Patents Assigned to ENGINEER INC.
-
Publication number: 20240264369Abstract: An optoelectronic package includes a first photonic component, an optical connection element and an optical component. The optical connection element is disposed at least partially over the first photonic component. The optical component is disposed at least partially over the first photonic component. The optical connection element and the optical component are spaced apart from each other.Type: ApplicationFiled: February 3, 2023Publication date: August 8, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Wen Chieh YANG
-
Patent number: 12053192Abstract: Described herein are systems, devices, and methods for removing material from patient vasculature. In some embodiments, an aspiration device may include a sheath and a catheter slidably disposed within the sheath and defining a lumen. The catheter may include a distal end portion and an elongate portion, the distal end portion being disposable adjacent to a clot, the elongate portion being couplable to a vacuum source that is configured to apply a negative pressure to the lumen to draw the clot into the distal end portion. The distal end portion may include a plurality of sections, each of the plurality of sections having a different cut pattern.Type: GrantFiled: September 1, 2023Date of Patent: August 6, 2024Assignee: Endovascular Engineering, Inc.Inventors: Scott J. Baron, Michael Rosenthal, David Snow, Brian Domecus, Joshua Michael Stafford
-
Publication number: 20240258229Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.Type: ApplicationFiled: April 9, 2024Publication date: August 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yi Chun CHOU
-
Publication number: 20240254952Abstract: An apparatus and methods are provided for a throttle body spacer that improves the performance of an internal combustion engine. The throttle body spacer comprises a body that includes an airflow opening for conducting airflow from a throttle body into an intake manifold. A spiral is disposed along a sidewall of the airflow opening and configured for swirling the airflow. The spiral comprises a helical shape disposed around a circumference of the sidewall and extends from an initial bore near a first contact surface of the body to a second contact surface. The helical shape includes a diameter that increases as the spiral extends toward the second contact surface, giving the body a sidewall taper angle that contributes to an increase in power output of the engine. A sawtooth cross-sectional shape of the spiral causes the airflow to swirl so as to improve atomization of an air-fuel mixture entering engine.Type: ApplicationFiled: January 10, 2024Publication date: August 1, 2024Applicant: K&N Engineering, Inc.Inventor: Jonathan Richard Fiello
-
Publication number: 20240255971Abstract: An apparatus and methods are provided for a portable mass airflow (MAF) training module configured to simulate an air intake into an internal combustion engine. An in-line blower draws an airflow through an air filter by way of a first air duct and a second air duct. A throttle assembly is coupled between the first air duct and the second air duct. The throttle assembly includes a throttle plate that may be rotated to regulate the airflow. The power output of the in-line blower is variable to simulate the air intake of various sizes of the internal combustion engine. A MAF sensor and a duct velocity sensor are configured to provide airflow information. The portable MAF training module enables a practitioner to select a desired throttle setting and observe a resultant mass airflow through the portable MAF training module that is measured by the MAF sensor.Type: ApplicationFiled: April 12, 2024Publication date: August 1, 2024Applicant: K&N Engineering, Inc.Inventors: Mac McClanahan, Steve Williams, Joel Valles
-
Publication number: 20240260181Abstract: A semiconductor package device includes a first dielectric layer, a first interconnection layer, a second interconnection layer, and a second dielectric layer. The first dielectric layer has a first surface, a second surface opposite to the first surface and a lateral surface extending between the first surface and the second surface. The first interconnection layer is within the first dielectric layer. The second interconnection layer is on the second surface of the first dielectric layer and extends from the second surface of the first dielectric layer into the first dielectric layer to electrically connect to the first interconnection layer. The second dielectric layer covers the second surface and the lateral surface of the first dielectric layer and the second interconnection layer.Type: ApplicationFiled: April 9, 2024Publication date: August 1, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Ze LIN, Chia Ching CHEN, Yi Chuan DING
-
Publication number: 20240250053Abstract: A semiconductor device includes a semiconductor die having a first surface and a second surface opposite to the first surface, a plurality of first real conductive pillars in a first region on the first surface, and a plurality of supporters in a second region adjacent to the first region. An area density of the plurality of supporters in the second region is in a range of from about 50% to about 100% to an area density of the plurality of first real conductive pillars in the first region. A method for manufacturing a semiconductor package including the semiconductor device is also disclosed in the present disclosure.Type: ApplicationFiled: March 5, 2024Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Hsin He HUANG
-
Publication number: 20240249958Abstract: A method for manufacturing a semiconductor package and an apparatus for flattening a workpiece are provided. The method includes providing a panel over a stage, wherein the panel includes a lower surface facing the stage and an upper surface opposite to the lower surface; applying a first force to a first region of the upper surface of the panel along at least one direction from the panel toward the stage; and transferring the first force from the first region to a second region of the upper surface of the panel different from the first region.Type: ApplicationFiled: January 20, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ya Fang CHAN, Cong-Wei CHEN, Kuoching CHENG, Shih-Yu WANG
-
