Patents Assigned to .Engineering, Inc.
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Publication number: 20220238502Abstract: An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.Type: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tsung-Yueh TSAI, Meng-Jen WANG, Yu-Fang TSAI, Meng-Jung CHUANG
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Publication number: 20220234433Abstract: A vehicle frame assembly includes a plurality of members, a tray, at least one insulation member, and at least one battery. The plurality of members define a first void. The tray is coupled to at least one member of the plurality of members. The tray defines a second void. The at least one insulation member is disposed within the first void or the second void. The at least one battery is disposed within the first void and the second void.Type: ApplicationFiled: June 4, 2020Publication date: July 28, 2022Applicant: AVL Powertrain Engineering, Inc.Inventors: Bruce FALLS, Adrian QUINTANA
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Publication number: 20220236489Abstract: A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.Type: ApplicationFiled: March 1, 2022Publication date: July 28, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shao Hsuan CHUANG, Huang-Hsien CHANG
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Publication number: 20220235545Abstract: Disclosed are methods and apparatus for providing pre-assembled modular structural louvered systems that include structural supports and louvers, and may also include dampers, actuators and wiring in pre-assembled modules that may be transported to a building site, tilted up into place, and installed. Embodiments of the present invention also provide methods and apparatus for providing pre-assembled modular structural louvered systems which include integrated vertical and horizontal structural supports, allowing for the elimination of some vertical and horizontal wall structures in a building by relying on the structural support provided in the modular louvered systems, thereby making more space available in the building for louvers and airflow.Type: ApplicationFiled: December 20, 2021Publication date: July 28, 2022Applicant: Span Construction & Engineering, Inc.Inventors: Charles E. Wilson, Alexander Mankin, Ernest Brandi, David John Blink
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Publication number: 20220236480Abstract: An optical communication package structure includes a wiring structure, at least one via structure, a redistribution structure, at least one optical device and at least one electrical device. The wiring structure includes a main portion and a conductive structure disposed on an upper surface of the main portion. The main portion defines at least one through hole extending through the main portion. The via structure is disposed in the at least one through hole of the main portion and electrically connected to the conductive structure. The redistribution structure is disposed on a lower surface of the main portion and electrically connected to the via structure. The optical device is disposed adjacent to the upper surface of the main portion and electrically connected to the conductive structure. The electrical device is disposed on and electrically connected to the conductive structure.Type: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Hsuan WU, Yung-Hui WANG
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Publication number: 20220238457Abstract: A semiconductor device package includes a first substrate, a second substrate, a first electronic component, a second electronic component and a shielding layer. The second substrate is disposed over the first substrate. The first electronic component is disposed between the first substrate and the second substrate. The second electronic component is disposed between the first substrate and the second substrate and adjacent to the second substrate than the first electronic component. The shielding element electrically connects the second electronic component to the second substrate. The second electronic component and the shielding element define a space accommodating the first electronic component.Type: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hao-Chih HSIEH, Tzu-Cheng LIN, Chun-Jen CHEN
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Patent number: 11397417Abstract: A robotic system automatically aligns, and/or tests alignment of, a lens to a digital camera or other workpiece. The system includes an optical target, an intermediate lens and a plurality of collimators peripheral to the intermediate lens to accommodate a wide range of fields of view of the workpieces, without requiring changes in equipment hardware. When manufacturing or testing a workpiece with a relatively narrow field of view, the entire field of view of the workpiece can be filled with a view of the target through the intermediate lens, and the collimators need not be used. However, when manufacturing or testing a camera having a relatively large field of view, the intermediate lens is used to fill a central portion of the field of view with an image of the target, and the collimators are used to fill a remaining portion of the field of view with images of reticles.Type: GrantFiled: November 23, 2019Date of Patent: July 26, 2022Assignee: Automation Engineering Inc.Inventors: Michael Chiu, Regan Mills, Lu Ren
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Publication number: 20220230915Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a substrate, a conductive trace, a passivation layer and an upper wiring. The conductive trace is disposed over the substrate. The conductive trace includes a body portion disposed on the substrate, and a cap portion disposed on the body portion, and the cap portion is wider than the body portion. The passivation layer covers the conductive trace. The upper wiring is disposed on the passivation layer and electrically connected to the cap portion of the conductive trace through an opening of the passivation layer.Type: ApplicationFiled: January 15, 2021Publication date: July 21, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wei-Wei LIU, Huei-Siang WONG
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Publication number: 20220230950Abstract: The present disclosure provides a semiconductor device package including a first substrate and an adhesive layer. The first substrate has a first surface and a conductive pad adjacent to the first surface. The conductive pad has a first surface exposed from the first substrate. The adhesive layer is disposed on the first surface of the first substrate. The adhesive layer has a first surface facing the first substrate. The first surface of the adhesive layer is spaced apart from the first surface of the conductive pad in a first direction substantially perpendicular to the first surface of the first substrate. The conductive pad and the adhesive layer are partially overlapping in the first direction.Type: ApplicationFiled: January 15, 2021Publication date: July 21, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Yi Chun Chou
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Publication number: 20220231589Abstract: A two-phase bipolar step motor, comprises a rotor having a plurality of pairs of rotor poles of alternating magnetic polarity, and a stator having four primary energizable stator poles with conductive windings around those primary stator poles and four passive inter-poles located uniformly between every adjacent pair of primary stator poles, the passive inter-poles lacking any conductive windings. Both 18° steppers with five pairs of rotor poles and 30° steppers with three pairs of rotor poles are provided. Also provided are both PM hybrid mix steppers with 2D magnetic flux paths and hybrid steppers with 3D magnetic flux paths having an axial component. In each case, the overall lengths of the flux paths are substantially reduced from conventional designs resulting in improved motor efficiency.Type: ApplicationFiled: May 25, 2021Publication date: July 21, 2022Applicant: Lin Engineering, Inc.Inventor: Ted T. Lin
