Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.

Abstract: A package structure is provided. The package structure includes a substrate, a conductive pad, and a conductive wire. The conductive pad is disposed over the substrate. The conductive wire includes an end portion connected to the conductive pad, wherein a grain arrangement of the end portion is distinct from a grain arrangement of the conductive pad.

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.

Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component, a first conductive element, and a voltage regulator. The voltage regulator is disposed adjacent to the first electronic component. The voltage regulator is configured to regulate a first voltage from the first EMI shielding layer and to provide the first electronic component with a second voltage.

Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.

Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a first die, a second die, and a third die. The first die is disposed below the first circuit structure. The second die is disposed below the first circuit structure. The third die is disposed above the first circuit structure and electrically connects the first die to the second die. The first die communicates with the second die through the third die.

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first region and a second region distinct from the first region. The electronic device also includes an electronic component covering the first region and at least partially exposing the second region. The electronic device also includes a first power regulating element in the second region of the carrier and a second power regulating element. The second power regulating element is disposed adjacent to the first power regulating element and electrically connected to the electronic component through the first power regulating element to provide a first power path.

Abstract: A package structure includes a wiring structure, a first electronic device, a second electronic device and a reinforcement structure. The wiring structure includes at least one dielectric layer, and at least one circuit layer in contact with the dielectric layer. The at least one circuit layer includes at least one interconnection portion. The first electronic device and the second electronic device are electrically connected to the wiring structure. The second electronic device is electrically connected to the first electronic device through the at least one interconnection portion of the at least one circuit layer. The reinforcement structure is disposed above the at least one interconnection portion of the at least one circuit layer.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.

Abstract: Provided herein are resonance-enabled machines, comprising one or more voice coil actuators mounted on a non-moving mass, such as a housing, one or more moving masses, and one or more pluralities of springs coupling the non-moving mass to the one or more moving masses. One or more of the moving masses can perform a specific task. For example, the moving mass may drive a pump as a vacuum pump or a compressor. The moving mass may drive a hammer chisel, for example, to break or fracture structures. The moving mass may drive a device to consolidate, for example, soil. The moving mass may impact a member to drive the member into another member, such as a pile into the soil. Each moving mass may be coupled to a voice coil actuator, and the machine is an electrical-mechanical-electrical transformer.

Abstract: An electronic device is disclosed. The electronic device includes a carrier, a computing element disposed over the carrier, and a first data storage element disposed over the carrier and electrically connected with the computing element through the carrier. The computing element is configured to receive a first power provided from the first data storage element.

Abstract: An apparatus and method are provided for a flangeless air filter configured to be mounted onto a flat surface within an air intake system of an internal combustion engine. The flangeless air filter is comprised of a cone-shaped filter medium, retained between a base and a cap, that is fabricated to remove contaminants and particulate matter from an intake airstream. The base includes a pliable seal that forms an airtight connection between the flangeless air filter and the flat surface of the air intake system. A mounting bracket and fasteners may be used to attach the base to the flat surface, compressing the seal there between. In some embodiments, the mounting bracket may be incorporated into, and made a part of the base. A cap is disposed on a top of the flangeless air filter and configured to direct the intake airstream around the cap and toward the filter medium.

Abstract: Verification systems and methods for high risk packaging are disclosed herein.

Abstract: A housing can have a first attachment point for an actuator wherein the actuator can be attached to the housing and a pin lift plow. The wearable mechanical robotic device can have a rolling pin lock. A cam wherein the cam can rotate around an axis and can come into contact with a cam follower and the rolling pin lock. A plunger wherein the plunger can be attached to the cam follower wherein the plunger compresses a spring against a base. An outer frame having at least one guide for the rolling pin lock. The housing can have at least one second attachment point wherein at least one frame is attached to the housing by at least one fastener.

Abstract: Apparatus for automatically filling fluid into containers includes an actuator for raising and lowering a fluid dispensing needle. The needle is supported for vertical sliding movement. A first end of a pivot arm is engaged with a cam rotated by a motor for rocking the pivot arm. The dispensing needle is also engaged with the pivot arm for being raised or lowered thereby as the pivot arm rocks. The cam, which may be circular and eccentric, may be surrounded by a circular bearing and slidingly received within a yoke at the first end of the pivot arm. The needle is coupled to a pump. A first sensor senses that the needle has been moved to its lowered position. A control circuit responsive to the first sensor prevents the pump from pumping fluid to the needle unless the needle is in its lowered position.

Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) home air filter to remove airborne molecular contaminants and volatile organic compounds (VOCs) from air within residential spaces. The HVAC home air filter includes a supportive frame having a shape and size suitable to orient the HVAC home air filter within a residential HVAC system. A filter medium is retained within the supportive frame to remove the airborne molecular contaminants and VOCs from air flowing through the residential HVAC system. The filter medium includes a combination of media layers configured to exhibit a relatively high filtration efficiency and a low air pressure drop across the filter medium. The supportive frame includes a plurality of elongate sections and corner sections disposed along perimeter edges of the filter medium to support the filter medium within the residential HVAC system so as direct air through the filter medium.

Abstract: Disclosed are embodiments of hydrocarbon leak detection cables that utilize time domain reflectometry to indicate the location of changes in impedance in a hydrocarbon leak detection cable. In addition, an embodiment of a hydrocarbon leak detection optical fiber is disclosed.