Patents Assigned to ENGINEER INC.
  • OPTOELECTRONIC PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240250080
    Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.
    Type: Application
    Filed: March 12, 2024
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU
  • ELECTRONIC DEVICE
    Publication number: 20240250030
    Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Chiu-Wen LEE, Yu-Hsun CHANG, Tai-Yuan HUANG
  • OPTICAL MODULE
    Publication number: 20240237907
    Abstract: An optical module is disclosed. The optical module includes a carrier, an optical device disposed over the carrier, and a sensing surface facing away from the carrier. The sensing surface includes a transmissive region and a non-transmissive region adjacent to the transmissive region.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Hsun-Wei CHAN, Hsin-Ying HO
  • OPTICAL DEVICE PACKAGE
    Publication number: 20240243207
    Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.
    Type: Application
    Filed: January 12, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Cheng TSAI, Ying-Chung CHEN, Kuo-Hua LAI
  • PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240243039
    Abstract: At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chung CHEN
  • ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240243086
    Abstract: An electronic device is disclosed. The electronic device includes a chip, a component, and a plurality of first interlayer elements. The chip has an upper surface and a first pad disposed over the upper surface. The component is disposed over the electronic component and configured to filter noise from the electronic component. The plurality of first interlayer elements connect the first pad.
    Type: Application
    Filed: January 18, 2023
    Publication date: July 18, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Hsiang HSU, Cheng-Hung KO, Jan-Feng YEN
  • SEMICONDUCTOR SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240234298
    Abstract: A semiconductor substrate structure and a method of manufacturing a semiconductor substrate structure are provided. The semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.
    Type: Application
    Filed: March 22, 2024
    Publication date: July 11, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • MEASUREMENT DEVICE FOR ANTENNA AND MEASURING RADIATION PATTERN USING THE SAME
    Publication number: 20240230739
    Abstract: A measurement device and a method of measuring a radiation pattern by using the same are provided. The measurement device includes at least one positioner configured to move a first antenna for measuring a main lobe and a back lobe of an electromagnetic wave radiated from the first antenna.
    Type: Application
    Filed: January 6, 2023
    Publication date: July 11, 2024
    Applicants: Advanced Semiconductor Engineering, Inc., National Chung Cheng University
    Inventors: Sheng-Chi HSIEH, Chen-Chao WANG, Sheng-Fuh CHANG, Chia-Chan CHANG, Shih-Cheng LIN, Yuan-Chun LIN, Wei-Lun HSU, Kuo-Hung CHENG
  • Modular structural louver and methods of use
    Patent number: 12031321
    Abstract: Disclosed are methods and apparatus for providing pre-assembled modular structural louvered systems that include structural supports and louvers, and may also include dampers, actuators and wiring in pre-assembled modules that may be transported to a building site, tilted up into place, and installed. Embodiments of the present invention also provide methods and apparatus for providing pre-assembled modular structural louvered systems which include integrated vertical and horizontal structural supports, allowing for the elimination of some vertical and horizontal wall structures in a building by relying on the structural support provided in the modular louvered systems, thereby making more space available in the building for louvers and airflow.
    Type: Grant
    Filed: May 8, 2023
    Date of Patent: July 9, 2024
    Assignee: Span Construction & Engineering, Inc.
    Inventors: Charles E. Wilson, Alexander Mankin, Ernest Brandi, David John Blink
  • OPTICAL MODULE
    Publication number: 20240219641
    Abstract: An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Ling HUANG, Ying-Chung CHEN
  • OPTICAL MODULE
    Publication number: 20240219524
    Abstract: An optical module is disclosed. The optical module includes an emitter, a receiver, and a pre-formed transparent element disposed over the emitter and the receiver. The pre-formed transparent element is configured to provide an optical guiding path within the optical module.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Hsin-Ying HO
  • OPTICAL DEVICE
    Publication number: 20240219628
    Abstract: An optical device is provided. The optical device includes a first photonic component; a first electronic component at least partially over the first photonic component; and an optical connection element at least partially over the first photonic component, the optical connection element being separated from the first electronic component.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Sin-Yuan MU, Chia-Sheng CHENG
  • ELECTRONIC DEVICE WITH ELECTROMAGNET
    Publication number: 20240224483
    Abstract: An electronic device includes a coil element configured to provide an electromagnetic field, a housing with an EMI shielding layer covering the coil element and a barrier configured to block an electromagnetic induction effect caused by the electromagnetic field and the EMI shielding layer.
