Patents Assigned to Electronics Co., Ltd.
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Publication number: 20250258440Abstract: Disclosed are a method for forming an overlay mark with improved reliability and an overlay measurement method using the overlay mark. The method for forming the overlay mark includes forming a lower overlay in a substrate; forming a pattern layer on the substrate; forming an upper overlay on the pattern layer, wherein the upper overlay includes a first area and a second area; forming a material layer on the upper overlay, wherein the material layer includes a third area corresponding to the first area and a fourth area corresponding to the second area; emitting light to the upper overlay through the material layer; and removing a portion of the upper overlay using the light.Type: ApplicationFiled: November 8, 2024Publication date: August 14, 2025Applicant: Samsung Electronics Co., Ltd.Inventor: Gun Woo PARK
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Publication number: 20250260912Abstract: An analog-to-digital converter circuit according to some example embodiments includes a ramp signal generator configured to generate a first ramp signal which rises with a first inclination and a second ramp signal which falls with a second inclination, and a comparison circuit configured to output a comparison result between the synthesis signal of a pixel signal output from a pixel array and the first ramp signal and the second ramp signal.Type: ApplicationFiled: September 13, 2024Publication date: August 14, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Sangwoo KIM, Kyunghoon KIM, Chanmin PARK
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Publication number: 20250258679Abstract: Disclosed is an operation method of a host which controls a computing device performing an artificial intelligence computation. The operation method includes receiving configuration information from the computation device, generating a plurality of lightening weight data by performing lightening on weight data based on the configuration information, generating a plurality of files by performing an aligning operation on the plurality of lightening weight data based on the configuration information, and loading the plurality of files into a memory device of the computing device. The configuration information includes channel information about a plurality of channels between the memory device and an accelerator, which are included in the computing device, and the number of the plurality of files is equal to the number of the plurality of channels.Type: ApplicationFiled: January 17, 2025Publication date: August 14, 2025Applicants: Samsung Electronics Co., Ltd., NAVER CORPORATIONInventors: Chansoo KIM, Hwang LEE, Jae Hun JANG, Younho JEON, Wan HEO, Sejung KWON, Byeonguk KIM, Baeseong PARK, Dongsoo LEE
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Publication number: 20250261431Abstract: A method of manufacturing an integrated circuit device may include forming a first etch stop layer on a first face of a substrate; forming a gate structure including a gate electrode layer and first and second source/drain regions on the first etch stop layer, the first and second source/drain regions respectively being self-aligned with opposing side walls of the gate structure and lower portions of the first and second source/drain regions respectively contacting first and second place holders extending into the substrate; removing the substrate until the first etch stop layer is exposed from a second face of the substrate while the first and second place holders are exposed; forming a base dielectric layer on a rear side of the first and second place holders; and forming a rear conductive line may be electrically connected to the second source/drain region.Type: ApplicationFiled: December 31, 2024Publication date: August 14, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Shinkyu CHOI, Kyoungwoo LEE, Minseung LEE, Seungseok HA, Youngwoo KIM, Junsoo KIM, Myeonggyoon CHAE
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Publication number: 20250257066Abstract: A compound of Chemical Formula 1, and an organic photoelectric device, an image sensor, and/or an electronic device including the same are disclosed: In Chemical Formula 1, each substituent is the same as defined in the detailed description.Type: ApplicationFiled: January 17, 2025Publication date: August 14, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Seon-Jeong LIM, Norihito ISHII, Katsunori SHIBATA, Yong Wan JIN, Taejin CHOI, Kyung Bae PARK, Sung Jun PARK, Jisoo SHIN, Sung Young YUN
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Publication number: 20250259670Abstract: A memory chip includes a plurality of storage blocks respectively including a plurality of memory cells; and a logic circuit configured to control the plurality of storage blocks, wherein the logic circuit includes an input/output pad configured to input data to the plurality of storage blocks and output data to the plurality of storage blocks; wherein the logic circuit is further configured to allocate block address codes having a bit inversion relationship with each other, output a mode selection signal in response to external control, output an external address code in response to the mode selection signal indicating a first addressing mode, and output an address code having a bit inversion relationship with regard to the external address code in response to the mode selection signal indicating a second addressing mode, and select a storage block to be controlled by the access command from among the plurality of storage blocks.Type: ApplicationFiled: May 2, 2025Publication date: August 14, 2025Applicant: Samsung Electronics Co., Ltd.Inventor: Kwangsook NOH
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Publication number: 20250259686Abstract: A memory device includes a memory cell array including memory cells and a page buffer circuit including page buffer units respectively connected to the memory cells through a plurality of bit lines and cache latches respectively corresponding to the page buffer units, each of the page buffer units including a main latch and a pass transistor, each connected to a corresponding sensing node, sensing nodes of at least first, second, and third page buffer units of the page buffer units connected to one another through pass transistors of the first, second, and third page buffer units, and a main latch of the first page buffer unit configured to perform a first data dump operation of transferring first data to a main latch of the second page buffer unit in a first time period of a data dump period.Type: ApplicationFiled: December 9, 2024Publication date: August 14, 2025Applicant: Samsung Electronics Co., Ltd.Inventor: Hyungyu YANG
