Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: Polyamide moulding composition consisting of the following components (A) 28.0-64.9 wt % of at least one polyamide, (B) 15.0-40.0 wt % of glass fibres, (C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 pi II, (D) 0.1-2.0 wt % of heat stabilizer, (E) 0-5.0 wt % of additives with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.

Abstract: Polyamide moulding composition consisting of the following components (A) 28.0-64.9 wt % of at least one polyamide, (B) 15.0-40.0 wt % of glass fibres, (C) 15.0-35.0 wt % of glass flakes having a particle thickness in the range of 0.3-2.0 ?m, (D) 0.1-2.0 wt % of heat stabilizer, (E) 0-5.0 wt % of additives with the proviso that the sum of components (B) and (C) is in the range of 35.0 to 65.0 wt %, based on the sum of components (A) to (E), and the sum of components (A) to (E) makes 100 wt %.

Abstract: Thermoplastic polyamide moulding composition consisting of: (A) 30-99.9 percent by weight of at least one polyamide selected from the group consisting of: at least one aliphatic or semiaromatic polyamide, in each case with C:N ratio at least 8; at least one aliphatic or semiaromatic polyamide composed of at least one dicarboxylic acid and of at least one diamine and also optionally a proportion below 50 mol percent based on the entirety of dicarboxylic acids and diamine as 100 mol percent, of lactams and/or aminocarboxylic acids; and mixtures thereof; (B) 0.1-5.0 percent by weight of polyethyleneimine (PEI) or copolymers or derivatives thereof; (C) 0-60 percent by weight of fillers and/or reinforcing materials; (D) 0-5.0 percent by weight of additives; where the entirety of (A)-(D) provides 100% of the thermoplastic polyamide moulding composition, and also uses of such moulding compositions in particular in the context of components bonded to mineral glass.

Abstract: A multi-layer composite in the form of a hollow body enclosing an interior space (2) is proposed, consisting of three or four layers: an inner layer (3) adjoining the interior space (2), a middle layer (4) adjoining the latter and an outer layer (5) adjoining the middle layer (4) and closing the multi-layer composite (1) to the outside. If necessary, there is a further innermost layer (8) which directly adjoins the said inner layer (3) and is equipped with a conductive finish. The inner layer (3) is based on polyamide 6, the middle layer (4) is based on EVOH, and the outer layer (5) is based on a mixture of (A) polyamide 6 and (B) at least one other polyamide selected from the following group: polyamide 612, polyamide 614, polyamide 616 and polyamide 618.

Abstract: Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-?-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.

Abstract: The present invention relates to polyamide molding compounds which contain the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one amorphous or microcrystalline specific polyamide; (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 616, PA 516, PA 1016 and mixtures thereof; and (C) 0 to 16% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The present invention also relates to molded articles made of these polyamide molding compounds and the use thereof.

Abstract: The present invention relates to polyamide moulding compounds that contain a semi-crystalline copolyamide, at least one filler, and optionally additives. The invention likewise relates to mouldings manufacture from these moulding compounds and to the use of the moulding compounds to manufacture mouldings.

Abstract: The present invention relates to a polyamide molding compound which contains the following components (A) to (C) or consist of these components: (A) 50 to 98% by weight of at least one specific amorphous or microcrystalline copolyamide constituted by the specific monomers (a1) to (a4); (B) 2 to 40% by weight of at least one semi-crystalline polyamide which is selected from the group consisting of PA 612, PA 6/12, PA 516, PA 614, PA 616, PA 618, PA 1012, PA 1014, PA 1016, PA 1018 and mixtures thereof; and (C) 0 to 20% by weight of at least one additive; the constituent amounts of the components (A) to (C) adding up to 100% by weight. The invention also relates to molded articles made of said polyamide molding compound and the use thereof.

Abstract: The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan ? of not more than 8.30×10?3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

Abstract: The present invention relates to impact-modified polyamide moulding compounds which, in addition to a specific, amorphous polyamide and a functionalised styrene-butadiene-styrene triblock copolymer as impact modifier, possibly comprise further specific, partially crystalline polyamides and additives. Likewise, the invention relates to the use of these polyamide moulding compounds for the production of moulded articles.

