Abstract: The present invention relates to a polyamide moulding compound which consists of a blend of two specific polyamides. The first polyamide is thereby based substantially on 1,5-pentanediamine as diamine component used during polycondensation. The second polyamide is thereby polyamide 6I/6T. The polyamide moulding compounds according to the invention are distinguished by extremely low shrinkage and low differential shrinkage (difference between shrinkage of the moulded article longitudinally and transversely relative to the injection flow). In addition, the present invention relates to moulded articles which are producible from the polyamide moulding compounds according to the invention and also to purposes of use of the polyamide moulding compounds.

Abstract: The present invention relates to polyamide molding compounds that are characterized by high notch impact resistance and high gloss. These polyamide molding compounds comprise the following components or consist of these components: (A) 84.5 to 97.0 wt % of at least one amorphous or microcrystalline copolyamide selected from the group comprising PA 6I/6T/MACMI/MACMT/PACMI/PACMT/Y, PA 6I/6T/MACMI/MACMT/Y, and mixtures thereof; (B) 3.0 to 9.5 wt % of at least one specific functionalized impact resistance modifier; and (C) 0 to 6 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100 wt %. The present invention furthermore relates to molded bodies composed of this polyamide molding compound.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 40 to 95 wt % of a specific polyamide mixture consisting of the polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% wt %; wherein the at least one transparent polyamide (A2) has a transparency of at least 90% and a haze of at most 3%. The present invention additionally relates to molded bodies composed of this polyamide molding compound.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.540 to 1.600; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention additionally relates to molded bodies composed of these polyamide molding compounds.

Abstract: The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.510 to 1.539; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is ?2/?1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is ?2/?1?1, where ?1=n(A1)?n(B) applies and ?2=n(B)?n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention furthermore relates to molded bodies composed of these polyamide molding compounds.

Abstract: A connection device (1) for at least one plug-in portion (3) comprising an annular external groove (2) comprises a housing (7), into which at least one plug-in portion (3) can be plugged, and also at least in each case one integral locking element (9) and a securing device (15). A locking element (9) comprises a securing portion (11) and a locking portion (10) which can be preassembled in the housing (7). In the preassembled state, the locking portion (10), by elastic deflection, permits a plug-in portion (3) to be plugged into the housing (7) and brings about the locking of said plug-in portion in the housing (7). By means of the securing device (15), the securing portion (11) can be secured on an outer side of the housing opening (13) against displacement in a circumferential direction (14). A securing device (15) is designed as a ring which engages around the housing (7) and is movable on said housing (7) at least axially counter to a resistance and has an axial recess (16) in a plugging-in direction (8).

Abstract: The present invention relates to a polyamide moulding compound which consists of a blend of two specific polyamides. The first polyamide is thereby based substantially on 1,5-pentanediamine as diamine component used during polycondensation. The second polyamide is thereby polyamide 6I/6T. The polyamide moulding compounds according to the invention are distinguished by extremely low shrinkage and low differential shrinkage (difference between shrinkage of the moulded article longitudinally and transversely relative to the injection flow). In addition, the present invention relates to moulded articles which are producible from the polyamide moulding compounds according to the invention and also to purposes of use of the polyamide moulding compounds.

Abstract: A reinforced polyamide molding composition is described, particularly for use as starting material for the production of housings for devices in the field of mobile radio technology, composed of the following components: (A) from 20-45% by weight of aliphatic polyamide selected from the group consisting of: PA 610, PA 612 and mixtures thereof; (B) from 5-15% by weight of semiaromatic polyamide selected from the group consisting of: 6I, DI, 6I/6T, 6I/6T, DI/DT, DI/6T, MXD6 and mixtures thereof; (C) from 45-75% by weight of flat glass fibers with non-circular cross section, where the dimensional ratio of the major cross-sectional axis to the minor cross-sectional axis of the said cross section is in the range from 2-5; (D) from 0-10% by weight of additives; where components (A)-(D) give a total of 100% by weight.

Abstract: A polyamide moulding composition in particular for use for components in the drinking water sector, made of the following constituents: (A) from 25 to 74.9% by weight of at least one semicrystalline, semiaromatic nylon-6,T/6,I, composed of: (a1) from 65 to 82 mol % of terephthalic acid, based on the entirety of the dicarboxylic acids used; (a2) from 18 to 35 mol % of isophthalic acid, based on the entirety of the dicarboxylic acids used; (a3) 1,6-diaminohexane; (a4) at least one monobasic carboxylic acid; (a5) a phosphorus compound; with the first proviso that the molar ratio of the component (a3) to the entirety of the dicarboxylic acids used ((al) +(a2)) is at least 1.04 and at most 1.15; and with the second proviso that the molar ratio of the component (a4) to the component (a3) is in the range from 0.01 to 0.08; (B) from 25 to 60% by weight of fibrous reinforcing materials; (C) from 0 to 30% by weight of particulate fillers; (D) from 0.1 to 2.

Abstract: The invention relates to copolyamides which are formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or ?-amino acid component. Furthermore, the invention relates to a polyamide moulding compound which comprises at least one of these copolyamides. Moulded articles produced from these moulding compounds are used in the automobile field, in the domestic field, in measuring-, regulating- and control technology or in mechanical engineering.

