Abstract: At least some embodiments of the present disclosure relate to a wiring structure and a method for manufacturing a wiring structure. The wiring structure includes a conductive structure, a first fan-out structure, and a second fan-out structure. The first fan-out structure is disposed on the conductive structure and includes a first circuit layer. The second fan-out structure is disposed on the conductive structure, and includes a second circuit layer. A thickness of the first circuit layer is different from a thickness of the second circuit layer.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a carrier, a first encapsulant, and an interposer. The first encapsulant is on the carrier and defines a cavity. The interposer is disposed between the first encapsulant and the cavity. The first encapsulant covers a portion of the interposer.

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

Abstract: A method for manufacturing a semiconductor package structure and a semiconductor manufacturing apparatus are provided. The method includes: (a) providing a package body disposed on a chuck, wherein the package body includes at least one semiconductor element encapsulated in an encapsulant; and (b) sucking the package body through the chuck to create a plurality of negative pressures on a bottom surface of the package body sequentially from an inner portion to an outer portion of the package body.

Abstract: A semiconductor device package includes a display device, an encapsulation layer disposed in direct contact with the display device, and a reinforced structure surrounded by the encapsulation layer. The reinforced structure is spaced apart from a surface of the display device. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: A sealed intake air system incorporates a positive connection seal interface between the air filter and the airbox with captive fasteners to provide a positive connection between the air filter and the one-piece airbox.

Abstract: An apparatus and method are provided for a fuel bowl to supply liquid fuel to a carburetor. The fuel bowl comprises a float chamber and a fuel inlet cavity which receives a fuel delivery insert. The fuel delivery insert receives a fuel inlet valve and comprises passages to direct incoming fuel to a bottom portion of the float chamber. A float comprises an elongate member rotatably hinged within a float cavity of the fuel delivery insert, such that the float rises according to a quantity of fuel within the float chamber. The fuel inlet valve supplies liquid fuel to the float chamber by way of the passages according to the operation of the float within the float chamber. A ventilation chamber allows air and fuel vapors to exit as liquid fuel enters the float chamber while preventing liquid fuel from entering into the carburetor.

Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.

Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.

Abstract: A system and method for detecting dynamic strain of a housing. The system includes an optical fiber linearly affixed along a surface of a length of the housing and an interrogator comprising a laser source and a photodetector. The optical fiber comprises at least one pair of fiber Bragg gratings (FBGs) tuned to reflect substantially identical wavelengths with a segment of the optical fiber extending between the FBGs. The segment of the optical fiber is linearly affixed along the surface of the housing. The interrogator is configured to perform interferometry by shining laser light along the optical fiber and detecting light reflected by the FBGs. The interrogator outputs dynamic strain measurements based on interferometry performed on the reflected light.

Abstract: Systems, devices, and methods for passing railcar tank cleaning systems through the opening and mounted to existing manways. The invention can extend horizontally more than 25 feet and clean rail cars up to and beyond approximately 102 inches in diameter for manual, automated, or semi-automated programmable railcar tank cleaning systems, devices and methods for providing safe and efficient methods for breaking up oil, tar, chemical, radioactive, hazardous, or any other liquid, solid, or sludge waste inside rail tank cars and the like with nozzles which utilize fluid jets to break up, liquefy, and motivate tank material. The programmable railcar cleaning system can be a standalone, independent unit or integrated into new designs and/or existing systems. Simplified programming and user interface allow an operator to remotely operate the system. The various capabilities of this invention allow cleaning in a quicker and more efficient manner.

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a substrate structure, a redistribution structure, an adhesive layer and at least one conductive pillar. The redistribution structure includes at least one dielectric layer. The at least one dielectric layer defines at least one through hole extending through the dielectric layer. The adhesive layer is disposed between the redistribution structure and the substrate structure and bonds the redistribution structure and the substrate structure together. The at least one conductive pillar extends through the redistribution structure and the adhesive layer and is electrically connected to the substrate structure. A portion of the at least one conductive pillar is disposed in the through hole of the at least one dielectric layer.

Abstract: An apparatus and method are provided for a cone air filter for a closed intake system of an internal combustion engine. The cone air filter is comprised of a cone-shaped filter medium, retained between a base and a cap, that is fabricated to remove contaminants and particulate matter from an intake airstream. The base is comprised of a flange that couples with an air intake duct of the internal combustion engine. A shell receiver is incorporated into the base and receives a rigid exterior shell, such that the exterior shell surrounds the cone air filter and directs the intake airstream therein. A cap is disposed on an apex portion of the cone air filter and is configured to direct the intake airstream around the apex portion and into the cone-shaped filter medium.

Abstract: A semiconductor device package includes a carrier, a semiconductor device, a lid, a conductive post, a first patterned conductive layer, a conductive element disposed between the first conductive post and the first patterned conductive layer, and an adhesive layer disposed between the lid and the carrier. The conductive post is electrically connected to the first patterned conductive layer. The semiconductor device is electrically connected to the first patterned conductive layer. The lid is disposed on the carrier, and the lid includes a second patterned conductive layer electrically connected to the first conductive post.

Abstract: The present invention relates to a thermal management system and a thermal management method for cooling a heat-generating electronic device such as a battery and for extinguishing a fire occurring in the heat-generating electronic device. More particularly, the present invention relates to a thermal management system and a thermal management method that are capable of cooling a heat-generating electronic device such as a battery of an energy storage system (ESS) in various ways at multiple stages and of extinguishing a fire in the heat-generating electronic device. The present invention has an effect of preventing fire by cooling a heating-generating element such as a battery of an energy storage device. In addition, the present invention has an effect of stopping a cooling operation and starting a fire extinguishing operation when a fire occurs during the cooling operation.

Abstract: An apparatus and a method are provided for an air box with an integrated air filter to communicate air flow from an exterior of the air filter to an air intake of an automobile engine. The air filter comprises a filter material that surrounds at least a portion of an interior cavity of the air filter. An end cap is affixed to a distal end of the filter material, and a wire support extends along at least a portion of the exterior surface of the filter material. The air box comprises a housing portion and a mount portion. The housing portion is configured to direct air drawn through the filter material into the interior cavity of the air filter and then into the air intake of the automobile engine. The mount portion is configured to support the air box and the air filter once installed within an automobile engine bay.

Abstract: A substrate structure, a semiconductor package structure including the same and a method for manufacturing the same are provided. The substrate structure includes a first passivation layer, a first circuit layer and a first protection layer. The first passivation layer has a first surface and a second surface opposite to the first surface. The first circuit layer has an outer lateral surface. A first portion of the first circuit layer is disposed in the first passivation layer. The first protection layer is disposed on a second portion of the first circuit layer and exposed from the first surface of the first passivation layer. The outer lateral surface of the first circuit layer is covered by the first passivation layer or the first protection layer.