Abstract: A thin film assembly may include a boron nitride thin film layer including a boron nitride compound and an insertion layer having a dielectric constant of 4.0 or less, wherein the boron nitride thin film layer and the insertion layer may be alternately arranged one or more times.

Abstract: A semiconductor device manufacturing method includes determining whether or not a reticle writing correction needs to be applied to a mask for an exposure process, when determining that the reticle writing correction needs to be applied, manufacturing the mask to which the reticle writing correction is applied by using the mask to which the reticle writing correction is applied, measuring an overlay and performing a correction based on the basis of on the measured overlay, determining whether or not a value of the measured overlay is greater than a specification, and when the value of the measured overlay is not greater than the specification, performing a subsequent process.

Abstract: An electronic device and method are disclosed. The electronic device includes a display, a first sensor, a communication module and a processor. The processor implements the method, including calculating a first impedance via the first biometric information, calculating a first body composition based on the first impedance, receiving second biometric information from an external electronic device, calculating a second impedance using the second biometric information, calculating a second body composition based the second impedance, calculating a total body composition based on at least one of the first impedance and the second impedance, calculating a third body composition for a third part of the body of the user, based on the total body composition, the first body composition, and the second body composition, and displaying at least one of the total body composition, the first body composition, and the second body composition, and the third body composition on the display.

Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services.

Abstract: A semiconductor device including first and second standard cells disposed in one of a first direction and a second direction intersecting the first direction, the first and second directions parallel to a substrate, and each of the first and second standard cells including a gate structure and an active region, and a filler cell adjacent to the first standard cell in the second direction and adjacent to the second standard cell in the first direction, wherein an output node of the first standard cell is connected to an input node of the second standard cell, an output active contact providing an output node of the first standard cell is connected to a wiring active contact among at least one dummy active contact included in the filler cell, and an input wiring providing an input node of the second standard cell is connected to the wiring active contact may be provided.

Abstract: An image sensor includes a semiconductor substrate having first and second opposing surfaces thereon and a photoelectric conversion region of first conductivity type therein, which extends between the first and second surfaces. A two-dimensional array of semiconductor photoelectric conversion devices of second conductivity type is provided within the photoelectric conversion region. A first grid-shaped isolation region is provided, which extends into the photoelectric conversion region from the first surface, and has a first electrically conductive material therein. A second grid-shaped isolation region is provided, which extends into the photoelectric conversion region from the second surface.

Abstract: Disclosed is an electronic device including a wireless communication circuitry capable of supporting dual connectivity for a first cellular communication network and a second cellular communication network, a processor operatively connected with the wireless communication circuitry, and a memory operatively connected to the processor, wherein the memory stores instructions that, when executed by the processor, cause the electronic device to establish a connection with the second cellular communication network as a secondary cell group (SCG) based at least in part on control information received from the first cellular communication network, monitor a condition of the electronic device, and report, if the condition is satisfied, an SCG failure to at least one of the first cellular communication network or the second cellular communication network for releasing the second cellular communication network, wherein the condition includes no mobile activity of the electronic device.

Abstract: An electronic device may include a body having a cylindrical shape as a cylindrical housing. The body may include: a first side surface portion extending from one end; and a second side surface portion extending from the other end of the body and disposed in parallel with the first side surface portion. The body may include a rollable display disposed to be rolled in an inner space of the cylindrical housing, and pulled from the inside of the housing to the outside and pushed into the inside of the housing. The electronic device may include radio frequency (RF) transmission lines disposed to traverse an active area of the rollable display on the rear surface of the rollable display. The electronic device may include a plurality of antennas disposed on one side of the rollable display and electrically connected to a first side of the plurality of RF transmission lines. The electronic device may include a flexible circuit board electrically connected to a second side of the RF transmission lines.

Abstract: A semiconductor package includes a first substrate including a first wiring layer inside the first substrate, a second substrate including a second wiring layer inside the second substrate, and a mold layer between the first substrate and the second substrate. An upper surface of the mold layer is on a same plane as upper surfaces of the first substrate and the second substrate. The package includes a first connecting film on each of the upper surface of the first substrate and the upper surface of the second substrate, the first connecting film connecting the first substrate and the second substrate, and a first semiconductor chip on the upper surface of the first substrate. The first semiconductor chip is spaced apart from the first connecting film, and an upper surface of the first connecting film is lower than an upper surface of the first semiconductor chip.

Abstract: Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

Abstract: Provided are display panel, method for driving same, and display device. Display panel includes pixel circuit and cascaded first shift circuits. Pixel circuit includes drive transistor and adjusting module electrically connected to first scan line, adjusting line and first electrode of drive transistor. First shift circuit is electrically connected to first scan line and includes first control module and first output module. First control module is electrically connected to first type-A clock line, first shift control line and first control node, and configured to write first shift control signal into first control node in response to first type-A clock signal from first type-A clock line. First output module is electrically connected to first control node, first type-B clock line and first scan line, and configured to write first type-B clock signal into first scan line in response to signal of first control node.

Abstract: An electronic device is provided. The electronic device includes memory storing instructions, a camera module, a communication module, a display module, and at least one processor operatively connected to the memory, the camera module, the communication module, and the display module. The instructions, that when executed by the at least one processor, cause the electronic device to identify a reception event of a video call based on the communication module, hook one or more images captured based on the camera module to provide image information corresponding to the hooked one or more images to a first application, identify a gesture based on information output from the first application, by inputting the image information to the first application, and perform at least one operation corresponding to the identified gesture.

Abstract: A display panel, a display apparatus, and a method for manufacturing a display panel, and the display panel includes a base plate, an isolation structure, and a touch layer. The isolation structure is provided on the base plate, and encloses and forms a plurality of isolation openings configured to partition the light-emitting layer to form partitioned light-emitting units. The isolation structure is provided with a light transmission opening, so that a light transmittance of the display panel can be increased. The touch layer is located on a side of the isolation structure away from the base plate, and includes a touch electrode and a virtual electrode spaced apart and insulated from each other, the virtual electrode and the touch electrode are spaced apart and insulated from each other, the virtual electrode includes a first virtual electrode at least partially located in the light transmission region.

Abstract: An audio output device is provided. The audio output device includes a speaker, a case surrounding the speaker and including a first opening connected to the resonance space within the case, a plurality of air adsorbents disposed within the speaker, an adhesive member disposed on the first opening and including a second opening overlapping the first opening, and a mesh layer disposed on the adhesive member and covering the second opening. A diameter of the first opening is larger than a diameter of each of the plurality of air adsorbents, and a diameter of the second opening is smaller than the diameter of the first opening.