Abstract: A substrate structure, a semiconductor package structure including the same and a method for manufacturing the same are provided. The substrate structure includes a first passivation layer, a first circuit layer and a first protection layer. The first passivation layer has a first surface and a second surface opposite to the first surface. The first circuit layer has an outer lateral surface. A first portion of the first circuit layer is disposed in the first passivation layer. The first protection layer is disposed on a second portion of the first circuit layer and exposed from the first surface of the first passivation layer. The outer lateral surface of the first circuit layer is covered by the first passivation layer or the first protection layer.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The method includes: providing a package body includes a first semiconductor device, wherein the first semiconductor device includes a plurality of first electrical contacts disposed adjacent to an active surface of the first semiconductor device; measuring the actual positions of the first electrical contacts of the first semiconductor device; providing a plurality of second electrical contacts outside the first semiconductor device; and forming an interconnection structure based on the actual positions of the first electrical contacts of the first semiconductor device and the positions of the second electrical contacts satisfying a predetermined electrical performance criterion by a mask-less process, so as to connect the first electrical contacts and the second electrical contacts and maintain signal integrity during transmission.

Abstract: A 2-phase bipolar step motor has a rotor and a stator, the rotor having a plurality of equally spaced rotor poles of alternating north and south magnetic polarities, and the stator having at least eight stator poles extending radially from a stator yoke and terminating in pole shoes interacting radially across an air gap with the rotor poles to cause the rotor to rotate step-by-step when windings around the stator poles are driven by a succession of energized states of the stator. The stator poles divided into four equal groups having a specified drive phase A or B, adjacent poles of a group having alternating drive polarities of the same drive phase A and ?, or B and B. Adjacent poles in the same group are separated by a center-to-center angle one-half of the rotor tooth pitch or up to 20% larger. Adjacent poles of different groups have a larger separation than that between poles of the same group.

Abstract: An electronic package and manufacturing method thereof are provided. The electronic package includes a substrate, a first encapsulant, a wettable flank and a shielding layer. The substrate includes a first surface, a second surface opposite to the first surface and a side surface connecting the first surface and the second surface. The first encapsulant is disposed on the first surface of the substrate. The wettable flank is exposed from the side surface of the substrate. The shielding layer covers a side surface of the first encapsulant, wherein on the side surface of the substrate, the shielding layer is spaced apart from the wettable flank.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first conductive component, a second conductive component, a planarization layer and an antenna layer. The second conductive component is disposed adjacent to the first conductive component. The second conductive component and the first conductive component have different thicknesses. The planarization layer is disposed on the first conductive component. The antenna layer is disposed on the first conductive component and the second conductive component.

Abstract: An optical package structure and a method for manufacturing an optical package structure are provided. The optical package structure includes a sensor, an optical component and a fixing element. The optical component directly contacts the sensor. An interfacial area is defined by a contacting region of the optical component and the sensor. The fixing element is disposed outside of the interfacial area for bonding the optical component and the sensor.

Abstract: A semiconductor device package includes a first circuit layer, a first emitting device and a second emitting device. The first circuit layer has a first surface and a second surface opposite to the first surface. The first emitting device is disposed on the second surface of the first circuit layer. The first emitting device has a first surface facing the first circuit layer and a second surface opposite to the first surface. The first emitting device has a first conductive pattern disposed on the first surface of the first emitting device. The second emitting device is disposed on the second surface of the first emitting device. The second emitting device has a first surface facing the second surface of the first emitting device and a second surface opposite to the first surface. The second emitting device has a second conductive pattern disposed on the second surface of the emitting device.

Abstract: An antenna package includes a conductive layer, an interconnection structure and an antenna. The interconnection structure is disposed on the conductive layer. The interconnection structure includes a conductive via and a first package body. The conductive via has a first surface facing the conductive layer, a second surface opposite to the first surface and a lateral surface extending from the first surface to the second surface. The first package body covers the lateral surface of the conductive via and exposes the first surface and the second surface of the conductive via. The first package body is spaced apart from the conductive layer. The antenna is electrically connected to the second surface of the conductive via.

Abstract: A novel clinical decision support system (CDS) helps the clinician setup, maintain, and interpret esophageal pressure measurement. The esophageal pressure CDS (Pes CDS) would remind the clinician to do an occlusion test whenever the balloon is first inserted or changes dramatically. It could monitor the occlusion test and provide feedback on the performance and success of the occlusion test. Changes in the patient or monitored data can be tracked by looking for changes in the balloon baseline pressure, changes in the amplitude of the pressure waveform, or changes in the pattern of the Pes waveform. Having information from the ventilator will further increase the ability of the system to determine when Pes is changing unexpectedly.

