Patents Assigned to .Engineering, Inc.
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Patent number: 11655740Abstract: An apparatus and method are provided for a drone elimination muffler to attenuate drone exhibited by engine exhaust systems. The drone elimination muffler comprises a hollow canister having a length and a diameter, and a tuned port comprising a first end connected to the canister and a second end connected to the exhaust system. The canister operates in concert with the tuned port as a dampener configured to substantially attenuate exhaust drone, or resonance, at one or more frequencies of engine operation. A valve is configured to switch the drone elimination muffler between a closed state in which the exhaust system operates without acoustic influence due to the drone elimination muffler, and an open state in which the drone elimination muffler directly influences the acoustic properties of the exhaust system.Type: GrantFiled: December 19, 2019Date of Patent: May 23, 2023Assignee: K&N Engineering, Inc.Inventors: Steve Williams, Kevin McClelland
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Publication number: 20230154905Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component.Type: ApplicationFiled: November 12, 2021Publication date: May 18, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Wei-Hao CHANG
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Publication number: 20230150354Abstract: An apparatus and a method are provided for a multiple inlet air box to communicate an airstream through an air filter to an air intake duct of an internal combustion engine of a vehicle. The multiple inlet air box is comprised of a housing that supports the air filter within an interior of the housing. A mount portion within the housing fixedly receives a base of the air filter. Multiple air inlets couple with corresponding air inlet ports of the vehicle to direct the airstream into the multiple inlet air box. A duct directs the airstream from the multiple air inlets to the interior of the housing. A conduit communicates the airstream from an interior of the air filter to the air intake duct of the internal combustion engine.Type: ApplicationFiled: January 18, 2023Publication date: May 18, 2023Applicant: K&N Engineering, Inc.Inventor: Jere James Wall
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Patent number: 11649776Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.Type: GrantFiled: July 22, 2021Date of Patent: May 16, 2023Assignee: K&N Engineering, Inc.Inventor: Steve Williams
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Publication number: 20230142829Abstract: An example of an apparatus is provided. The apparatus includes a light source to emit light. The apparatus further includes a light source controller to control the light source. The light source controller is to change an intensity of the light emitted by the light source. In addition, the apparatus includes a low resolution sensor to measure light data from a reflection of the light off a wall. Also, the apparatus includes a memory storage unit to store the light data and corresponding control data. The apparatus includes an image processing engine to locate and to classify the wall based on the light data and the control data.Type: ApplicationFiled: April 23, 2020Publication date: May 11, 2023Applicant: JDRF Electromag Engineering Inc.Inventors: Roumanos Dableh, Ghassan Knayzeh, Elias Boukhers
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Publication number: 20230145588Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.Type: ApplicationFiled: January 10, 2023Publication date: May 11, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng Yuan CHEN, Jiming LI, Chun Chen CHEN, Yuanhao YU
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Publication number: 20230144000Abstract: An electronic package is provided. The electronic package includes a carrier, a first electronic component, a bonding element, and a barrier. The carrier has a conductive layer. The first electronic component is disposed adjacent to the carrier and has a first terminal and a second terminal. The bonding element is configured to electrically connect the conductive layer to the first terminal. The barrier is configured to avoid electrically bypassing an electrical path in the first electronic component and between the first terminal and the second terminal.Type: ApplicationFiled: November 9, 2021Publication date: May 11, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jun-Wei CHEN, Yu-Yuan YEH, Hsu-Nan FANG
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Patent number: 11643809Abstract: Disclosed are methods and apparatus for providing pre-assembled modular structural louvered systems that include structural supports and louvers, and may also include dampers, actuators and wiring in pre-assembled modules that may be transported to a building site, tilted up into place, and installed. Embodiments of the present invention also provide methods and apparatus for providing pre-assembled modular structural louvered systems which include integrated vertical and horizontal structural supports, allowing for the elimination of some vertical and horizontal wall structures in a building by relying on the structural support provided in the modular louvered systems, thereby making more space available in the building for louvers and airflow.Type: GrantFiled: December 20, 2021Date of Patent: May 9, 2023Assignee: Span Construction & Engineering, Inc.Inventors: Charles E. Wilson, Alexander Mankin, Ernest Brandi, David John Blink
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Publication number: 20230136049Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.Type: ApplicationFiled: January 3, 2023Publication date: May 4, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yi Chun CHOU
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Publication number: 20230136046Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a carrier and a photonic component. The carrier includes an upper surface and a first lateral surface. The photonic component is disposed over an upper surface of the carrier and includes an optical portion. The carrier includes a recessed portion recessed from the first lateral surface of the carrier, and the optical portion of the photonic component is located within the recessed portion of the carrier from a top view perspective.Type: ApplicationFiled: October 28, 2021Publication date: May 4, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsiang-Cheng TSAI, Jui-Che WU
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Publication number: 20230138460Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) providing a package body including at least one semiconductor device encapsulated in an encapsulant; (b) providing a flattening force to the package body; (c) thinning the package body after (b); (d) attaching a film to the package body; and (e) releasing the flattening force after (d).Type: ApplicationFiled: December 27, 2022Publication date: May 4, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Che-Ting LIU, Jheng-Yu HONG, Yu-Ting LU, Po-Chun LEE, Chih-Hsiang HSU
