Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first substrate, a second substrate, and a solid solution layer. The first substrate includes a first metal layer, and the first metal layer includes a first metal. The second substrate includes a second metal layer. The solid solution layer electrically connects the first metal layer to the second metal layer. The solid solution layer includes a first metal-rich layer.

Abstract: A system including a camera configured to capture a first image of an offshore structure and a second image of the offshore structure, and a processor coupled to the camera, the processor configured to receive the first image and the second image from the camera, recognize a first visual pattern in the first image and the second image, extract pixel coordinates associated with a first position of the first visual pattern in the first image and a second position of the first visual pattern in the second image, and determine a first distance between the first position and the second position, or the first position of the first visual pattern and a first position of a second visual pattern fixably attached to the offshore structure in the first image.

Abstract: A combined mass airflow sensor and hydrocarbon trap is provided for absorbing evaporative hydrocarbon emissions from an air intake duct of an internal combustion engine. The combined mass airflow sensor and hydrocarbon trap comprises a duct that supports a hydrocarbon absorbing sheet in an unfolded configuration within a housing. The duct communicates an airstream from an air filter to the air intake duct during operation of the internal combustion engine. An opening in the housing receives a mass airflow sensor into the duct, such that the mass airflow sensor is disposed within the airstream. Guide vanes extending across the duct reduce air turbulence within the airstream passing by the mass airflow sensor. Ports disposed along the duct allow the evaporative hydrocarbon emissions to be drawn into the interior and arrested by the hydrocarbon absorbing sheet when the internal combustion engine is not operating.

Abstract: The present disclosure provides a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a substrate, a first electronic component, an interlayer, a third electronic component and an encapsulant. The first electronic component is disposed on the substrate. The first electronic component has an upper surface and a lateral surface and a first edge between the upper surface and the lateral surface. The interlayer is on the upper surface of the first electronic component. The third electronic component is attached to the upper surface of the first electronic component via the interlayer. The encapsulant encapsulates the first electronic component and the interlayer. The interlayer does not contact the lateral surface of the first electronic component.

Abstract: An assembly structure and a method for manufacturing an assembly structure are provided. The assembly structure includes a wiring structure and a semiconductor element. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the at least one dielectric layer, and defines an accommodating recess recessed from a top surface of the wiring structure. The wiring structure has a smooth surface extending from the top surface of the wiring structure to a surface of the accommodating recess. The semiconductor element is disposed in the accommodating recess.

Abstract: A semiconductor device package and a method of manufacturing the same are provided. The semiconductor device package includes a first carrier, an encapsulant, a second carrier and one or more supporters. The first carrier has a first surface and a first side contiguous with the first surface. The encapsulant is on the first surface of the first carrier, and the first side of the first carrier is exposed from the encapsulant. The second carrier is disposed over the first carrier. The one or more supporters are spaced apart from the first side of the first carrier and connected between the first carrier and the second carrier. The one or more supporters are arranged asymmetrically with respect to the geographic center of the first carrier. The one or more supporters are fully sealed in the encapsulant.

Abstract: A substrate structure, a package structure, and a method for manufacturing an electronic package structure provided. The substrate structure includes a dielectric layer, a trace layer, and at least one wettable flank. The dielectric layer has a first surface and a second surface opposite to the first surface. The trace layer is embedded in the dielectric layer and exposed from the first surface of the dielectric layer. The at least one wettable flank is stacked with a portion of the trace layer embedded in the dielectric layer.

Abstract: A semiconductor substrate structure and a method of manufacturing a semiconductor substrate structure are provided. The semiconductor substrate structure includes a substrate, an electronic device, and a filling material. The substrate defines a cavity. The electronic device is disposed in the cavity and spaced apart from the substrate by a gap. The filling material is disposed in the gap and covers a first region of an upper surface of the electronic device.

Abstract: An apparatus and a method are provided for a crankcase breather vent assembly to direct blow-by gases out of an engine crankcase. A vent base comprising a generally cylindrical vessel communicates received blow-by gases into an interior cavity of a breather vent that comprises a filter medium. Baffles disposed within an interior cavity of the vent base capture oil carried along with the blow-by gases. The captured oil is directed to an oil sump of the engine by way of a suitable hose. A bonnet fastenably receives the breather vent and is configured to reduce a buildup of oil residue on nearby engine components. An outer profile of the breather vent is tapered along a longitudinal dimension of the filter medium to facilitate unrestricted air flow through the filter medium when the bonnet is installed onto the breather vent.