Abstract: The vehicle leveler includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge and forms a ramp section. The first portion has a flat section adjacent the trailing edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion includes an extension portion. The vehicle leveler also has at least one drainage aperture which is formed within and extends through the second portion for improved user safety.

Abstract: A semiconductor package structure, an electronic device, and method for manufacturing the same are provided. The semiconductor package structure includes a wiring structure, a first electronic device, a second electronic device, and a protection material. The first electronic device is disposed on the wiring structure. The second electronic device is disposed on the wiring structure. The second electronic device defines a plurality of recesses on a first lateral side surface thereof. The protection material is disposed on the wiring structure and encapsulates the recesses of the second electronic device.

Abstract: An electronic device and a method for manufacturing an electronic device are provided. The electronic device includes an inductor. The inductor includes a plurality of line portions and a plurality of plate portions connected to the plurality of line portions. The line portions and the plate portions form a coil concentric to a horizontal axis.

Abstract: A wafer supporting mechanism and a method for wafer dicing are provided. The wafer supporting mechanism includes a base portion and a support portion. The base portion includes a first gas channel and a first outlet connected to the first gas channel. The support portion is connected to the base portion and including a second gas channel connected to the first gas channel. An accommodation space is defined by the base portion and the support portion.

Abstract: An electronic package and method for manufacturing the same are provided. The electronic package includes a first conductive structure, a second conductive structure, an electronic component, an underfill and a dam structure. The second conductive structure is disposed on the first conductive structure, wherein the second conductive structure defines a cavity over the first conductive structure. The electronic component is disposed on the first conductive structure and at least partially disposed in the cavity. The underfill is disposed between the first conductive structure and the electronic component. The dam structure is disposed on the first conductive structure and configured to confine the underfill.

Abstract: A semiconductor device package includes a display device, an electronic module and a conductive adhesion layer. The display device includes a first substrate and a TFT layer. The first substrate has a first surface and a second surface opposite to the first surface. The TFT layer is disposed on the first surface of the first substrate. The electronic module includes a second substrate and an electronic component. The second substrate has a first surface facing the second surface of the first substrate and a second surface opposite to the first surface. The electronic component is disposed on the second surface of the second substrate. The conductive adhesion layer is disposed between the first substrate and the second substrate.

Abstract: A semiconductor package is provided. The semiconductor package includes a first conductive layer, a plurality of first conductive pads, a plurality of second conductive pads, and a first dielectric layer. The first conductive pads are electrically connected to the first conductive layer. The second conductive pads are electrically disconnected from the first conductive layer.

Abstract: A package structure and a method for manufacturing the same are provided. The package structure includes a redistribution structure, a first electronic device, at least one second electronic device, a protection material, a heat dissipation structure and a reinforcement structure. The first electronic device is disposed on the redistribution structure. The second electronic device is disposed on the redistribution structure. The protection material is disposed between the first electronic device and the second electronic device. The heat dissipation structure is disposed on the first electronic device and the second electronic device. The reinforcement structure is disposed in an accommodating space between the heat dissipation structure and the protection material.

Abstract: A package substrate and manufacturing method thereof are provided. The package substrate includes a substrate and an electronic component. The substrate includes a cavity. The electronic component is disposed in the cavity. The electronic component includes a first region and a second region, and an optical recognition rate of the first region is distinct from that of the second region.

Abstract: A pleat counter and methods are provided to accurately count the number of pleats in a corrugated sheet of material to be used for the production of air filters. The pleat counter comprises a pleat detector mounted underneath a mounting board for counting the pleats. The mounting board is configured to position the pleat detector adjacent to the corrugated sheet of filter material. The pleat detector includes one or more sensors configured to detect the presence of individual pleats comprising the corrugated sheet. The pleat counter includes an interface configured to enable coupling the pleat counter with a data processing system. The data processing system may comprise any of a desktop, a tablet, a server, a mobile phone, a media player, a personal digital assistant (PDA), a personal communicator, a network router or hub, a wireless access point (AP) or repeater, a set-top box, or a combination thereof.

Abstract: One or more seals may be provided in a gap sub to prevent the ingress of drilling fluid into an insulating gap between a male member of the gap sub and a female member of the gap sub. A first seal may comprise an internal gap sub seal provided near the tip of the male member of the gap sub. A second seal may comprise an external gap sub seal provided near the tip of the female member of the gap sub. The first and second seals may comprise non-conductive materials. The first and second seals may each comprise one or more O-rings. The first and second seals may comprise one or more lips, protrusions or flanges to engage the male and/or female members of the gap sub for maintaining contact with the male and/or female members during deformation of the gap sub.