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Publication number: 20230132684Abstract: A system and methods are provided for a wing stabilizer charging system for recharging onboard batteries during operation of an electrically powered vehicle. The wing stabilizer charging system comprises a wing stabilizer configured to be coupled with a rear of the vehicle. One or more air inlets are disposed in the wing stabilizer and configured to receive an airstream during forward motion of the vehicle. Wind turbines are disposed within the wing stabilizer and configured to be turned by the airstream. A circuit box is configured to combine electricity received from the wind turbines into a useable electric current. A power cable extends from the circuit box and is configured to supply the useable electric current to any one or more electronic devices, such as any of an onboard battery for powering the vehicle, mobile phones or smart phones, portable music players, tablet computers, cameras, and the like.Type: ApplicationFiled: December 28, 2022Publication date: May 4, 2023Applicant: K&N Engineering, Inc.Inventors: Jonathan Richard Fiello, Steve Williams
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Patent number: 11639749Abstract: A gear system based on variably expandable gears, where input from either or both an operator or a computer processor may induce selective radial expansion and contraction of at least one gear in a gear set. The computer processor may be programmed to establish and maintain a desired gear ratio, regardless of the various variable forces which may be encountered, permitting gear setting and adjustment to control a desired parameter, such as speed, revolutions-per-minute, and watts with minimal effort by the operator.Type: GrantFiled: May 21, 2020Date of Patent: May 2, 2023Assignee: SunMan Engineering, Inc.Inventors: Allen Nejah, Sagar Bhatia
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Patent number: 11638895Abstract: The filter of a gas sensor comprises an inorganic porous support supporting both an organic sulfonic acid compound including sulfo group (—SO3H) and a Lewis acid having at least a metal element of transitional metal elements, Al element, Ga element, In element, Ge element, and Sn element. The Lewis acid loaded in the inorganic porous support adsorbs low concentration siloxanes. The organic sulfonic acid compound including sulfo group polymerizes adsorbed siloxanes in the filter so as not to desorb from the filter.Type: GrantFiled: February 19, 2018Date of Patent: May 2, 2023Assignees: Figaro Engineering Inc., University Public Corporation OsakaInventors: Masato Takeuchi, Junpei Furuno, Tatsuya Tanihira, Kenichi Yoshioka
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Patent number: 11634091Abstract: An acoustic fiber silencer for a motor vehicle includes a first sound absorbing layer and a second sound insulating layer. The layers are formed of lightweight fibrous material, and the sound insulating layer is quilted. The acoustic fiber silencer includes a frame to which the sound absorbing and sound insulating layers are secured. The frame provides structural support and shape to the sound absorbing and sound insulating layers. The acoustic fiber silencer is lightweight while maintaining excellent noise attenuation properties.Type: GrantFiled: March 13, 2018Date of Patent: April 25, 2023Assignee: Cascade Engineering, Inc.Inventors: Michael T. Campbell, Andrew R. Skestone
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Patent number: 11635120Abstract: A sintered friction material for brake having a high friction coefficient, with which reduction of the friction coefficient is prevented at high temperature and stable brake performance is maintained. It comprises: a metal matrix of Ni or Ni+Fe (small amount); a solid lubricant (a); and a friction adjusting material (b) including: metal or alloy particles (b1) having an average particle size of 50 ?m or more and containing at least one selected from W, Mo, Cr, and FeW; and inorganic particles (b2) containing at least one selected from oxides, nitrides, carbides, and intermetallic compounds. An average particle size db1 of b1 and an average particle size db2 of b2 satisfy db1<db2. Dispersing, in the metal matrix, b1 and b2 satisfying particular conditions as the friction adjusting material can produce a geometrical structure (particle structure with a high filling density) suitable for preventing plastic deformation of the sintered friction material.Type: GrantFiled: March 14, 2018Date of Patent: April 25, 2023Assignee: Sunstar Engineering Inc.Inventors: Hoshiaki Terao, Raita Wada, Tsuyoshi Nakatsuji, Yoshinori Shinagawa
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Publication number: 20230124000Abstract: At least some embodiments of the present disclosure relate to an electronic package structure. The electronic package structure includes an electronic structure, a wiring structure disposed over the electronic structure, a bonding element connecting the wiring structure and the electronic structure, and a reinforcement element attached to the wiring structure. An elevation difference between a highest point and a lowest point of a surface of the wiring structure facing the electronic structure is less than a height of the bonding element.Type: ApplicationFiled: October 14, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Jen WANG, Po-Jen CHENG, Fu-Yuan CHEN, Yi-Hsin CHENG
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Publication number: 20230122292Abstract: An optoelectronic package includes an input/output (I/O) component, a photonic component, and an electronic component configured to modulate optical signals in the photonic component. The I/O component is electrically connected to the photonic component via the electronic component.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Jung Jui KANG
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Publication number: 20230123016Abstract: An apparatus and method are provided for an air filter configured to be mounted onto an air inlet of an internal combustion engine. The air filter comprises a first end cap configured to couple with a base which is configured to support a conventional air filter and provide an interface between the conventional air filter and the air inlet. A filter medium which is relatively thicker than the conventional air filter is configured to remove particulate matter and other contaminates from an incoming airstream. A second end cap is configured to couple with a cover which is configured to fasten the conventional air filter and the base onto the air inlet, such that the incoming airstream is directed through the filter medium. The air filter is configured to be installed in place of the conventional air filter without necessitating alteration of the base and cover.Type: ApplicationFiled: December 16, 2022Publication date: April 20, 2023Applicant: K&N Engineering, Inc.Inventor: Steve Williams
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Publication number: 20230123962Abstract: The present disclosure provides an antenna device. The antenna device includes a dielectric element including a first region and a second region, a first antenna disposed on the first region, and a second antenna disposed on the second region. The first antenna and the second antenna are configured to operate in different frequencies. The first antenna and the second antenna are misaligned in directions perpendicular and parallel to a surface of the dielectric element on which the first antenna or the second antenna is disposed.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Mark GERBER