Abstract: Disclosed are methods and apparatus for providing pre-assembled modular structural louvered systems that include structural supports and louvers, and may also include dampers, actuators and wiring in pre-assembled modules that may be transported to a building site, tilted up into place, and installed. Embodiments of the present invention also provide methods and apparatus for providing pre-assembled modular structural louvered systems which include integrated vertical and horizontal structural supports, allowing for the elimination of some vertical and horizontal wall structures in a building by relying on the structural support provided in the modular louvered systems, thereby making more space available in the building for louvers and airflow.

Abstract: An electronic device includes a coil element configured to provide an electromagnetic field, a housing with an EMI shielding layer covering the coil element and a barrier configured to block an electromagnetic induction effect caused by the electromagnetic field and the EMI shielding layer.

Abstract: An electronic package structure and a method for manufacturing the same are provided. The electronic package structure includes a first electronic component, a second electronic component, an interconnection element, an insulation layer, and an encapsulant. The second electronic component is disposed adjacent to the first electronic component. The interconnection element is disposed between the first electronic component and the second electronic component. The insulation layer is disposed between the first electronic component and the second electronic component and has a side surface and a top surface connecting to the side surface. The encapsulant surrounds the interconnection element and at least partially covers the top surface of the insulation layer and has an extended portion in contact with the side surface of the insulation layer.

Abstract: An optical module is disclosed. The optical module includes an emitter, a receiver, and a pre-formed transparent element disposed over the emitter and the receiver. The pre-formed transparent element is configured to provide an optical guiding path within the optical module.

Abstract: An optical device includes an emitter, a receiver, a transparent element, and a block layer. The transparent element is disposed over the emitter and the receiver. The transparent element defines a recess between the emitter and the receiver. The block layer is conformally disposed over the transparent element and the recess.

Abstract: An optical module is disclosed. The optical module includes a carrier and a lid disposed over the carrier. The carrier and the lid are collaboratively define a first cavity for accommodating a photonic component. The optical module also includes a first electrical contact disposed over a first side of the lid and configured to provide an electronic connection for the optical module. A first aperture penetrating the lid is formed at the first side of the lid and corresponds to a light transmission/reception area of the photonic component.

Abstract: An optical device is provided. The optical device includes a first photonic component; a first electronic component at least partially over the first photonic component; and an optical connection element at least partially over the first photonic component, the optical connection element being separated from the first electronic component.

Abstract: The device includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is removably attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion also includes an extension portion. The first portion and second portion are separate from each other until they are removably attached by a connection apparatus. The device also includes at least one wheel chock with a corresponding wheel-chock track.

Abstract: Currently, some work vehicles and/or off-road vehicles come from the manufacturer lacking tow hooks—or even a strong point on the rear bumper assembly and/or the chassis to install a tow hook. A non-limiting example of this sort of vehicle is the Toyota Tundra. It is highly desirable for such a vehicle to be able to be towed by another vehicle and/or have connection points for recovery from stuck in a natural hazard like mud or water. A novel and improved sway bar bushing bracket with a tow hook design is disclosed. In particular, the manufacturer-installed sway bar bushing bracket may be replaced with a reinforced sway bar bushing bracket with an integrated tow hook that may serve as a more robust sway bar bushing bracket, as well as providing a strong connection point with a tow hook.

Abstract: The present disclosure provides an electronic device and a method of manufacturing the same. The electronic device includes a first redistribution structure and a first encapsulant. The first encapsulant supports the first redistribution structure and is configured to function as a first reinforcement to provide a second redistribution structure. The redistribution structure has a plurality of conductive layers disposed over the first redistribution structure.

Abstract: A package is provided. The package includes a carrier, a component, and a first protective element. The component is disposed over the carrier and having a side surface configured for optically coupling. The first protective element is disposed between the carrier and the component. The side surface of the component is free from being in contact with the first protective element.

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

Abstract: A filter oil composition and a method for removing airborne molecular contaminants from air are provided. The composition includes a first portion comprising paraffinic oil by volume of the composition, a second portion comprising polyalphaolefin by volume of the composition, and a third portion comprising red dye by volume of the composition. Applying the filter oil composition to a cotton air filter material causes tackiness throughout the air filter material, thereby enhancing filtration of air passing through the filter. The composition generally is substantially non-reactive, has excellent oxidation stability, possesses good thermal stability, and retains a suitable viscosity at a normal operating temperature of an automobile engine. In an embodiment, the composition comprises 96.74% paraffinic oil by volume, 3.20% polyalphaolefin by volume, and 0.06% red dye by volume. The viscosity of the composition at 100 degrees-C. ranges between substantially 7.2 and 7.6 centistokes (cSTs).

Abstract: An apparatus and methods are provided for an air cleaner to be mounted onto an air inlet of an internal combustion engine. The air cleaner comprises an air filter that includes a filter medium disposed between a curved base and a cover. The curved base provides an interface between the air filter and the air inlet, and comprises a shape that provides clearance between the curved base and an electric choke installed onto a carburetor comprising the air inlet. The cover secures the air filter and the curved base to the air inlet such that an airstream is drawn through the filter medium and is conducted into the air inlet. A raised portion of the cover is configured to cooperate with the curved base to ensure a desired volume of the airstream is available to the air inlet at substantially all engine speeds.

Abstract: The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive layer on the first surface, and a second patterned conductive layer on the second surface. The first conductive via includes a bottom pattern on the first surface and a second patterned conductive layer on the second surface. The bottom pattern has at least two geometric centers corresponding to at least two geometric patterns, respectively, and a distance between one geometric center and an intersection of the two geometrical patterns is a geometric radius. A distance between the at least two geometric centers is greater than 1.4 times the geometric radius. A method for manufacturing the semiconductor substrate described herein and a semiconductor package structure having the semiconductor substrate are also provided.

Abstract: An optoelectronic device package includes a first redistribution layer (RDL), a first electronic die disposed over the first RDL, wherein an active surface of the first electronic die faces the first RDL. The optoelectronic device package further includes a second electronic die disposed over the first RDL, and a photonic die disposed over and electrically connected to the second electronic die. An active surface of the second electronic die is opposite to the first RDL.

Abstract: The present disclosure provides a semiconductor device package including a carrier, an electronic component, and a shielding layer. The carrier includes a predetermined non-shielding region. The electronic component is disposed over the predetermined non-shielding region. The shielding layer includes a first portion disposed over the predetermined non-shielding region.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface, an electrical contact disposed over a first region of the substrate, and an EMI shielding layer disposed over the substrate. The EMI shielding layer includes a non-uniform thickness and an elevation of the EMI shielding layer is higher than an elevation of the electrical contact with respect to the first surface of the substrate. A method for manufacturing a semiconductor device package is also disclosed.