Abstract: The present invention relates to heat-aging resistant polyamide molding materials based on partially crystalline, partially aromatic polyamides as well as to moldings manufactured therefrom.

Abstract: The invention relates to a composite which comprises a matrix material made of an amorphous polyamide with a glass transition temperature of at least 180° C. The composites according to the invention are used for the production of reinforced components in the fields of sport, leisure, engineering industry, electronics, construction, medical technology, communication and transport means and aeronautical and aerospace engineering.

Abstract: The present invention refers to a polyamide moulding composition having an excellent adhesion to metal surfaces. Moreover, the present invention refers to structural parts with a metal component directly bonded to a thermoplastic component (interconnected without using a bonding agent/layer). The present invention also relates to a method for manufacturing of such structural parts by an injection moulding or extrusion processes.

Abstract: A layer structure having at least one metal element and at least one polyamide layer arranged at least regionally on the metal element, the structure preferably comprising an insulated electrical conductor wherein The polyamide layer consists of a polyamide molding composition consisting of the following components: (a) a polyamide based on cycloaliphatic diamines or cycloaliphatic dicarboxylic acids having a glass transition temperature (Tg) of at 130° C.; (b) a polyolefin based on C2-C12 alkenes, and additionally on at least one monomer selected from the following group: maleic anhydride, itaconic anhydride, glycidyl acrylate, butene, propylene, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C12 alkyl (meth)acrylates, substituted or unsubstituted styrene, or a mixture of such monomers; (c) optionally an aliphatic polyamide different from (a), or a mixture of such polyamides; (d) optionally additives.

Abstract: The invention relates to polyamide moulding compounds comprising the following components: a) 50 to 95% by weight of a single amorphous copolyamide constructed from monomers a1) to a6), b) 5 to 50% by weight of at least one glass filler, c) 0 to 15% by weight of at least one monomeric lactam and/or polyamide 12, d) 0 to 19% by weight of additives, the sum of components a) to d) producing 100% by weight. Furthermore, the invention relates to moulded articles made of this polyamide moulding compound.

Abstract: The present invention relates to a flame-retardant polyamide moulding composition with good mechanical properties with the following constitution: (A) from 25 to 90% by weight of at least one polyamide, (B) from 5 to 60% by weight of glass fibres, where the arithmetic average of the length of these in the polyamide moulding composition is from 100 to 220 ?m, (C) from 5 to 25% by weight of at least one phosphinic salt and/or one diphosphinic salt, (D) from 0 to 20% by weight of at least one additive, where the entirety of components (A) to (D) gives 100% by weight. The invention also relates to processes for the production of moulding compositions of this type, to mouldings produced therefrom, and also to uses.

Abstract: The invention relates to a method for laser welding two plastic components A, B brought into contact at least in the joining area, wherein component B facing away from the laser radiation consists of a plastic matrix with a white pigmentation of 1.5 5-20 wt.-%, and component A facing the laser radiation, through which the laser beam passes in the welding process, exhibits a plastic matrix. For a given laser wavelength the travel distance of the laser beam through the component A measures at most 10 mm, and given a white pigmentation of the component A in wt.-%, the product of the travel distance of the laser 10 beam through the component A in mm and white pigmentation in wt.-% is less than 1.25, and the travel distance of the laser beam through the component A measures at most 1 mm.

Abstract: The present invention refers to a polyamide moulding composition consisting of the following components: a) 45 to 75% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 18 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines and cycloaliphatic diamines, b) 5 to 20% by weight of at least one fibrous reinforcing agent, c) 10 to 40% by weight of at least one non-sized filler which is different from the fibrous reinforcing agent in b), d) 0 to 10% by weight of a at least one additive, with the proviso that the component b) and c) add up to 25 to 45% by weight and the entirety of components a) to d) add up to 100% by weight. Moreover, the present invention refers to a moulded article producible from this moulding composition.