Publication number: 20240250030Abstract: An electronic device is provided. The electronic device includes an inductor and a dielectric layer. The inductor includes a first magnetic layer, a conductive trace over the first magnetic layer, and a second magnetic layer over the conductive trace. The dielectric layer includes a first portion between the second magnetic layer and an inclined surface of the first magnetic layer. A substantially constant distance between the second magnetic layer and the inclined surface of the first magnetic layer is defined by the dielectric layer.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Chiu-Wen LEE, Yu-Hsun CHANG, Tai-Yuan HUANG
-
Publication number: 20240250080Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.Type: ApplicationFiled: March 12, 2024Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
-
Publication number: 20240247620Abstract: An apparatus and method are provided for a fuel bowl to supply liquid fuel to a carburetor. The fuel bowl comprises a float chamber and a fuel inlet cavity which receives a fuel delivery insert. The fuel delivery insert receives a fuel inlet valve and comprises passages to direct incoming fuel to a bottom portion of the float chamber. A float comprises an elongate member rotatably hinged within a float cavity of the fuel delivery insert, such that the float rises according to a quantity of fuel within the float chamber. The fuel inlet valve supplies liquid fuel to the float chamber by way of the passages according to the operation of the float within the float chamber. A ventilation chamber allows air and fuel vapors to exit as liquid fuel enters the float chamber while preventing liquid fuel from entering into the carburetor.Type: ApplicationFiled: April 1, 2024Publication date: July 25, 2024Applicant: K&N Engineering, Inc.Inventor: John Kyle
-
Publication number: 20240250427Abstract: The present disclosure provides an electronic device. The electronic device includes an antenna. The antenna includes a first conductive element, a second conductive element, and a switch circuit. The first conductive element is configured to transmit a first signal along a first direction. The second conductive element is configured to transmit a second signal along a second direction different from the first direction. The switch circuit is configured to electrically couple a ground to the first conductive element and/or the second conductive element.Type: ApplicationFiled: January 23, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Hao CHANG, Wei-Chun LEE
-
Publication number: 20240249988Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a substrate, an electronic component, an intermediate structure and a protective layer. The electronic component is disposed over the substrate. The intermediate structure is disposed over the substrate and comprises an interposer and a conductive element on the interposer. The protective layer is disposed over the substrate and has an upper surface covering the electronic component and being substantially level with an upper surface of the conductive element.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yu-Chang CHEN, Wei-Tung CHANG, Jen-Chieh KAO
-
Publication number: 20240250006Abstract: The present disclosure provides a package structure. The package structure includes a die bonding region and a first lead region. The first lead region extends along a first direction. The first direction is along a first edge of the die bonding region. The first lead region includes a first high density lead region and a first low density lead region. The first high density lead region overlaps the first low density lead region in the first direction.Type: ApplicationFiled: January 19, 2023Publication date: July 25, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: I-Jen CHEN
-
Publication number: 20240237907Abstract: An optical module is disclosed. The optical module includes a carrier, an optical device disposed over the carrier, and a sensing surface facing away from the carrier. The sensing surface includes a transmissive region and a non-transmissive region adjacent to the transmissive region.Type: ApplicationFiled: January 12, 2023Publication date: July 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Chieh TANG, Hsun-Wei CHAN, Hsin-Ying HO
-
Publication number: 20240243086Abstract: An electronic device is disclosed. The electronic device includes a chip, a component, and a plurality of first interlayer elements. The chip has an upper surface and a first pad disposed over the upper surface. The component is disposed over the electronic component and configured to filter noise from the electronic component. The plurality of first interlayer elements connect the first pad.Type: ApplicationFiled: January 18, 2023Publication date: July 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Hsiang HSU, Cheng-Hung KO, Jan-Feng YEN
-
Publication number: 20240243207Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.Type: ApplicationFiled: January 12, 2023Publication date: July 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsiang-Cheng TSAI, Ying-Chung CHEN, Kuo-Hua LAI
-
Publication number: 20240243039Abstract: At least some embodiments of the present disclosure relate to an electronic structure. The package structure includes a lead frame, an electronic component, and a conductive wire physically and electrically connecting the electronic component to the lead frame. An elevation of a first end of the conductive wire is substantially equal to an elevation of a second end of the conductive wire.Type: ApplicationFiled: January 18, 2023Publication date: July 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ying-Chung CHEN
-
Publication number: 20240230739Abstract: A measurement device and a method of measuring a radiation pattern by using the same are provided. The measurement device includes at least one positioner configured to move a first antenna for measuring a main lobe and a back lobe of an electromagnetic wave radiated from the first antenna.Type: ApplicationFiled: January 6, 2023Publication date: July 11, 2024Applicants: Advanced Semiconductor Engineering, Inc., National Chung Cheng UniversityInventors: Sheng-Chi HSIEH, Chen-Chao WANG, Sheng-Fuh CHANG, Chia-Chan CHANG, Shih-Cheng LIN, Yuan-Chun LIN, Wei-Lun HSU, Kuo-Hung CHENG
-
Publication number: 20240234298Abstract: A semiconductor substrate structure and a method of manufacturing a semiconductor substrate structure are provided. The semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.Type: ApplicationFiled: March 22, 2024Publication date: July 11, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wen Hung HUANG
