Elastic membrane for semiconductor wafer polishing apparatus
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Description
Claims
The ornamental design for an elastic membrane for semiconductor wafer polishing apparatus, as shown and described.
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Patent History
Patent number: D981969
Type: Grant
Filed: Jun 15, 2021
Date of Patent: Mar 28, 2023
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenichi Akazawa (Tokyo), Tomoko Owada (Tokyo), Osamu Nabeya (Tokyo), Makoto Fukushima (Tokyo), Yuichi Kato (Tokyo)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/794,758
Type: Grant
Filed: Jun 15, 2021
Date of Patent: Mar 28, 2023
Assignee: EBARA CORPORATION (Tokyo)
Inventors: Kenichi Akazawa (Tokyo), Tomoko Owada (Tokyo), Osamu Nabeya (Tokyo), Makoto Fukushima (Tokyo), Yuichi Kato (Tokyo)
Primary Examiner: Shawn T Gingrich
Assistant Examiner: Caleb M Baker
Application Number: 29/794,758
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)