Abstract: Thermoplastic, flameproof plastic molding materials are described having improved mechanical properties and improved surface properties, in particular for use in LDS. The thermoplastic molding compound consists of: (A) 30-84.9% by weight of a thermoplastic polymer mixture, comprising (A1) 50-90% by weight of a partially aromatic, partially crystalline polyamide or a mixture of such polyamides; (A2) 5-50% by weight of a polyphenylether or a mixture of such polyphenylethers; (A3) 0-40% by weight of a partially crystalline, aliphatic polyamide, wherein (A1)-(A3) add up to 100% by weight of component (A); (B) 15-60% by weight of glass fibers; (C) 0.1%-10% by weight of a LDS additive or a mixture of LDS additives, wherein at least one LDS additive is composed entirely or partially of inorganic compounds of copper and/or tin; (D) 0-40% by weight of a particulate filler different from (C); (F) 0-5% by weight of other additional additives; wherein the sum of (A)-(E) amounts to 100% by weight.

Abstract: Disclosed is a polyamide moulding compound formed from a mixture of partially crystalline, aliphatic polyamides and partially crystalline, partially aromatic polyamides and also fibrous reinforcing materials. The partially crystalline, partially aromatic polyamides are thereby formed from a diamine component, a dicarboxylic acid component and possibly a lactam- and/or ?-amino acid component. The mixture and/or the moulding compound can include further components. Moulded articles produced from these moulding compounds are used, for example, in the automobile sphere, in the household sphere, in measuring, regulating and control technology or in mechanical engineering.

Abstract: The invention relates to microwave-resistant mouldings comprising at least one amorphous or microcrystalline copolyamide moulding compound, comprising at least one amorphous or microcrystalline copolyamide (A), said copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine, (b) 0.25 to 30 mol % of at least one dimeric fatty acid and (c) at least one aromatic dicarboxylic acid, where the proportions of all the monomers add up to 100 mol % and which has a glass transition temperature of at least 155° C. and a dielectric loss factor tan ? of not more than 8.30×10?3. The invention also relates to the use of an amorphous or microcrystalline copolyamide moulding compound comprising the copolyamide (A) for production of microwave-resistant mouldings.

Abstract: The present invention relates to an amorphous or microcrystalline copolyamide (A) containing at least the following monomers: (a) at least one cycloaliphatic diamine; (b) 0.25 to 4.4 mol % of at least one dimeric fatty acid; and (c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid, terephthalic acid and naphthalenedicarboxylic acid, and (d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid; where the molar proportion of isophthalic acid is at least equal to the molar proportion of terephthalic acid, and where the monomers (b), (c) and optionally (d) add up to 50 mol % and the molar proportions of all the monomers present in the copolyamide (A) add up to 100 mol %. The invention further relates to moulding compounds comprising the copolyamide (A), to mouldings made therefrom and to the use thereof.

Abstract: The invention relates to a method for the production of 4,4?-methylenebis(phenylisocyanate) dimer (MDI dimer) which is distinguished by an MDI dimer being obtained which is present in high purity. The MDI dimer which is produced according to the method according to the invention is distinguished by being essentially free of MDI and also urea derivatives. Furthermore, the invention relates to a corresponding MDI dimer and also the use thereof as crosslinker for polyurethanes.

Abstract: The invention relates to a method for the continuous production of laminates made of at least two fiber bands made of fibers which are embedded unidirectionally in a plastic material matrix. Likewise, the invention relates to laminates which are produced in this way and can have a shape memory. The laminates according to the invention are used for local reinforcement of injection molded parts.

Abstract: A polyamide moulding composition with particularly good tensile strain at break consisting of the following constituents: (A) 50 to 100% by weight of at least one transparent polyamide composed of: (a1) 55 to 77 mol % of acyclic, aliphatic diamine having 5-10 carbon atoms; (a2) 23 to 45 mol % of cycloaliphatic diamine having 6-36 C atoms, where the proportions of (a1) and (a2) are based on the entirety of the diamines used; (a3) 40 to 80 mol % of aromatic dicarboxylic acid or a mixture of such dicarboxylic acids; and (a4) 20 to 60 mol % of acyclic, aliphatic dicarboxylic acid having 8 to 16 carbon atoms, or a mixture of such dicarboxylic acids, where the proportions of (a3) and (a4) are based on the entirety of the dicarboxylic acids used; and (B) 0-50% by weight of additives,; where the entirety of components (A) and (B) gives 100% by weight.

Abstract: The present invention relates to polyamide moulding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to moulded articles produced from these polyamide moulding compounds as components in the automobile or electrics/electronics sector.

Abstract: Disclosed are polyamide moulding compounds having a relative permittivity of no more than 3.5 at 2.45 GHz, and having the following components: (A) 25 to 80% by weight of a mixture made of at least one partially crystalline aliphatic polyamide and at least one amorphous or microcrystalline polyamide, (B) 20 to 65% by weight of at least one glass filler, and (C) 0 to 10% by weight of additives, the sum of components (A), (B) and (C) producing 100% by weight. The polyamide moulding compounds are for use in components of devices such as laptops and mobile phones.

Abstract: The present invention relates to polyamide molding compounds which have an improved resistance to heat-aging and comprise the following compositions: (A) 25 to 84.99 wt.-% of at least one polyamide, (B) 15 to 70 wt.-% of at least one filler and reinforcing means, (C) 0.01 to 5.0 wt.-% of at least one inorganic radical interceptor, (D) 0 to 5.0 wt.-% of at least one heat stabilizer which is different from the inorganic free-radical scavenger under (C), and (E) 0 to 20.0 wt.-% of at least one additive. The invention further relates to molded articles produced from these polyamide molding compounds as components in the automobile or electrics/electronics sector.