Abstract: Disclosed is a fluid transport pipe which has an inner layer, coming in contact with a fluid, comprising at least one aliphatic polyamide and at least one impact modifier and also at least one outer layer which is connected directly to the inner layer and is formed from an aliphatic polyamide and at least one flame retardant. While the inner layer ensures the chemical resistance relative to the fluids to be transported and the mechanical resistance, the flame resistance is ensured by the outer layer.

Abstract: The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one latex; (C) at least one compound selected from the group consisting of polyacrylates, lignin derivatives and mixtures hereof; and (D) possibly at least one additive; the dipping bath composition being essentially free of epoxides, and the dipping bath composition being essentially free of resorcinol, formaldehyde and the reaction products thereof.

Abstract: The invention relates to a polyamide moulding compound consisting of an amorphous, microcrystalline or partially crystalline polyamide or mixtures hereof, at least one impact modifier, hollow glass balls and also further additives. The invention likewise relates to moulded articles produced from this polyamide moulding compound.

Abstract: A connection device for at least one plug-in portion including an annular external groove includes a housing, into which at least one plug-in portion can be plugged, and also at least in each case one integral locking element and a securing device. A locking element includes a securing portion and a locking portion which can be preassembled in the housing. In the preassembled state, the locking portion, by elastic deflection, permits a plug-in portion to be plugged into the housing and brings about the locking of the plug-in portion in the housing. By means of the securing device, the securing portion can be secured on an outer side of the housing opening against displacement in a circumferential direction. A securing device is designed as a ring which engages around the housing and is movable on the housing at least axially counter to a resistance and has an axial recess in a plugging-in direction.

Abstract: The invention relates to polyamide moulding compounds comprising the following components: a) 50 to 95% by weight of a single amorphous copolyamide constructed from monomers a1) to a6), b) 5 to 50% by weight of at least one glass filler, c) 0 to 15% by weight of at least one monomeric lactam and/or polyamide 12, d) 0 to 19% by weight of additives, the sum of components a) to d) producing 100% by weight. Furthermore, the invention relates to moulded articles made of this polyamide moulding compound.

Abstract: A polyamide moulding composition in particular for use for components in the drinking water sector, made of the following constituents: (A) from 25 to 74.9% by weight of at least one semicrystalline, semiaromatic nylon-6,T/6,I, composed of: (a1) from 65 to 82 mol % of terephthalic acid, based on the entirety of the dicarboxylic acids used; (a2) from 18 to 35 mol % of isophthalic acid, based on the entirety of the dicarboxylic acids used; (a3) 1,6-diaminohexane; (a4) at least one monobasic carboxylic acid; (a5) a phosphorus compound; with the first proviso that the molar ratio of the component (a3) to the entirety of the dicarboxylic acids used ((al)+(a2)) is at least 1.04 and at most 1.15; and with the second proviso that the molar ratio of the component (a4) to the component (a3) is in the range from 0.01 to 0.08; (B) from 25 to 60% by weight of fibrous reinforcing materials; (C) from 0 to 30% by weight of particulate fillers; (D) from 0.1 to 2.

Abstract: The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.

Abstract: A plastics line (1) is described with at least one layer (5) consisting of the following components: (A) 70-94 weight percent of a polyamide selected from the following group: polyamide 516, polyamide 616, polyamide 1016 or mixtures thereof; (B) 4-20 weight percent impact modifier; (C) 2-15 weight percent of plasticiser; (D) 0-5 weight percent of additives different from (B) and (C), wherein the sum of (A)-(D) is 100 weight percent, and with the proviso that layer (5) does not contain polyamide 6, as well as a method of manufacturing such a plastic pipe and uses of such a plastic pipe.

Abstract: The present invention relates to an aqueous, solids-containing dipping bath composition for treating reinforcing inserts for rubber products comprising the following components or consisting of these components, (A) at least one blocked MDI mixture, the MDI mixture comprising MDI oligomers of formula (I), n being a whole number from 1 to 8, and MDI monomers; (B) at least one resorcinol-formaldehyde latex; and (C) possibly at least one additive, wherein the dipping bath composition is essentially free of epoxides.