    Type: Application
    Filed: December 28, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chin Han CHEN
  • ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240222306
    Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.
    Type: Application
    Filed: March 19, 2024
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Jen WANG, Yi Dao WANG, Tung Yao LIN
  • OPTICAL DEVICE
    Publication number: 20240222543
    Abstract: An optical device includes an emitter, a receiver, a transparent element, and a block layer. The transparent element is disposed over the emitter and the receiver. The transparent element defines a recess between the emitter and the receiver. The block layer is conformally disposed over the transparent element and the recess.
    Type: Application
    Filed: December 30, 2022
    Publication date: July 4, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chung CHEN
  • Vehicle leveler with wheel chock
    Patent number: 12024411
    Abstract: The device includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is removably attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion also includes an extension portion. The first portion and second portion are separate from each other until they are removably attached by a connection apparatus. The device also includes at least one wheel chock with a corresponding wheel-chock track.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: July 2, 2024
    Assignee: Leum Engineering, Inc.
    Inventors: Grant Leum, Eric Demerath
  • Sway bar bushing bracket with tow hook
    Patent number: 12023979
    Abstract: Currently, some work vehicles and/or off-road vehicles come from the manufacturer lacking tow hooks—or even a strong point on the rear bumper assembly and/or the chassis to install a tow hook. A non-limiting example of this sort of vehicle is the Toyota Tundra. It is highly desirable for such a vehicle to be able to be towed by another vehicle and/or have connection points for recovery from stuck in a natural hazard like mud or water. A novel and improved sway bar bushing bracket with a tow hook design is disclosed. In particular, the manufacturer-installed sway bar bushing bracket may be replaced with a reinforced sway bar bushing bracket with an integrated tow hook that may serve as a more robust sway bar bushing bracket, as well as providing a strong connection point with a tow hook.
    Type: Grant
    Filed: October 28, 2022
    Date of Patent: July 2, 2024
    Assignee: Advanced Flow Engineering, Inc.
    Inventors: James Erik Provencher, Saul Zambrano, Shahriar Nick Niakan, Stuart Miyagishima, John Gray
  • CURVED BASE AIR FILTER
    Publication number: 20240209817
    Abstract: An apparatus and methods are provided for an air cleaner to be mounted onto an air inlet of an internal combustion engine. The air cleaner comprises an air filter that includes a filter medium disposed between a curved base and a cover. The curved base provides an interface between the air filter and the air inlet, and comprises a shape that provides clearance between the curved base and an electric choke installed onto a carburetor comprising the air inlet. The cover secures the air filter and the curved base to the air inlet such that an airstream is drawn through the filter medium and is conducted into the air inlet. A raised portion of the cover is configured to cooperate with the curved base to ensure a desired volume of the airstream is available to the air inlet at substantially all engine speeds.
    Type: Application
    Filed: March 11, 2024
    Publication date: June 27, 2024
    Applicant: K&N Engineering, Inc.
    Inventors: Steve E. Williams, Jere James Wall
  • Sterilization deodorizer
    Patent number: D1033619
    Type: Grant
    Filed: August 5, 2022
    Date of Patent: July 2, 2024
    Assignee: Sunstar Engineering Inc.
    Inventor: Natsumi Suzuki
  • Tow hook
    Patent number: D1034410
    Type: Grant
    Filed: October 18, 2022
    Date of Patent: July 9, 2024
    Assignee: Advanced Flow Engineering, Inc.
    Inventors: James Erik Provencher, Saul Zambrano, Shahriar Nick Niakan, Stuart Miyagishima, John Gray