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Publication number: 20220229149Abstract: Current indoor tracking methods are inadequate to accurately and reliably point a pointer or camera at an object or a person doing an activity. An apparatus and method are provided for cooperative tracking that is operable both indoors and outdoors. The system works using ranging technology without the need for placing radiation sources and/or sensors in set locations around the location where tracking takes place. The apparatus and method may be used for automatic filming, allowing free movement of both the subject of the filming and that of the camera with a compact design, and providing easy setup at any location.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Applicant: H4 Engineering, Inc.Inventors: Gordon Jason Glover, Christopher T. Boyle
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Publication number: 20220230946Abstract: A substrate structure and a semiconductor package structure are provided. The substrate structure includes a first dielectric layer, a pad and a conductive structure. The first dielectric layer has a first surface and a second surface opposite to the first surface. The pad is adjacent to the first surface and at least partially embedded in the first dielectric layer. The first dielectric layer has an opening exposing the pad, and a width of the opening is less than a width of the pad. The conductive structure is disposed on the pad and composed of a first portion outside the opening of the first dielectric layer and a second portion embedded in the opening of the first dielectric layer. The first portion has an aspect ratio exceeding 1.375.Type: ApplicationFiled: January 15, 2021Publication date: July 21, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Wei SHIH, Sheng-Wen YANG, Chung-Hung LAI, Chin-Li KAO
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Publication number: 20220223507Abstract: A substrate structure includes a wiring structure, a first bump pad, a second bump pad and a compensation structure. The wiring structure includes a plurality of redistribution layers. The first bump pad and the second bump pad are bonded to and electrically connected to the wiring structure. An amount of redistribution layers disposed under the first bump pad is greater than an amount of redistribution layers disposed under the second bump pad. The compensation structure is disposed under the second bump pad.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Syu-Tang LIU, Tsung-Tang TSAI, Huang-Hsien CHANG, Ching-Ju CHEN
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Publication number: 20220221332Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsin-Ying HO, Ying-Chung CHEN
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Publication number: 20220223489Abstract: A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.Type: ApplicationFiled: March 29, 2022Publication date: July 14, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Sheng-Yu CHEN, Chang-Lin YEH, Ming-Hung CHEN
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Patent number: 11387527Abstract: Described is a battery de-passivation circuit that generally comprises a battery having a de-passivation circuit attached across its positive and negative terminals. The de-passivation circuit includes a switch that can open or close the de-passivation circuit, a resistor that can regulate the amount of current drawn from the battery and a clock and timer controller system that controls the switch. The controller system controls closing the circuit long enough to bring the passivation level build-up within the battery to an acceptable lower level and controls opening the circuit long enough to allow passivation levels to build-up to an acceptable upper level.Type: GrantFiled: January 10, 2019Date of Patent: July 12, 2022Assignee: Phase IV Engineering Inc.Inventor: Scott David Dalgleish
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Patent number: 11383194Abstract: A reusable air filter and methods are provided for filtering air being conducted to an air intake of an internal combustion engine. The reusable air filter comprises a filter medium configured to pass an airstream and entrap particulates flowing within the airstream. The filter medium is comprised of cotton gauze disposed in a sinusoidal arrangement that provides a filtration surface area that is larger than a perimeter area of the filter medium. An end cap and base may be configured to retain the filter medium therebetween. The base provides an interface between the air filter and an air inlet of the engine. The filter medium may be disposed in a flat, panel shape that is bordered by a supportive tray. Support rods may be embedded within the tray to prevent bowing of the tray due to air pressure when coupled with an air box of the engine.Type: GrantFiled: September 25, 2019Date of Patent: July 12, 2022Assignee: K&N Engineering, Inc.Inventors: Jere James Wall, Steve Williams
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Patent number: 11385195Abstract: A gas sensor and the drive circuit for the sensor are installed within a mobile electronic device. The gas sensor is intermittently heated to an operating temperature for detecting gases and kept at an ambient temperature for other periods. When a sensor of the mobile electronic device detects that the device is placed in a closed space, the heating of the metal oxide semiconductor is halted. When the sensor detects that the mobile electronic device has been taken out from the closed space, the heating of the metal oxide semiconductor is resumed. The poisoning of the gas sensor by siloxanes or the like is prevented.Type: GrantFiled: December 28, 2017Date of Patent: July 12, 2022Assignee: Figaro Engineering Inc.Inventors: Kenichi Yoshioka, Akiko Omori
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Publication number: 20220214488Abstract: A device is provided. The device may be an optical device, a light coupling device, or a tunable light coupling device. The device includes a first portion, a lens, a light emitting element, and a waveguide. The first portion is disposed adjacent to a surface of a substrate and has a first side and a second side opposite to the first side. The light emitting element is disposed adjacent to the second side of the first portion. The lens is disposed adjacent to the first side of the first portion and between the light emitting element and the waveguide.Type: ApplicationFiled: January 7, 2021Publication date: July 7, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Feng YOU, Jr-Wei LIN, Chieh-Chen FU, Kao-Ming SU, Chen Yuan Weng
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Publication number: 20220216136Abstract: An electronic device package and a method for manufacturing the same are provided. The electronic device package includes a circuit layer and an electronic component. The circuit layer includes a dielectric layer having an opening, and an electrical contact. A width of an aperture of the opening increases from a first surface toward a second surface. The electrical contact is at least partially disposed in the opening and exposed through the opening. The electronic component is disposed on the second surface and electrically connected to the circuit layer.Type: ApplicationFiled: January 5, 2021Publication date: July 7, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-Jen CHENG, Chien-Fan CHEN