Abstract: A substrate structure and a semiconductor package structure including the same are provided. The substrate structure includes a circuit layer and a dielectric structure. The circuit layer has a bottom surface and a top surface opposite to the bottom surface. The dielectric structure around the circuit layer. The dielectric structure covers a first part of the bottom surface of the circuit layer, and exposes a second part of the bottom surface and the top surface of the circuit layer. The dielectric structure exposes the top surface of the circuit layer. In addition, a method of manufacturing a semiconductor package structure is also provided.

Abstract: At least some embodiments of the present disclosure relate to a semiconductor package structure. The semiconductor package structure includes a substrate with a first surface, an encapsulant, an electronic component, and a patterned conductive layer. The encapsulant is disposed on the first surface of the substrate. The encapsulant includes a first surface and a second surface. The patterned conductive layer extends on the first surface and the second surface of the encapsulant and protrudes from the first surface and the second surface of the encapsulant. The electronic component is disposed on the patterned conductive layer.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface of the substrate. The substrate has a through opening extending between the first surface of the substrate and the second surface of the substrate. The semiconductor device package also includes a conductive pad in the through opening and approximal to the second surface of the substrate. The conductive pad has a first surface and a second surface opposite to the first surface of the conductive pad. The semiconductor device package also includes a conductive pillar in contact with the first surface of the conductive pad. The second surface of the conductive pad protrudes from the second surface of the substrate. A method of manufacturing a semiconductor device package is also disclosed.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate, a first module disposed on the substrate, a second module disposed on the substrate and spaced apart from the first module, and a conductive element disposed outside of the substrate and configured to provide a signal transmission path between the first module and the second module.

Abstract: An apparatus and a method are provided for a heating, ventilation, and air conditioning (HVAC) home air filter to remove airborne molecular contaminants and volatile organic compounds (VOCs) from air within residential spaces. The HVAC home air filter includes a supportive frame having a shape and size suitable to orient the HVAC home air filter within a residential HVAC system. A filter medium is retained within the supportive frame to remove the airborne molecular contaminants and VOCs from air flowing through the residential HVAC system. The filter medium includes a combination of media layers configured to exhibit a relatively high filtration efficiency and a low air pressure drop across the filter medium. The supportive frame includes a plurality of elongate sections and corner sections disposed along perimeter edges of the filter medium to support the filter medium within the residential HVAC system so as direct air through the filter medium.

Abstract: A diaphragm pump includes a transfer chamber containing hydraulic fluid and a pumping chamber for fluid to be pumped. A connecting assembly includes a plunger extending to the transfer chamber. A diaphragm connects to the connecting assembly and separates the transfer chamber and the pumping chamber. A pressure protection device mounts to the connecting assembly and is configured to seal against the transfer chamber when pressure differential, including reverse pressure differential, across the diaphragm exceeds a predetermined value. The pressure protection device is intermediate the plunger and the diaphragm and supports the diaphragm when there is excess pressure differential across the diaphragm.

Abstract: A semiconductor package structure includes a redistribution structure and an impedance matching device. The redistribution structure includes a first surface, a second surface opposite to the first surface and a circuitless region extending from the first surface to the second surface. The impedance matching device is disposed on the redistribution structure and includes at least one impedance matching circuit aligned with the circuitless region.

Abstract: An apparatus and a method are provided for an aircharger air intake system for filtering and conducting an airstream to an air intake of an engine. The aircharger air intake system includes an air filter comprising a filter medium configured to entrap particulates flowing within the airstream. An air box comprising one or more sidewalls and a mount wall is configured to support the air filter within an engine bay. The air box is configured to be mounted, or fastened, onto the engine. An intake tube is coupled with the air filter and configured to conduct the airstream to the air intake of the engine. The intake tube is configured to be coupled with an air temperature sensor or a mass air sensor of the engine. An adapter is configured to couple the intake tube with the air intake.

Abstract: Various embodiments provide a method of simulating a leak in a pipeline. The method includes: receiving a fluid stream from a fluid supply; and outputting the received fluid stream through an outlet such that the received fluid stream hits an outer surface of the pipeline at a location opposite the outlet such that a vibration is caused in the pipeline. Some other embodiments provide a corresponding system for simulating a leak in a pipeline, and a corresponding outlet for coupling a conduit to a pipeline.

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.