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Patent number: 12387811Abstract: A semiconductor memory device includes a memory cell array, an on-die error correction code (ECC) engine and a control logic circuit. The on-die ECC engine includes a first latch and a second latch. The control logic circuit sets the semiconductor memory device to a test mode in response to a first mode register set command. The on-die ECC engine, in the test mode, cuts off a connection with the memory cell array, receives a test data, stores the test data in the first latch, performs an ECC decoding on the test data stored in the first latch and a test parity data, stored in the second latch in response to a read command and provides an external device with a severity signal indicating whether the test data and the test parity data includes at least one error bit and the at least one error bit is correctable.Type: GrantFiled: February 24, 2023Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Yujung Song, Sungrae Kim, Gilyoung Kang, Hyeran Kim, Chisung Oh
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Patent number: 12387866Abstract: An inductor with the special-shaped structure includes an inductor main body and a pair of supporting legs fixed below the inductor main body, wherein the pair of supporting legs is conductors and is electrically connected to a pair of electrodes of the inductor main body, and the pair of supporting legs is configured to support the inductor main body during installation, so that a gap space is left below the inductor main body. Due to the unique structural design of the inductor in the present invention, the utilization ratio of the area of the PCB can be effectively increased, and the inductor is particularly suitable for very-high-density component installation on the PCB during power application. Moreover, by changing relative positions of the supporting legs, lower cavities with different sizes may be formed below the inductor main body, thereby facilitating optimal design for meeting different demands.Type: GrantFiled: March 29, 2022Date of Patent: August 12, 2025Assignee: Shenzhen Sunlord Electronics Co., Ltd.Inventors: Hai Guo, Shengcheng Xia, Qintian Hou
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Patent number: 12387874Abstract: A wearable electronic device may include: a display, a housing forming at least part of an exterior of the wearable electronic device, a printed circuit board disposed beneath the display, a plurality of electronic components disposed on the printed circuit board, a rear cover forming at least a part of a rear surface of the wearable electronic device, a conductive coil disposed within a specified proximity of the rear cover, a first electromagnetic shield disposed between the conductive coil and the plurality of the electronic components, and configured to shield a first area covering the conductive coil, and a second electromagnetic shield disposed between the first electromagnetic shield and the plurality of the electronic components, and configured to shield at least an area outside of the first area.Type: GrantFiled: December 17, 2021Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Jongchul Hong, Jungsu Park, Yongsang Yun
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Patent number: 12389241Abstract: According to certain embodiments, an electronic device, comprises: a communication circuit; and at least one processor operatively connected with the communication circuit, wherein the at least one processor is configured to: transmit, to a server through the communication circuit, a registration request message including information indicating that it is possible for the electronic device to perform an access point (AP) operation, receive, from the server through the communication circuit, an AP operation command message commanding to perform an AP operation and including access information of an AP in which a failure state has occurred, and perform the AP operation which is based on the access information of the AP.Type: GrantFiled: June 8, 2022Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Seokhyun Kim, Namjin Kim
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Patent number: 12389428Abstract: A user equipment (UE) in a wireless communication system, according to an embodiment of the present disclosure, includes: a transceiver; and at least one processor connected to the transceiver, the at least one processor being configured to: receive, from a base station, a UECapabilityEnquiry message including at least one of radio access technology (RAT) type information or frequency information; and transmit capability information of the UE to the base station based on the RAT type information or the frequency information, wherein the RAT type information is associated with at least one of new radio (NR), evolved universal terrestrial radio access (EUTRA)-NR, or EUTRA, and the frequency information is associated with a Uu frequency or a sidelink frequency.Type: GrantFiled: January 13, 2021Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., LtdInventors: Hyunjeong Kang, Seungri Jin
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Patent number: 12388017Abstract: A semiconductor device includes: circuit devices on a first substrate; a lower interconnection structure electrically connected to the circuit devices; a lower bonding structure connected to the lower interconnection structure; an upper bonding structure on the lower bonding structure; an upper interconnection structure connected to the upper bonding structure; a second substrate on the upper interconnection structure; gate electrodes between the upper interconnection structure and the second substrate; channel structures penetrating the gate electrodes and each including a channel layer; via patterns on the second substrate; a source contact plug spaced apart from the second substrate on an external side of the second substrate and having an upper surface higher than the second substrate and a lower surface lower than a lowermost gate electrode; and a source connection pattern contacting upper surfaces of each of the via patterns and the upper surface of the source contact plug.Type: GrantFiled: March 23, 2022Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Moorym Choi, Jungtae Sung
