substrate, a short circuit detection method includes a step of outputting a current with a predetermined current value from the rectifier, in a state where the substrate and a substrate holder holding the substrate are not electrically connected to the rectifier, a step of acquiring an output voltage value of the rectifier, a step of comparing the output voltage value with a predetermined reference voltage value, and a step of determining that a short circuit occurs in a circuit for connecting the rectifier and the substrate, in a case where the output voltage value is lower than the reference voltage value.

Abstract: A resin molded rotor includes a rotor, a main shaft, and a resin mold. The rotor is configured to hold a magnet. The main shaft is provided with the rotor mounted thereto and is configured to transmit power to the outside. The resin mold is configured to integrally cover the rotor and part of the main shaft on respective sides in an axial direction of the rotor. An O-ring is placed between the resin mold and the main shaft to seal between the resin mold and the main shaft.

Abstract: A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

Abstract: As an aspect of the present invention, a cleaning apparatus for cleaning member has a holding part holding a cleaning member assembly having a cleaning member; an inner cleaning liquid supply part; an outer cleaning liquid supply part; and a control part controlling the substrate cleaning apparatus to perform a first process in which the cleaning member is pressed against a dummy substrate at a first pressure and the outer cleaning liquid supply part supplies the cleaning liquid to the dummy substrate, and to perform a second process in which the cleaning member is separated from the dummy substrate or is pressed against the dummy substrate at a second pressure which is equal to or less than the first pressure and the inner cleaning liquid supply part supplies the cleaning liquid.

Abstract: Provided is a technique that allows suppressing a liquid splash of a plating solution. A plating apparatus includes a plating tank 10 including an inner tank 11, a substrate holder, and a paddle 50 configured to agitate the plating solution accumulated in the inner tank 11 by reciprocating in a horizontal direction. The paddle 50 is arranged to be inserted through a hole provided in an outer peripheral wall of the inner tank and to build a bridge between an inside of the inner tank and an outside of the inner tank, and the paddle 50 includes a first portion 51 configured to agitate the plating solution accumulated in the inner tank, a second portion 53 arranged outside the inner tank and disposed above the first portion, and a connecting portion 52 arranged outside the inner tank to connect the first portion to the second portion.

Abstract: A sensor target cover capable of preventing an optical liquid level detection sensor from erroneously detecting a rise in a liquid level is provided. A sensor target cover is used in combination with an optical liquid level detection sensor. The sensor target cover includes a reflecting plate, an inner wall structure surrounding the reflecting plate, and an outer wall structure surrounding the inner wall structure. A gap is formed between the inner wall structure and the outer wall structure.

Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.

Abstract: A polishing apparatus capable of increasing an added value is disclosed. The polishing apparatus includes a polishing table configured to support a polishing pad, a top ring configured to press a substrate against the polishing pad, and a liquid supply mechanism configured to supply a liquid onto the polishing pad. The liquid supply mechanism includes a nozzle arm configured to be movable in a radial direction of the polishing table, and a liquid ejection nozzle attached to the nozzle arm. The liquid ejection nozzle is a fan-shaped nozzle having a liquid throttle surface having a tapered shape.

Abstract: The present invention relates to a pump apparatus for delivering a liquid. The pump apparatus includes a pump (1) having an impeller (5), an electric motor (7) for rotating the impeller (5), and an inverter (10) for driving the electric motor (7) at variable speed. The impeller (5) has a non-limit load characteristic in a predetermined discharge flow-rate range (R). The inverter (10) is configured to drive the electric motor (7) at a preset target operating point (TO) with a rotation speed higher than a rotation speed corresponding to a power frequency of a commercial power source.

Abstract: A cleaning method capable of removing abrasive grains adhering to a light passage provided in a polishing table is disclosed. The cleaning method includes: while supplying slurry containing abrasive grains onto a polishing pad supported by a polishing table, placing a substrate in sliding contact with the polishing pad to polish the substrate; during polishing of the substrate, directing light to the substrate through a light passage provided in the polishing table, and causing reflected light from the substrate to pass through the light passage; removing the polished substrate from the polishing pad; and supplying a chemical liquid into the light passage when the substrate is not present on the polishing pad to remove the abrasive grains adhering to the light passage by the chemical liquid.

Abstract: A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248.

Abstract: A substrate holding and rotation mechanism includes: a substrate holding roller that holds a peripheral portion of the substrate and rotates the substrate, the substrate holding roller including, a lower portion of the roller facing the lower surface of the peripheral portion of the substrate, an upper portion of the roller facing the upper surface of the peripheral portion of the substrate, and a clamping groove which is provided between the lower portion of the roller and the upper portion of the roller and into which the peripheral portion of the substrate is inserted; and a roller washing nozzle that injects a fluid from diagonally above the substrate holding roller to an area including the clamp groove and an upper surface of the upper portion of the roller.

Abstract: To measure thickness in a polishing treatment more efficiently. A substrate polishing apparatus comprises a rotatably configured polishing table provided with a sensor that outputs a signal related to a thickness, a rotatably configured polishing head that faces the polishing table, a substrate being attachable to a face of the polishing head that faces the polishing table, and a controller. The controller acquires a signal from the sensor when the sensor passes over a surface to be polished of the substrate, specifies an orbit of the sensor with respect to the substrate on a basis of a profile of the signal, calculates a thickness of the substrate at each point on the orbit on a basis of the signal, and creates a thickness map on a basis of the calculated thickness at each point on a plurality of orbits of the sensor.

Abstract: A substrate washing device includes a roll washing member, a single tube nozzle and spray nozzle. The roll washing member linearly extends over the entire length of the diameter of the substrate and comes into slide-contact with the surface of the substrate. The single tube nozzle discharges washing liquid onto a roll winding side of the roll washing member so that the first washing liquid lands in the front center of the substrate. The spray nozzle sprays a second washing liquid in a fan shape toward a second area when the roll winding side area is divided into two areas.

Abstract: A method for estimating a life of a polishing pad includes: polishing a workpiece by pressing the workpiece against a polishing surface of a polishing pad with an elastic membrane forming a pressure chamber provided in a polishing head; controlling a pressure in the pressure chamber on the basis of a measured value of a film thickness of the workpiece while measuring the film thickness during the polishing of the workpiece; inputting time-series pressure data representing a change in the pressure in the pressure chamber during the polishing of the workpiece into a learned model; and outputting a life index of the polishing pad from the learned model.

Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.

Abstract: According to one embodiment of the present disclosure, provided is a substrate cleaning method that performs an operation, in a state where a cleaning member is in contact with a rotating substrate, the cleaning member is moved between a first position on the substrate and a second position close to an edge of the substrate, n times (n is an integer of 2 or more), wherein a controller, which controls a driver that moves the cleaning member, controls the driver to perform an edge cleaning step to perform cleaning of the substrate in a state where the cleaning member is in contact with the second position on the substrate for a predetermined period of time after the cleaning member reaches the second position at least in one operation of the first to the (n-1)th operations.