Abstract: A polyamide molding composition and uses thereof, and moldings produced therefrom, comprising the following components: (A) semicrystalline semiaromatic polyamide with melting point above 270° C., or a mixture of these polyamides; (B) copolymer of oxyranyl acrylate and/or oxyranyl methacrylate with at least one other olefinically unsaturated monomer, or a mixture of these copolymers; (C) one or more fibrous reinforcing materials; (D) one or more heat stabilizers; where the proportion of (B) is in the range of 1 to 15% by weight, based on 100% by weight composed of the entirety of the components (A) and (B), with the proviso that the polyamide molding composition is free from grafted impact modifiers.

Abstract: A polyamide molding material is proposed, which comprises at least one partially crystalline, partially aromatic polyamide (A) and at least one amorphous polyamide (B). The polyamides (A) and (B) together make up 30-60 wt.-% of the polyamide molding material. Furthermore, the polyamide molding material comprises 40-70 wt.-% glass fibers (C) having flat cross section, 0-15 wt.-% of at least one nonhalogenated flame retardant (D), and 0-10 wt.-% further additives (E), the components (A) to (E) adding up to 100 wt.-% of the polyamide molding material. The at least one partially crystalline, partially aromatic polyamide (A) has a glass transition temperature of at least 105° C. The polyamide molding material according to the invention is preferably distinguished in an injection-molding burr formation test in that, at a melt temperature of 320° C. and a tool temperature of 90° C.

Abstract: Thermoplastic, flame-retarded plastic molding compounds with improved mechanical properties, in particular for LDS applications, are described. The thermoplastic molding compound consists of: (A) 21-81.9 wt. % thermoplastic material, consisting of (A1) 55-100 wt. % polyamide, containing at least 50 wt. % partly aromatic, partly crystalline polyamide; (A2) 0-45 wt. % non-polyamide based thermoplastic material, wherein (A1) and (A2) add up to 100 wt. % component (A); (B) 10-70 wt. % glass fibers; (C) 0.1-10 wt. % LDS additive or a mixture of LDS additives; (D) 8-18 wt. % halogen-free flame retardant; (E) 0-40 wt. % particulate filler, different from (C); (F) 0-2 wt. % other further additives; wherein the sum of (A)-(F) makes up 100 wt. %.

Abstract: A thermoplastic moulding composition, in particular a polyamide moulding composition, consisting of, by weight: (A) 20-88%—thermoplastic material; (B) 10-60%—fibrous fillers, formed from (B1) 10-60%—glass fibers, selected from: glass fibres (B1_1) with a non-circular cross section, wherein the axis ratio of the main cross-sectional axis to the secondary cross-sectional axis is at least 2; high-strength glass fibres (B1_2) with a glass composition (substantially SiO2, AlO, and MgO; or mixtures thereof; (B2) 0-20%—glass fibres, different from glass fibres of component (B1) and have a circular cross section; and (B3) 0-20%—further fibrous tillers, different from fibres of (B1) and (B2), not based on glass, and selected from the group: carbon fibres, graphite fibres, aramid fibres, nanotubes; (C) 2-10%—LDS additive or a mixture of LDS additives; (D) 0-30%—particulate filler; (E) 0-2%—further, different additives; the sum of (A)-(E) is 100% by weight.

Abstract: Disclosed is a polyamide moulding compound suitable for producing moulded articles with improved mechanical properties, the moulding compound including A) at least one amorphous or microcrystalline polyamide, with the proviso that a test piece of polyamide A) has a light transmission according to ASTM D 1003 of at least 80% and a melting heat according to ISO 11357 of <25 J/g, B) 20 to 85% by weight of a long fibre with a round cross-section and C) 0 to 10% by weight of at least one additive, components A) to C) adding up to 100% by weight. Also disclosed is a process for producing moulded bar granulates containing the moulding compound.

