Abstract: A roll-type cleaning member for scrubbing and cleaning a target cleaning surface of a substrate includes a plurality of nodules formed on a surface thereof. Each nodule includes a slit which extends so as not to be parallel to the rotation direction of the roll-type cleaning member, upstream edges are formed by the slit so as to serve as edges first contacting the target cleaning surface when a cleaning surface of the nodule contacts the target cleaning surface of the substrate by the rotation of the roll-type cleaning member, and the upstream edges are provided at a plurality of positions of the cleaning surface of the nodule in the circumferential direction.

Abstract: An object of the present invention is to reduce an amount of use of the polishing liquid. There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including: a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable; a substrate holding unit configured to hold the object to be polished and press the object against the polishing pad; a supplying device for supplying polishing liquid to the polishing surface in a state in which the supplying device is pressed against the polishing pad; and a pressing mechanism configured to press the supplying device against the polishing pad, in which the pressing mechanism is capable of respectively adjusting pressing forces for pressing the sidewalls of on the upstream side and the downstream side of the supplying device against the polishing surface.

Abstract: A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.

Abstract: A polishing method capable of terminating polishing of a substrate, such as a wafer, at a preset polishing time is disclosed. The polishing method includes: polishing a substrate by pressing the substrate against a polishing surface of a polishing pad, while regulating a temperature of the polishing surface by a heat exchanger; calculating a target polishing rate required for an actual polishing time to coincide with a target polishing time, the actual polishing time being a time duration from start of polishing the substrate until a film thickness of the substrate reaches a target thickness; determining a target temperature of the polishing surface that can achieve the target polishing rate; and during polishing of the substrate, changing a temperature of the polishing surface to the target temperature by the heat exchanger.

Abstract: An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

Abstract: A first and a second substrate polishing apparatus and are provided with a film thickness sensor for measuring a film thickness of layer to be polished and polish the layer by pressing the substrate against a polishing pad. The first substrate polishing apparatus outputs difference between output value of the film thickness sensor when an underlayer is exposed and output value of the film thickness sensor when the substrate is not present, as a first offset value. The second substrate polishing apparatus has a storage unit that stores information of the first offset value, an output correction unit that corrects the output value from the film thickness sensor based on the first offset value, and an end point detection unit that outputs control signal indicating end point of substrate polishing when measured value of the film thickness of the layer calculated based on the corrected output value reaches target value.

Abstract: A cover for a swing member of a substrate processing apparatus includes an upper surface including a first groove, and a first side edge and a second side edge located respectively at both ends of the upper surface in the short-length direction of the cover, where a bottom portion of the first groove is located lower than the first side edge and the second side edge.

Abstract: A polishing method capable of accurately determining a polishing end point of a substrate is disclosed. The method comprises: rotating a polishing table supporting a polishing pad; and polishing the substrate by pressing the substrate against a polishing surface of the polishing pad by a polishing head, wherein polishing the substrate includes: an oscillation polishing process of polishing the substrate while causing the polishing head to oscillate along the polishing surface; and a static polishing process of polishing the substrate with the oscillation of the polishing head stopped, the static polishing process is performed after the oscillation polishing process, and the static polishing process comprises determining a static polishing end point which is a point in time at which a rate of change of torque for rotating the polishing table has reached a change-rate threshold value.

Abstract: A polishing method capable of accurately measuring a film thickness of a substrate, such as a wafer, by enhancing light intensity of a flash-light source, such as a xenon flash lamp is disclosed. The polishing method includes: while an optical sensor head is moving across a substrate, causing a flash-light source to emit light plural times in a first exposure time of a light detector to direct the light to the substrate via the optical sensor head, capturing reflected light from the substrate by the light detector via the optical sensor head, further causing the flash-light source to emit light plural times in a second exposure time of the light detector to direct the light to the substrate via the optical sensor head, and capturing reflected light from the substrate by the light detector via the optical sensor head; generating a spectrum of the reflected light; and detecting a surface state of the substrate from the spectrum.