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Patent number: 12386021Abstract: Disclosed is a method for performing downlink time difference of arrival (DL-TDoA) by an ultra-wide band (UWB) device that includes selecting at least one active ranging round from a ranging block based on at least one of location information or motion information about the UWB device, transferring, to a UWB sub system, a command including information about the at least one active ranging round, and performing a DL-TDoA operation based on the information about the at least one active ranging round.Type: GrantFiled: July 8, 2022Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., LtdInventors: Jonghoe Koo, Jinwook Seo, Hyunseob Oh, Mingyu Lee, Taeyoung Ha, Haeyoung Jun
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Patent number: 12389071Abstract: A method includes obtaining device usage log data associated with multiple user devices. The device usage log data is related to device settings associated with the user devices, where each device setting associated with the user devices is adjustable by users of the user devices. The method also includes obtaining one or more metrics representing each user's activeness in customizing one or more device settings of the user device associated with the user based on the device usage log data. The method further includes clustering the users into multiple groups based on the metric(s) and identifying at least one of the groups as being at least one valid user group. In addition, the method includes providing one or more recommendations of at least one customized device setting to one or more of the user devices based on the device usage log data associated with the valid user group(s).Type: GrantFiled: April 12, 2023Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventor: Ho Sub Lee
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Patent number: 12389264Abstract: A communication device mounted on a vehicle and an operation method of the communication device are provided. The communication device performs a connection with a communication terminal included in a vehicle stopped or driving in a vicinity of the vehicle via device-to-device communication, provide subscriber identity module (SIM) information to the connected communication terminal, request execution of a communication relay function from the communication terminal, and in response to a communication relay function acceptance signal being received from the communication terminal, transmit and receive data to and from the base station by using the communication terminal as a communication relay.Type: GrantFiled: March 16, 2023Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Jaewoong Lee, Seungjin Yu, Woong Lee, Yuseon Lee, Changwon Jang
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Patent number: 12389271Abstract: The disclosure relates to a method and device for efficiently providing a split computing service in a wireless communication system. In accordance with an aspect of the disclosure, a method performed by a session management function (SMF) in a wireless communication system supporting split computing is provided, the method comprises receiving, via a first network entity from an application server, quality of service (QoS) related information to be applied to a user equipment (UE) for the split computing, the first network entity being either a policy control function (PCF) or a user data management (UDM), and transmitting, to the UE via a network, the QoS related information for the split computing in a session establishment procedure for the UE.Type: GrantFiled: November 2, 2022Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Jungshin Park, Sangsoo Jeong
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Patent number: 12389286Abstract: According to an embodiment of the disclosure, an operating method of an electronic device in a wireless communication system includes: establishing a wireless communication connection for transmitting and receiving data to and from an access point in a first communication method; receiving a state detection message from the access point; identifying an internal state of the electronic device in response to the state detection message being received; and determining whether to switch a communication interface, based on the identified internal state, and the internal state includes a received signal strength indicator (RSSI) value of the wireless communication connection, information regarding whether a network switching mode of the electronic device is enabled, information regarding whether an application related to the data is enabled, and/or information regarding use of the data.Type: GrantFiled: July 11, 2022Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Minho Kang, Chounjong Nam, Junhak Lim
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Patent number: 12389291Abstract: According to an aspect of the disclosure, a method of performing a conditional handover by a vehicle-to-everything (V2X) user equipment (UE) may include: transmitting a cell measurement report to a serving cell; receiving conditional handover configuration information from the serving cell; determining whether to perform a handover, based on the conditional handover configuration information; and when it is determined to perform the handover, performing random access to a target cell.Type: GrantFiled: May 17, 2024Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventors: Seungri Jin, Sangkyu Baek, Soenghun Kim, Hyunjeong Kang, June Hwang
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Patent number: 12388014Abstract: An integrated circuit is provided. The integrated circuit includes a substrate, one or more active devise such as one or more transistors arranged on the substrate, a plurality of interlayer dielectrics arranged on the substrate, a first metallization pattern arranged on the plurality of interlayer dielectrics, a first lower electrode arranged on the first metallization pattern, a first dielectric layer arranged on the first lower electrode, and a first upper electrode arranged on the first dielectric layer, wherein a thickness of the first metallization pattern in a first direction perpendicular to the substrate is not uniform, e.g. is variable, e.g. is not planar.Type: GrantFiled: September 12, 2022Date of Patent: August 12, 2025Assignee: Samsung Electronics Co., Ltd.Inventor: Myoungsoo Kim