Abstract: A polyamide moulding compound consisting of the following components (A)-(E): (A) 40-70 wt. % of at least one partially crystalline, partially aromatic polyamide, made up of: (a1) 60 to 75 wt. % of 6T units, formed from 1,6-hexanediamine and terephthalic acid; (a2) 20 to 35 wt. % of 6I units, formed from 1,6-hexanediamine and isophthalic acid; (a3) 3 to 15 wt. % of 612 units, formed from 1,6-hexanediamine and dodecanedioic acid; and (a4) 0 to 5 wt. % of one of the following units: 66 units, formed from 1,6-hexanediamine and adipic acid; 68 units, formed from 1,6-hexane-diamine and suberic acid; 69 units formed from 1,6-hexanediamine and azelaic acid; 610 units formed from 1,6-hexanediamine and sebacic acid; 6 units formed from ?-caprolactam; or a mixture of such units; wherein the sum of the components (a1) to (a4) makes up 100 wt. % of the polyamide (A); (B) 30-60 wt. % of fibrous reinforcing materials; (C) 0-30 wt. % of particulate fillers different from (B), (D) and (E); (D) 0-2.0 wt.

Abstract: The present invention relates to an adhesive formulation in the form of an aqueous dispersion with a solids content of 10 to 40% by weight relative to the adhesive formulation, for the treatment of reinforcing inserts for the production of reinforced polymer products, 100% by weight of the solids containing a) 1 to 20% by weight of a bisphenol A epoxy novolak, b) 0 to 20% by weight of an entirely or partially blocked isocyanate, c) 60 to 92% by weight of a resorcinol formaldehyde latex (RFL).

Abstract: The present invention relates to a method for the production of injection-moulded, reinforced moulded parts, the fibre orientation of which is specifically adjusted on a local basis. Via suitable, dynamically controlled supplementary heating in the wall of the injection mould which is used (variotherm heatable channel), a local cavity region is hereby heated at the time of injection to a temperature in the region of or above the solidification temperature (in any case above the crystallisation temperature in the case of partially crystalline plastic materials or above the glass transition temperature in the case of amorphous plastic materials) of the polymer (plastic material moulding compound).

Abstract: The invention relates to a method for storage and for transport of polyamide granulate which comprises at least one amorphous or microcrystalline polyamide. By means of this novel method, yellowing during further processing to form the moulded article can be avoided or at least reduced. Likewise, the invention relates to a corresponding container in which the polyamide granulate is stored. The invention also relates to correspondingly stored or transported polyamide granulate and also moulded articles produced therefrom.

Abstract: Polyamide molding composition: (A) 29-89 wt % of at least one partly crystalline thermoplastic homo- or copolyamide selected from: aliphatic polyamide, cycloaliphatic polyamide, partly aromatic polyamide, or a mixture thereof, having a melting temperature (Tm) of at least 270° C. and a melting enthalpy in the range of 30-70 J/g, in particular in the range of 40-65 J/g, each measured to ISO standard 11357-3 on the granulate at a heating rate of 20° C./min; (B) 1-15 wt % of ethylene-vinyl acetate copolymer; (C) 10-70 wt % of filling and reinforcing materials selected from the following group: fibrous reinforcing materials, particulate fillers and mixtures thereof; (D) 0-20 wt % of impact modifier other than (B) and/or polymers other than (A); (E) 0-20 wt % of flame retardant; and (F) 0-5 wt % of additives, wherein the sum total of components (A)-(F) is 100 weight percent.

Abstract: The invention relates to a polyamide molding composition which comprises an amorphous polyamide, a partially crystalline, aliphatic polyamide and also glass fibers for reinforcement. Furthermore, the polyamide molding composition according to the invention comprises a polyamide made of a cycloaliphatic diamine and a dimerized fatty acid. The polyamide molding compositions according to the invention are used in the production of electrical or electronic components, housings or housing components.

Abstract: The present invention relates to polyketone moulding compounds based on partially crystalline, aliphatic polyketones. In particular, it relates to halogen-free, flameproof moulding compounds based on aliphatic polyketones which preferably comprise salts of phosphinic acids as flame retardant. The moulding compounds fulfil the fire protection classification V0 according to UL94 and display good mechanical properties. These moulding compounds are suitable for the production of in particular thin-walled moulded articles for the electrical and electronics industry, such as for example housings, housing components or connectors.