Abstract: There is provided a cleaning method and a cleaning apparatus capable of removing dirt on electrical contacts, the dirt being unable to be removed with deionized water, without adversely affecting a plating solution and a substrate holder which is a member for holding a substrate. A cleaning method according to the present disclosure is a cleaning method for a substrate holder having electrical contacts for supplying electric power to a substrate by contacting the substrate to plate the substrate, the method including a cleaning step of cleaning the electrical contacts attached to the substrate holder with a citric acid aqueous solution.

Abstract: Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

Abstract: A CMP polishing apparatus for flattening a quadrate substrate is provided. A polishing apparatus for polishing a quadrate substrate is provided. The polishing apparatus includes a substrate holding portion configured to hold the quadrate substrate. The substrate holding portion includes a quadrate substrate supporting surface that supports the substrate, and an attachment mechanism that attaches a retainer member to be disposed at an outside of at least one corner portion of the substrate supporting surface.

Abstract: A plating device includes: an anode; a substrate holder which holds a substrate; a substrate contact which comes into contact with a peripheral edge portion of the substrate; a resistor which is disposed in a way of facing the substrate holder between the anode and the substrate holder, and is used for adjusting ion movement; and a rotation driving mechanism which causes the resistor and the substrate holder to relatively rotate. The resistor includes: a shielding region which forms an outer frame and shields the ion movement between the anode and the substrate; and a resistance region which is formed on the radially inner side of the shielding region, and has a porous structure allowing the passage of an ion. An outer diameter of the resistance region has an amplitude centering on an imaginary reference circle, and has a wave shape which is periodic and annularly continuous.

Abstract: An object is to allow for simple measurement of a bump height. There is provided a device for measuring a bump height comprising: a light sensor provided with a light source and a light-receiving element and configured to irradiate a substrate including a seed layer, a resist layer formed on the seed layer and a bump formed in an opening of the resist layer, with light emitted from the light source and to detect reflected light that is reflected from the seed layer via the resist layer and reflected light that is reflected from the bump, by the light-receiving element; and a control device configured to calculate a height of the bump relative to the seed layer, based on the reflected light from the seed layer and the reflected light from the bump and to subtract an error caused by a refractive index of the resist layer from the height of the bump calculated based on the reflected lights, so as to correct the height of the bump.

Abstract: Provided is a substrate holding device that inhibits drop in holding accuracy of a substrate. A Bernoulli chucking pad suctions and holds a front surface or a back surface of a substrate S. A position determiner 54 is capable of pushing the substrate S in contact with a side surface 82 of the substrate S, and positioning the suctioned substrate S. A pin 66 enables the position determiner 54 to come in contact with the side surface 82 of the substrate S. The pin 66 brings the position determiner 54 into contact with the side surface 82 of the substrate S, and the position determiner 54 thereby positions the substrate S.

Abstract: Provided are an alloy powder having excellent environmental resistance even in an environment where corrosion and wear are active simultaneously, and an alloy coating using the powder. A Ni—Fe base alloy powder comprising Cr of 15% by mass or more and 35% by mass or less, Fe of 10% by mass or more and 50% by mass or less, Mo of 0% by mass or more and 5% by mass or less, Si of 0.3% by mass or more and 2% by mass or less, C of 0.3% by mass or more and 0.9% by mass or less, B of 4% by mass or more and 7% by mass or less, and a balance of Ni and incidental impurities.

Abstract: There is provided a method of plating comprising: a process of bringing a sealing portion of a seal provided to prevent a contact of a substrate holder that holds a substrate from coming into contact with a plating solution, into contact with pure water; and a process of detecting a leak of the seal, based on presence or absence of a short circuit of a leak detection electrode placed inside of the substrate holder after the sealing portion is brought into contact with the pure water and before the substrate is brought into contact with a chemical solution.

Abstract: To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.