Patents Assigned to .Engineering, Inc.
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Publication number: 20240153920Abstract: An electronic device is disclosed. The electronic device includes a first conductive plate and a first electronic component. The first conductive plate includes a first connecting portion. The first electronic component supports the first conductive plate through the first connecting portion. The first connecting portion is electrically connected to the first electronic component and configured to buffer stress from the first conductive plate to the first electronic component.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Applicants: Advanced Semiconductor Engineering, Inc., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.Inventors: Yi-Hung HOU, Yung-Fa CHEN, Sheng-Chia CHEN
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Publication number: 20240154642Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Wen LU, Chun-Jen CHEN, Po-Hsiang TSENG, Hsin-Han LIN, Ming-Lun YU
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Publication number: 20240155758Abstract: An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.Type: ApplicationFiled: November 4, 2022Publication date: May 9, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Yu Hsin CHANG CHIEN, Chiu-Wen LEE, Chang Chi LEE
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Patent number: 11976915Abstract: There is described a method for interrogating optical fiber comprising fiber Bragg gratings (“FBGs”), using an optical fiber interrogator. The method comprises (a) generating an initial light pulse from phase coherent light emitted from a light source, wherein the initial light pulse is generated by modulating the intensity of the light; (b) splitting the initial light pulse into a pair of light pulses; (c) causing one of the light pulses to be delayed relative to the other of the light pulses; (d) transmitting the light pulses along the optical fiber; (e) receiving reflections of the light pulses off the FBGs; and (f) determining whether an optical path length between the FBGs has changed from an interference pattern resulting from the reflections of the light pulses.Type: GrantFiled: December 1, 2022Date of Patent: May 7, 2024Assignee: Hifi Engineering Inc.Inventors: Brian H. Moore, Walter Jeffrey Shakespeare, Phillip William Wallace, Viet Hoang, Chris Henrikson, Ajay Sandhu, Adrian Dumitru, Thomas Clement, Dongliang Huang, Seyed Ehsan Jalilian
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Publication number: 20240145357Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Lin YEH, Jen-Chieh KAO
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Publication number: 20240145941Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Wen LU
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Publication number: 20240140785Abstract: A method of attaching a film is provided. The method includes providing a carrier tape. The carrier tape supports a film over a surface of the carrier tape. The method further includes moving the film to a position over an electronic device. The method further includes attaching the film to the electronic device.Type: ApplicationFiled: October 26, 2022Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Chin-Song LEE
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Publication number: 20240145319Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tsung-Yu LIN, Pei-Yu WANG, Chung-Wei HSU
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Publication number: 20240142727Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Sin-Yuan MU, Chia-Sheng CHENG
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Patent number: 11967920Abstract: Solar trackers that may be advantageously employed on sloped and/or variable terrain to rotate solar panels to track motion of the sun across the sky include bearing assemblies and other mechanical features configured to address mechanical challenges posed by the sloped and/or variable terrain that might otherwise prevent or complicate use of solar trackers on such terrain.Type: GrantFiled: December 13, 2021Date of Patent: April 23, 2024Assignee: Nevados Engineering, Inc.Inventors: Yezin Taha, Amitoj Gill
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Patent number: 11967434Abstract: A multiple fluid model tool for multi-dimensional fluid modeling of a biological structure is presented. For example, a system includes a modeling component, a machine learning component, and a three-dimensional health assessment component. The modeling component generates a three-dimensional model of a biological structure based on multi-dimensional medical imaging data. The machine learning component predicts one or more characteristics of the biological structure based on input data and a machine learning process associated with the three-dimensional model. The three-dimensional health assessment component that provides a three-dimensional design environment associated with the three-dimensional model. The three-dimensional design environment renders physics modeling data of the biological structure based on the input data and the one or more characteristics of the biological structure on the three-dimensional model.Type: GrantFiled: May 4, 2021Date of Patent: April 23, 2024Assignee: Altair Engineering, Inc.Inventors: Zain S. Dweik, Shane Cline
