Patents Assigned to .Engineering, Inc.
  • Portable dock plate
    Patent number: 11577923
    Abstract: A portable dock plate which includes a planar ramp that has opposing side members, the ramp also has a top end and a bottom end, the top end includes a lip portion. The dock plate has a first wheel assembly and a second wheel assembly. The first wheel assembly includes a wheel, wheel lock linkage, a first locking pin with corresponding first locking pin holes, a lip-lowering apparatus and a lip-raising apparatus. The second wheel assembly has a wheel and a second locking pin with corresponding second locking pin holes. The dock plate also includes opposing handrails which are connected to the opposing side members, each handrail includes a moveable lever-handle for movement and placement of the dock plate.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: February 14, 2023
    Assignee: Leum Engineering, Inc.
    Inventors: Grant Leum, Eric Demerath
  • Flangeless Air Filter
    Publication number: 20230045362
    Abstract: An apparatus and method are provided for a flangeless air filter configured to be mounted onto a flat surface within an air intake system of an internal combustion engine. The flangeless air filter is comprised of a cone-shaped filter medium, retained between a base and a cap, that is fabricated to remove contaminants and particulate matter from an intake airstream. The base includes a pliable seal that forms an airtight connection between the flangeless air filter and the flat surface of the air intake system. A mounting bracket and fasteners may be used to attach the base to the flat surface, compressing the seal there between. In some embodiments, the mounting bracket may be incorporated into, and made a part of the base. A cap is disposed on a top of the flangeless air filter and configured to direct the intake airstream around the cap and toward the filter medium.
    Type: Application
    Filed: October 17, 2022
    Publication date: February 9, 2023
    Applicant: K&N Engineering, Inc.
    Inventors: Jere James Wall, Steve Williams
  • ELECTRONIC PACKAGE AND METHOD OF FORMING THE SAME
    Publication number: 20230042800
    Abstract: An electronic package is provided in the present disclosure. The electronic package comprises: a heat spreading component; a first electronic component disposed on the heat spreading component; and a second electronic component disposed on the first electronic component, wherein the second electronic component comprises an interconnection structure passing through the second electronic component and electrically connecting the first electronic component. In this way, through the use of the interconnection structure, the heat dissipation of the electronic components in the package can be improved. Also, through the use of the encapsulant, the stacked electronic components can be protected by the encapsulant so as to avoid being damaged.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: You-Lung YEN, Bernd Karl APPELT
  • WEARABLE DEVICE
    Publication number: 20230042984
    Abstract: A wearable device is provided. The wearable device includes an electronic component and an encapsulant. The encapsulant includes a low-penetrability region encapsulating the electronic component and a high-penetrability region physically separated from the electronic component.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chang-Lin YEH
  • ANTENNA DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230045587
    Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier and an antenna element. The carrier includes a plurality of pads and has a surface exposing the pads. The antenna element is disposed above the pads. A lateral surface of one of the pads is farther from a central axis of the antenna element substantially perpendicular to the surface than from a lateral surface of the antenna element.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Chang-Fu LU
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230037713
    Abstract: The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wei-Tang CHU, Tsu-Hsiu WU, Chun Yu KO
  • ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230037915
    Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.
    Type: Application
    Filed: August 6, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230039430
    Abstract: An electronic package includes a patterned conductive layer and at least one conductive protrusion on the patterned conductive layer. The at least one conductive protrusion has a first top surface. The patterned conductive layer and the at least one conductive protrusion define a space. The electronic package further includes a first electronic component disposed in the space and a plurality of conductive pillars on the first electronic component. The conductive pillars have a second top surface. The first top surface is substantially level with the second top surface.
    Type: Application
    Filed: August 5, 2021
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: You-Lung YEN, Bernd Karl APPELT, Kay Stefan ESSIG
  • SEMICONDUCTOR DEVICE PACKAGE AND ACOUSTIC DEVICE HAVING THE SAME
    Publication number: 20230039552
    Abstract: A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.
    Type: Application
    Filed: October 18, 2022
    Publication date: February 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Tau HUANG, Kuei-Hao TSENG, Hung-I LIN
  • Vehicle leveler with safety features
    Patent number: 11572239
    Abstract: The vehicle leveler includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The second portion also includes an extension portion. The vehicle leveler also includes opposing side portions which extend the length of and contact the second portion and extension portion, the opposing side portions have a top surface which forms a walkway.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 7, 2023
    Assignee: Leum Engineering, Inc.
    Inventors: Grant Leum, Eric Demerath
  • Mechanical dry waste excavating end effector
    Patent number: 11571723
    Abstract: Systems, devices, apparatus and methods for cleaning contaminated tanks without introducing large amounts of free water or liquefier into the tanks. A gathering arm assembly and a bucket assembly is used to remove and break up waste debris from a contaminated tank.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: February 7, 2023
    Assignee: AGI Engineering, Inc.
    Inventor: Alex G. Innes
  • Adhesive composition
    Patent number: 11572493
    Abstract: The present invention provides a hot-melt adhesive having a sufficiently long usable time and exhibiting good strength and good heat resistance. The present invention relates to a hot-melt adhesive composition comprising a hydrocarbon cyclic polymer (A), an ?-olefin polymer (C), and a tackifying resin (D).
