Abstract: A downhole system has a plurality of telemetry systems and a control system configured to obtain information from one or more sensors and transmit that information on one or more of the plurality of telemetry systems. The configuration of a controller may be changed so as to change which information is transmitted on a given telemetry system and how the information is to be transmitted on the given telemetry system.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes an electronic component, a conductive contact, and a first shielding layer. The electronic component has a first surface, a lateral surface angled with the first surface, and a second surface opposite to the first surface. The conductive contact is connected to the first surface of the electronic component. The first shielding layer is disposed on the lateral surface of the electronic component and a portion of the first surface of the electronic component. The first shielding layer contacts the conductive contact.

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.

Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.

Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.

Abstract: The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

Abstract: The present disclosure relates to an electronic component. The electronic component includes a first surface, a first functional region, and a non-functional region. The first functional region is disposed on the first surface of the electronic component. The non-functional region is recessed from the first surface of the electronic component.

Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) home air filter to remove airborne molecular contaminants and volatile organic compounds (VOCs) from air within residential spaces. The HVAC home air filter comprises a supportive frame having a shape and size suitable to orient the HVAC home air filter within a residential HVAC system. A filter medium is retained within the supportive frame to remove the airborne molecular contaminants and VOCs from air flowing through the residential HVAC system. The filter medium comprises a combination of media layers configured to exhibit a relatively high filtration efficiency and a low air pressure drop across the filter medium. The supportive frame comprises a plurality of elongate sections and corner sections disposed along perimeter edges of the filter medium to support the filter medium within the residential HVAC system so as direct air through the filter medium.

Abstract: An apparatus and a method are provided for a crankcase breather vent assembly to direct blow-by gases out of an engine crankcase. A vent base comprising a generally cylindrical vessel communicates received blow-by gases into an interior cavity of a breather vent that comprises a filter medium. Baffles disposed within an interior cavity of the vent base capture oil carried along with the blow-by gases. The captured oil is directed to an oil sump of the engine by way of a suitable hose. A bonnet fastenably receives the breather vent and is configured to reduce a buildup of oil residue on nearby engine components. An outer profile of the breather vent is tapered along a longitudinal dimension of the filter medium to facilitate unrestricted air flow through the filter medium when the bonnet is installed onto the breather vent.

Abstract: An air filter including a base and a first and second frame element is disclosed. Each frame element is coupled to the base. The frame elements have an oscillating shape having a first portion relatively close to the base and a second portion relatively farther from the base. A filter element generally follows the oscillating shape of the frame elements. An air filter system is also disclosed. The air filter system can include the air filter and an air filter container. The air filter container contains the air filter and directs air through the air filter in a predetermined direction. An air filter is disclosed including a support structure and an oscillating shaped filter element attached to the support structure. The oscillating shape increases the air filter surface area for a given volume.

Abstract: An apparatus and a method are provided for an aircharger air intake system for filtering and conducting an airstream to an air intake of an engine. The aircharger air intake system includes an air filter comprising a filter medium configured to entrap particulates flowing within the airstream. An air box comprising one or more sidewalls and a mount wall is configured to support the air filter within an engine bay. The air box is configured to be mounted, or fastened, onto the engine. An intake tube is coupled with the air filter and configured to conduct the airstream to the air intake of the engine. The intake tube is configured to be coupled with an air temperature sensor or a mass air sensor of the engine. An adapter is configured to couple the intake tube with the air intake.

Abstract: The vehicle leveler includes a first portion which has a leading edge and a trailing edge, the trailing edge is disposed further from the driveway than the leading edge. The embodiment also includes a second portion which has a leading edge and a trailing edge, the leading edge of the second portion is attached to the trailing edge of the first portion and the leading edge of the second portion is disposed further from the driveway than the trailing edge of the second portion. The device has opposing side portions and a walkway. The opposing side portions include at least one or more lights which illuminate the leveler and the walkway.

Abstract: A portable dock plate which includes a planar ramp that has opposing side members, the ramp also has a top end and a bottom end, the top end includes a lip portion. The dock plate has a first wheel assembly and a second wheel assembly. The first wheel assembly includes a wheel, wheel lock linkage, a first locking pin with corresponding first locking pin holes, a lip-lowering apparatus and a lip-raising apparatus. The second wheel assembly has a wheel and a second locking pin with corresponding second locking pin holes. The dock plate also includes opposing handrails which are connected to the opposing side members, each handrail includes a moveable lever-handle for movement and placement of the dock plate.

Abstract: An assembly structure and a method for manufacturing the same are provided. The method for manufacturing the assembly structure includes providing a substrate defining an active region and a side rail surrounding the active region; and forming a frame structure on the side rail.

Abstract: A portable dock plate which includes a planar ramp that has opposing side members, the ramp also has a top end and a bottom end, the top end includes a lip portion. The dock plate has a wheel assembly and a opposing wheel assembly. The wheel assembly includes a wheel, wheel lock linkage, a first locking pin with corresponding first locking pin holes, a lip-lowering apparatus and a lip-raising apparatus. The opposing wheel assembly has a wheel and a opposing locking pin with corresponding opposing locking pin holes. The dock plate also includes opposing handrails which are connected to the opposing side members, each handrail includes a moveable lever-handle for movement and placement of the dock plate.

Abstract: A linear stepping motor has a linear stator and a rod movable longitudinally within the stator. The rod has alternating permanent magnets and spacer disks, successive magnets being N-S opposed. A rod pitch equals twice the magnet width plus twice the disk width. The stator has a stack of stator groups associated with the drive phases. Each stator group is a pair of stator poles of opposite magnetic polarity separated by one-half rod pitch. Adjacent poles in different groups are separated by a [(n+1)/2n] rod pitch, where n is the number of drive phases. Each pole may be an annular disk yoke with a plurality of inward projecting salient pole pieces terminating in pole shoes. Conductive windings for a stator group proceed successively around each pole piece in one direction for a first pole of the group and then successively in a reverse direction for a second pole of the group.

Abstract: A semiconductor package structure includes a semiconductor package structure includes a first supporting bar, a second supporting bar and an encapsulant. The second supporting bar is adjacent to the first supporting bar. The first supporting bar and the second supporting bar extend substantially along a first direction. The encapsulant covers the first supporting bar and the second supporting bar. The encapsulant defines a first recess and a second recess recessed from a lower surface of the encapsulant. The first recess extends substantially along a second direction different from the first direction. The second recess is located between the first recess and the second supporting bar.

Abstract: The present specification describes a system for synchronizing a transmission detector and a backscatter detector integrated with a portable X-ray scanner. The system includes a transmitter connected with the transmission detector for transmitting the analog detector signal and a receiver connected with the scanner for receiving the transmitted analog detected signal where the transmitter and the receiver operate in the ultra-high frequency range.

Abstract: The present disclosure provides a package substrate and method of manufacturing the same. The package substrate includes a substrate, an electronic component and a conductive trace. The electronic component is disposed in the substrate, and the electronic component includes a magnetic layer and a conductive wire. The conductive wire includes a first section embedded in the magnetic layer, and a second section connected to the first section and thinner than the first section. A first upper surface of the first section is covered by the magnetic layer, a second upper surface of the second section is lower than the first upper surface, and the magnetic layer includes a first recess disposed in the upper surface and exposing the second upper surface of the second section. The first conductive trace is in the first recess and electrically connected to the second upper surface of the second section of the conductive wire.