Patents Assigned to .Engineering, Inc.
  • Publication number: 20230341317
    Abstract: The present disclosure provides a sensing package. The sensing package includes a carrier configured to face an object to be inspected and an emitter disposed adjacent to the carrier. The emitter is configured to emit a first light propagating in a first direction. The sensing package further includes a component configured to change the first light into a second light propagating in a second direction different from the first direction. An optical module and a method for detecting light are also provided.
    Type: Application
    Filed: April 26, 2022
    Publication date: October 26, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Hao CHANG
  • Patent number: 11794099
    Abstract: A universal controller having a housing is provided. The housing includes a first curved segment and a second curved segment, the first curved segment located on a first side of the housing and the second curved segment located on an opposite, second side of the housing, the first curved segment and the second curved segment symmetrical in shape and begin from a front surface of the housing and end at a rear surface of the housing enabling a user to grip a first side wall at a rear side of the housing and a second side wall at the rear side of the housing; and a cavity created at a bottom segment of the housing, the bottom segment coupled to a bottom support structure for receiving a first battery and a second battery to provide power to a plurality of electronic components of the universal controller.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: October 24, 2023
    Assignee: Bokam Engineering Inc.
    Inventors: Boris Kamentser, Eugenia Kamentser
  • Patent number: 11799864
    Abstract: A method is performed to regulate access to electronic content based on content usage telemetry data. A first computer receives, from a second computer system, a request for access to electronic content. The first computer system determines, based on an access profile associated with the second computer system, that the second computer system is authorized to access the electronic content. A first authorization message indicating that the second computer system is authorized to access the electronic content is transmitted from the first computer system to the second computer system. The first computer system receives, from the second computer system, content usage telemetry data including data items indicating metrics of use of the electronic content by the second computer system. The first computer system modifies the access profile of the second computer system based on the content usage telemetry data.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: October 24, 2023
    Assignee: Altair Engineering, Inc.
    Inventors: Michael Huebner, Max Fariello, Stephanie A. Scapa
  • Patent number: 11794059
    Abstract: A resistance band exercise machine for performing various exercises. An embodiment includes a housing for a cable-pulley variable resistance system. Some embodiments are configured to receive one or more safety bars to set a starting position of an exercise. Some embodiments include a training partner assistantship feature for a training partner to assist the user by imparting a secondary force on the machine. The configuration of the cable-pulley variable resistance system may be in any manner based on the exercise. In some embodiments, a user performs an exercise on the resistance band exercise machine to overcome a primary (e.g., resistance bands) and secondary (e.g., springs) sources of variably increasing resistance from the cable-pulley variable resistance system.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: October 24, 2023
    Assignee: OK Engineering Inc.
    Inventors: Omar Ismail KashKash, Yousef Ismail KashKash
  • Publication number: 20230332059
    Abstract: A method and apparatus for separating production fluids using a system designed to minimize the heating requirements through thermodynamic efficiency and reduce equipment costs.
    Type: Application
    Filed: June 19, 2023
    Publication date: October 19, 2023
    Applicant: Bell Engineering, Inc.
    Inventors: Robert Richardson, Tyler Briggs, Brint Bridegam
  • Publication number: 20230335505
    Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Hung CHEN, Zheng Wei WU
  • Publication number: 20230335533
    Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Ming HUNG, Meng-Jen WANG, Tsung-Yueh TSAI, Jen-Kai OU
  • Publication number: 20230333139
    Abstract: A testing device is disclosed. The testing device includes a socket configured to support a DUT and a first detection module disposed at a first side of the socket and configured to detect a location relationship between the DUT and the socket.
    Type: Application
    Filed: April 15, 2022
    Publication date: October 19, 2023
    Applicants: Advanced Semiconductor Engineering, Inc., ASE TEST, INC.
    Inventors: Jia Jin LIN, Chia Hsiang WANG, Shih Pin CHUNG, Wei Shuo CHU, You Lin LEE, Pin Heng KUO, Cheng Chia TU
  • Publication number: 20230335454
    Abstract: The present disclosure provides a semiconductor device package including a first device, a second device, and a spacer. The first device includes a substrate having a first dielectric constant. The second device includes a dielectric element, an antenna, and a reinforcing element. The dielectric element has a second dielectric constant less than the first dielectric constant. The antenna is at least partially within the dielectric element. The reinforcing element is disposed on the dielectric element, and the reinforcing element has a third dielectric constant greater than the first dielectric constant.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Tung CHANG
  • Patent number: 11788917
    Abstract: Disclosed are embodiments of hydrocarbon leak detection cables that utilize time domain reflectometry to indicate the location of changes in impedance in a hydrocarbon leak detection cable. In addition, an embodiment of a hydrocarbon leak detection optical fiber is disclosed.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: October 17, 2023
    Assignee: Raymond & Lae Engineering, Inc.