    Type: Grant
    Filed: July 13, 2017
    Date of Patent: February 7, 2023
    Assignee: Sunstar Engineering Inc.
    Inventor: Atsushi Uno
  • METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
    Publication number: 20230037117
    Abstract: A method of manufacturing a semiconductor structure is provided. The method includes the following operations: providing a semiconductor substrate; performing a first cutting operation along a first set of cutting lines of the semiconductor substrate; and performing a second cutting operation along a second set of cutting lines of the semiconductor substrate later than performing the first cutting operation, wherein the second set of cutting lines are arranged interlacedly with the first set of cutting lines along a first direction.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Bo Hua CHEN, Yan Ting SHEN, Tsung Chi WU, Tai-Hung KUO
  • ELECTRONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230037201
    Abstract: A electronic package and a method of manufacturing the same are provided. The electronic package includes an electronic component, a thermal spreading element, and an encapsulant. The electronic component has a first surface. The thermal spreading element is disposed over the electronic component and has a first surface facing the first surface of the electronic component. The encapsulant covers the electronic component and has a first surface closer to the first surface of the thermal spreading element than the first surface of the electronic component.
    Type: Application
    Filed: July 30, 2021
    Publication date: February 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: You-Lung YEN, Bernd Karl Appelt
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230033515
    Abstract: A semiconductor device package and method for manufacturing the same are provided. The semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, and a first circuit layer disposed on the substrate. The first circuit layer includes a conductive wiring pattern, and the conductive wiring pattern is an uppermost conductive pattern of the first circuit layer. The stress buffering structure is disposed on the first conductive structure. The second conductive structure is disposed over the stress buffering structure. The conductive wiring pattern extends through the stress buffering structure and electrically connected to the second conductive structure, and an upper surface of the conductive wiring pattern is substantially coplanar with an upper surface of the stress buffering structure.
    Type: Application
    Filed: October 10, 2022
    Publication date: February 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsing Kuo TIEN, Chih-Cheng LEE
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20230030133
    Abstract: A semiconductor device package includes a carrier, a first conductive post and a first adhesive layer. The first conductive post is disposed on the carrier. The first conductive post includes a lower surface facing the carrier, an upper surface opposite to the lower surface and a lateral surface extended between the upper surface and the lower surface. The first adhesive layer surrounds a portion of the lateral surface of the first conductive post. The first adhesive layer comprises conductive particles and an adhesive. The first conductive post has a height measured from the upper surface to the lower surface and a width. The height is greater than the width.
    Type: Application
    Filed: October 11, 2022
    Publication date: February 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yu-Ying LEE
  • Multiple inlet filtration system
    Patent number: 11565584
    Abstract: An apparatus and a method are provided for a multiple inlet air box to communicate an airstream through an air filter to an air intake duct of an internal combustion engine of a vehicle. The multiple inlet air box is comprised of a housing that supports the air filter within an interior of the housing. A mount portion within the housing fixedly receives a base of the air filter. Multiple air inlets couple with corresponding air inlet ports of the vehicle to direct the airstream into the multiple inlet air box. A duct directs the airstream from the multiple air inlets to the interior of the housing. A conduit communicates the airstream from an interior of the air filter to the air intake duct of the internal combustion engine.
    Type: Grant
    Filed: September 16, 2021
    Date of Patent: January 31, 2023
    Assignee: K&N Engineering, Inc.
    Inventor: Jere James Wall
  • Vehicle steering attachment
    Patent number: 11565737
    Abstract: The present disclosure provides a vehicle steering attachment configured to augment a vehicle steering device, the vehicle steering attachment comprising: a first end configured to secure to a left handle of the vehicle steering device; a second end configured to secure to a right handle of the vehicle steering device; and a middle portion disposed between the first end and the second end, wherein the left handle and the right handle connect to a center section.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: January 31, 2023
    Assignee: Velossa Tech Engineering, Inc.
    Inventor: Dan Joseph Becker
  • ANTENNA DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230023398
    Abstract: An antenna device and a method for manufacturing the same are provided. The antenna device includes a carrier, an antenna portion, a first portion and a second portion. The antenna portion is located on the carrier. The first portion is located on the carrier. The second portion is located on the carrier and is configured for blocking a material from entering the antenna area, wherein the material covers a lateral surface of the carrier.
    Type: Application
    Filed: July 22, 2021
    Publication date: January 26, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Shyue-Long LOUH
  • CIRCUIT STRUCTURE AND ELECTRONIC STRUCTURE
    Publication number: 20230025850
    Abstract: A circuit structure and an electronic structure are provided. The circuit structure includes a low-density conductive structure, a high-density conductive structure and an electrical connection structure. The high-density conductive structure is disposed on the low-density conductive structure. The electrical connection structure extends through the high-density conductive structure and is electrically connected to the low-density conductive structure. The electrical connection structure includes a shoulder portion.
    Type: Application
    Filed: July 23, 2021
    Publication date: January 26, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG