Abstract: Disclosed herein are air intake assemblies for internal combustion engines. In some embodiments, an air intake assembly includes an air filter configured to produce filtered air, a sealed filter housing configured to house the air filter therein, and an intake tube configured to convey the filtered air to an internal combustion engine. The filter housing includes an air intake port configured to provide intake air to the air filter. The air filter is configured to remove particulate matter from the intake air and produce the filtered air. The air filter includes a multi-component coupling interface configured to accept an intake-end portion of the intake tube in the coupling interface. The filter housing includes an aperture configured to accept the coupling interlace of the air filter in the aperture. Also disclosed herein are methods of the air intake assemblies.

Abstract: An electronic device is provided. The electronic device includes an electronic component and a heat dissipation structure. The electronic component has a passive surface and a plurality of conductive vias exposed from the passive surface. The heat dissipation structure is disposed on the passive surface and configured to transmit a plurality of independent powers to the conductive vias through the passive surface.

Abstract: An electronic device is disclosed. The electronic device includes an active component, a power regulating component disposed on the active component, and a patterned conductive element disposed between the active component and the power regulating component. The patterned conductive element is configured to provide one or more heat dissipation paths for the active component and to provide a power path between the active component and the power regulating component.

Abstract: A 2-phase bipolar step motor has a rotor and a stator, the rotor having a plurality of equally spaced rotor poles of alternating north and south magnetic polarities, and the stator having at least eight stator poles extending radially from a stator yoke and terminating in pole shoes interacting radially across an air gap with the rotor poles to cause the rotor to rotate step-by-step when windings around the stator poles are driven by a succession of energized states of the stator. The stator poles divided into four equal groups having a specified drive phase A or B, adjacent poles of a group having alternating drive polarities of the same drive phase A and ?, or B and B. Adjacent poles in the same group are separated by a center-to-center angle one-half of the rotor tooth pitch or up to 20% larger. Adjacent poles of different groups have a larger separation than that between poles of the same group.

Abstract: A hydrocarbon absorbing air filter box is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. A combined mass airflow sensor and hydrocarbon trap comprising the hydrocarbon absorbing air filter box includes a duct supporting a hydrocarbon absorbing sheet within an interior of a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.

Abstract: Disclosed are embodiments of a round floor grommet and a rectangular floor grommet. These floor grommets can be constructed in any desired shape other than round or rectangular. Frame portions that hold foam pieces are joined together to form a primary slit in the floor grommet. Cross slits can also be formed in the foam material. The foam is a semi-closed cell foam that is constructed from PVC and nitrile butadiene rubber which has superior sealing effects since the foam can conform around objects passing through the slits in the floor grommet and seal any flow of air through the slits.

Abstract: The present invention relates to a thermally crosslinkable composition comprising an acid-modified polymer A having a melting point of 110 to 150° C. and a crystallization temperature of 50 to 90° C., an acid-modified polymer B having a melting point of 30 to 110° C. and a crystallization temperature of lower than 50° C., a tackifier resin, and a curing agent, wherein the thermally crosslinkable composition has a crystallization temperature of 30 to 70° C.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first antenna pattern disposed at a first elevation and a second antenna pattern disposed at a second elevation different from the first elevation. The first antenna pattern and the second antenna pattern define an air cavity. The semiconductor device package also includes a circuit layer. The air cavity is between the first antenna pattern, the second antenna pattern, and the circuit layer.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.

Abstract: A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a package component having a first mounting surface and a second mounting surface; and a first electronic component having a first conductive pad signal communicatively mounted on the first mounting surface through a first type connector; wherein the first type connector comprises a first solder composition having a lower melting point layer sandwiched between a pair of higher melting point layers, wherein the lower melting point layer is composed of alloys capable of forming a room temperature eutectic.

Abstract: An electronic device is provided. The electronic device includes a circuit pattern layer. The circuit pattern layer includes a first surface, a second surface recessed with respect to the first surface; and a third surface recessed with respect to the first surface and adjacent to and spaced apart from the second surface. The second surface and the third surface are mis-aligned with each other.

Abstract: A wiring structure includes a test pattern layer. The test pattern layer includes a test circuit pattern and a heat dissipating structure. The heat dissipating structure is disposed adjacent to the test circuit pattern, and is configured to reduce temperature rise of the test circuit pattern when a power is applied to the test circuit pattern.

Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

Abstract: A flight simulator having a wind tunnel with a vertical flight chamber and a second vertical chamber communicatively coupled thereto via air flow conduits. A nacelle disposed within the second vertical chamber includes a fan and a ratio gearbox connected to the fan. A motor is disposed remote from the nacelle for powering the fan via a jackshaft and the ratio gearbox. A variable frequency drive responsive to a control signal from a programmable logic controller regulates the speed of the motor.

Abstract: An air filter apparatus is provided. The air filter apparatus includes a manifold having at least one compressible gas inlet and an outlet. The internal volume of the manifold increases from a distal end of the manifold to the outlet. A shroud is detachably mounted to the manifold so that a compressible gas can enter the shroud and pass through the at least one compressible gas inlet and through the outlet.

Abstract: An electronic structure includes a packaging structure, a circuit pattern structure, an underfill and a protrusion structure. The circuit pattern structure is disposed over the packaging structure. A gap is between the circuit pattern structure and the packaging structure. The underfill is disposed in the gap. The protrusion structure is disposed in the gap, and is configured to facilitate the distributing of the underfill in the gap.

Abstract: A semiconductor device package includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a dielectric layer, a third patterned conductive layer and a connector. The substrate has a top surface. The first patterned conductive layer is on the top surface of the substrate. The second patterned conductive layer contacts the first patterned conductive layer. The second patterned conductive layer includes a first portion, a second portion and a third portion. The second portion is connected between the first portion and the third portion. The dielectric layer is on the top surface of the substrate. The dielectric layer covers the first patterned conductive layer and surrounds the second portion and the third portion of the second patterned conductive layer. The first portion of the second patterned conductive layer is disposed on the dielectric layer.

Abstract: Systems and methods for providing and controlling solar panel arrays are provided. The solar panel array may include one or more articulating joints that may provide variability in the arrangement of solar panels, which may allow the solar panel array to be distributed over varying types of underlying surfaces. The articulating joints may allow orientations of solar panels to be different relative to one another. The articulating joints may convey rotational force across the joints, so that a rotational force used to drive a first solar panel may also be conveyed across the joint and used to drive a second solar panel. The controls system may include row-specific semi-autonomous, or autonomous, controllers as well as controllers to interface with multiple rows. The controllers may include sensors to measure system power generation and basic operations aspects of the solar field to directly measure, or infer, module shading within the solar field.