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Publication number: 20240128193Abstract: An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configured to transmit a power from outside of the electronic module to the electronic component. The second region is configured to dissipate heat from the electronic component.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chang Chi LEE, Jung Jui KANG
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Publication number: 20240130043Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Yen TING, Pao-Nan LEE, Hung-Chun KUO, Jung Jui KANG, Chang Chi LEE
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Publication number: 20240128206Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.Type: ApplicationFiled: December 5, 2023Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Peng YANG, Yuan-Feng CHIANG, Po-Wei LU
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Publication number: 20240126327Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
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Patent number: 11959708Abstract: A heat exchanger includes an inlet for receiving bulk solids, a plurality of heat transfer plate assemblies, a plurality of spacers disposed between adjacent heat transfer plate assemblies, and supports for supporting the heat transfer plate assemblies. The heat transfer plate assemblies include a first plate having a first pair of holes extending therethrough, the first plate having channels extending along a surface thereof, for the flow of fluid through the channels, and a second plate bonded to the first plate to enclose the channels, the second plate including a second pair of holes generally aligned with the first pair of holes to form through holes to facilitate flow of the fluid through the through holes and the channels.Type: GrantFiled: November 6, 2018Date of Patent: April 16, 2024Assignees: Solex Thermal Science Inc., National Technology and Engineering Solutions of Sandia, Vacuum Process Engineering, Inc.Inventors: Ashley D. Byman, Robert McGillivray, Brandon Emmanuel St Germain, Layne Charles, Kevin James Albrecht, Dereje Shiferaw Amogne, Matthew David Carlson, Clifford Kuofei Ho, Carl P. Schalansky, Aaron Edward Wildberger
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Patent number: 11960309Abstract: An apparatus and methods are provided for a portable mass airflow (MAF) training module configured to simulate an air intake into an internal combustion engine. An in-line blower draws an airflow through an air filter by way of a first air duct and a second air duct. A throttle assembly is coupled between the first air duct and the second air duct. The throttle assembly includes a throttle plate that may be rotated to regulate the airflow. The power output of the in-line blower is variable to simulate the air intake of various sizes of the internal combustion engine. A MAF sensor and a duct velocity sensor are configured to provide airflow information. The portable MAF training module enables a practitioner to select a desired throttle setting and observe a resultant mass airflow through the portable MAF training module that is measured by the MAF sensor.Type: GrantFiled: October 5, 2021Date of Patent: April 16, 2024Assignee: K&N Engineering, Inc.Inventors: Mac McClanahan, Steve Williams, Joel Valles
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Publication number: 20240119616Abstract: A computer-implemented method, a system, and a non-transitory computer readable medium for determining diameter of an electrical transmission wire. The method includes receiving, on a processing server, data for one or more images, the one or more images including one or more electrical transmission wires captured by an optical instrument; receiving, by the processing server, a distance from the optical instrument to the one or more electrical transmission wires; receiving, by the processing server, a number of pixels across the one or more electrical transmission wires in the one or more images; and calculating, with the processing server, an estimated diameter of the one or more electrical transmission wires based on the distance from the optical instrument to the one or more electrical transmission wires and the number of pixels across the one or more electrical transmission wires in the one or more images.Type: ApplicationFiled: October 5, 2022Publication date: April 11, 2024Applicant: Dewberry Engineers Inc.Inventors: Eric AUFMUTH, Ryan LIGON, Eric MCNEILL, Josh NOVAC, Amar NAYEGANDHI, Amy LARSON
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Patent number: D1023061Type: GrantFiled: December 6, 2021Date of Patent: April 16, 2024Assignee: Velossa Tech Engineering, Inc.Inventor: Dan Joseph Becker
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Patent number: D1025132Type: GrantFiled: August 26, 2019Date of Patent: April 30, 2024Assignee: Velossa Tech Engineering Inc.Inventor: Dan Joseph Becker