    Inventor: Donald M. Raymond
  • Patent number: 11786628
    Abstract: An air purifier according to an aspect of the present disclosure includes: an air passage defined between a first inner wall surface and a second inner wall surface that are planar and face each other, having a flat passage cross section in which a distance between the first inner wall surface and the second inner wall surface is small, and meandering in a plane parallel to the first inner wall surface and the second inner wall surface; a catalyst member including a support having a flat mesh shape, and a photocatalyst supported on the support, the catalyst member being disposed parallel to the first inner wall surface and the second inner wall surface in the air passage; and a plurality of light sources dispersed on the second inner wall surface, and configured to irradiate the catalyst member with light that activates the photocatalyst.
    Type: Grant
    Filed: September 22, 2021
    Date of Patent: October 17, 2023
    Assignee: Sunstar Engineering Inc.
    Inventors: Tomoharu Usa, Katsuhiro Yamaguchi
  • Publication number: 20230327336
    Abstract: An electronic device is disclosed. The electronic device includes a carrier and a first interposer disposed on the carrier. The first interposer has a first region configured for providing an external electrical connection to outside the electronic device and a second region distinct from the first region. The electronic device also includes a first antenna component disposed on the second region of the first interposer.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Shyue-Long LOUH
  • Publication number: 20230324308
    Abstract: An electronic device is disclosed. The electronic device includes a carrier, an optical component disposed on the carrier and a humidity indicator within the electronic package. A position of the humidity indicator within the electronic package is arranged such that at least a part of the humidity indicator is visible from a viewpoint outside of the electronic package.
    Type: Application
    Filed: April 8, 2022
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shu Ting MAI, Tzu Hsing CHIANG
  • Publication number: 20230326889
    Abstract: An electronic package is provided. The electronic package includes a processing component and a memory unit. The processing component has a side including a first region and a second region distinct from the first region. The memory unit is disposed over the first region. The first region is configured to provide interconnection between the processing component and the memory unit, and the second region is configured to provide external connection.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hung-Yi Lin, Cheng-Yuan Kung
  • Publication number: 20230326878
    Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chia Hsiu HUANG, Chun Chen CHEN, Wei Chih CHO, Shao-Lun YANG
  • Publication number: 20230326861
    Abstract: An electronic package is provided. The electronic package includes a first processing component, a second processing component, and a first memory unit. The first memory unit is over the first processing component and the second processing component. The first processing component and the second processing component are configured to access data stored in the first memory unit.
    Type: Application
    Filed: April 7, 2022
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hung-Yi LIN, Cheng-Yuan KUNG
  • Publication number: 20230327333
    Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.
    Type: Application
    Filed: June 6, 2023
    Publication date: October 12, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shao-En HSU, Huei-Shyong CHO, Shih-Wen LU
  • Publication number: 20230317502
    Abstract: A method for manufacturing an electronic package and a suction device are provided. The method includes: providing an electronic component having a first surface and including at least one conductive stud on the first surface; providing a suction device having at least one recess; and moving the electronic component with the suction device, wherein an edge of the at least one recess does not overlap the at least one conductive stud from a top view while moving the electronic component with the suction device.
    Type: Application
    Filed: April 1, 2022
    Publication date: October 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung TSAI, Chenghan SHE, Kuo-Chih HUANG, Kuan-Lin YEH
  • Publication number: 20230317589
    Abstract: A package structure includes a first die, a second die, an encapsulant and at least one electrical contact. The first die has an active surface. The second die is disposed on the first die, and has an active surface and a backside surface opposite to the active surface. The active surface of the second die is closer to the active surface of the first die than the backside surface of the second die is. The encapsulant encapsulates the first die and the second die, and has a top surface far away from the active surface of the first die. The electrical contact is exposed from the top surface of the encapsulant and is configured for connecting at least one conductive wire.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Ying Lee
  • Patent number: 11773794
    Abstract: A throttle-controlled intake system is disclosed that provides a driver of a vehicle with greater control over engine functions and vehicle performance. The throttle-controlled intake system includes a control module that is coupled with an aircharger air intake. The control module processes input signals from a throttle pedal of the vehicle and sends modified throttle position signals to a throttle body of the vehicle so as to increase throttle responsiveness of the vehicle. The throttle-controlled intake system further includes a wiring harness and a signal adjuster. The wiring harness electrically couples the control module with the throttle pedal and the throttle body. The control module sends signals directly to the throttle body of the engine, bypassing an electronic control unit of the vehicle. The signal adjuster includes a rheostat that enables manual adjustment of the throttle responsiveness of the vehicle.
    Type: Grant
    Filed: November 17, 2021
    Date of Patent: October 3, 2023
    Assignee: K&N Engineering, Inc.
    Inventors: Jonathan Richard Fiello, Gilbert Heck, Steve Williams