Abstract: The NMOS transistor is provided with a semiconducting substrate (12) which is p-doped and comprises a top side (14), and with a first region (16) which is n-doped and placed into the substrate by diffusion from the top side (14) of the substrate (12). Further, the transistor comprises a second region (18) arranged within the n-conducting region (16), which is n-doped and introduced into the substrate from the top side (14) of the substrate (12), and a field oxide layer (20) which is arranged on the top side (14) of the substrate (12) and limits the p-conducting region (16) on all sides. The top side comprises a source region (22) and a drain region (24) which are n-doped and arranged within the p-conducting region (18) at a distance to each other. A gate oxide layer (26) is arranged on the top side (14) of the substrate (12) between the source and the drain regions (22, 24).

Abstract: An ink replenishment kit and method for an inkjet printer includes a replaceable ink supply module providing replenishment of an inkjet printhead. The module includes a collapsible bag, an enclosure box, a connective tube, and an on/off valve. These four components are incorporated into a composite sealed system which remains intact during shipment, storage, installation and operation. A coupler is provided to securely attach a print cartridge inlet with the on/off valve to hold them together in an open position allowing ink to be replenished into the print cartridge from the collapsible bag.

Abstract: An MOS transistor with high voltage sustaining capability and low closing resistance comprises a substrate (10) provided with a doping of a first conductive type, and a well area (20) formed in the substrate (10) and provided with a doping of a second conductive type opposite to the first conductive type. Further, the MOS transistor comprises source and drain areas (26,28) of the first conductive type formed in the well area (20). The MOS transistor is provided with a gate (32) comprising a gate oxide layer (36) and arranged between the source region (26) and the drain area (28), the gate (32) having drain-side end region (42) arranged at a distance (40) from the drain area (28). The MOS transistor comprises a drain extension region (24) provided with a doping of the first conductive type and having the drain area (28) arranged therein, with the drain extension region (24) reaching below the drain-side end region (42) of the gate (32).