Abstract: A lightweight, portable, water purification device can be used to recover potable water from any water source. The manually operated device, requires no external power, is very lightweight, and removes salt and other impurities from source water while also disinfecting it. A symmetrical reverse osmosis (RO) membrane coupled with a pre-filter is used to remove salt and impurities from the raw water. Metal biocides are integratable to disinfect the permeate, improve wet storage and to significantly reduce biofouling within the RO membrane.

Abstract: A system for extracting samples from a stream in a conduit utilizing a probe, placed in the stream and having a channel for passing samples from the conduit stream. First and second pressure taps measure the pressure inside and outside the probe. A feedback signal, based on a pressure differential relative to the probe, is generated and controls a valve regulating sample velocity flow through the probe channel, that bears a fixed proportion to the velocity of flow in the conduit. The constant of proportionality between flow velocities in the conduit and the probe may be 1.0, resulting in an isokinetic sampling condition.

Abstract: A method of bending glass, in which glass (5) is heated in a bending furnace (1). After the heating, the glass (5) is transferred onto a mold (7). The glass-bending mold (7) is at at least one point arranged to be bent substantially in its entirety when the mold (7) is transferred from the position it had during the initial heating of the glass (5) into a position where the glass (5) is arranged upon the mold (7).

Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises an isolating base, a wafer level package, a lens holder, and a F.P.C.. The wafer level package having a plurality of image sensor dies and a plurality of solder balls is attached to the isolating base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dies. The lens holder is placed in the F.P.C., and the F.P.C. has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dies. Moreover, the image sensor dies may be packaged with passive components or other dies with a side by side structure or a stacking structure.

Abstract: An extended partial least squares (EPLS) approach for the condition monitoring of industrial processes is described. This EPLS approach provides two statistical monitoring charts to detect abnormal process behaviour as well as contribution charts to diagnose this behaviour. A theoretical analysis of the EPLS monitoring charts is provided, together with two application studies to show that the EPLS approach is either more sensitive or provides easier interpretation than conventional PLS.

Abstract: A high frequency substrate includes a first metal layer, a first dielectric layer, a second metal layer, a second dielectric layer and a high-frequency signal transmission line. The first dielectric layer is formed on the first metal layer, and the second metal layer is formed on the first dielectric layer. The first and second metal layers are maintained in a stable voltage status due to the high dielectric coefficient of the first dielectric layer. Besides, the second dielectric layer is formed on the second metal layer. High speed and high frequency transmission are achieved when signals transmitting in the high-frequency transmission line formed on the second dielectric layer due to the low dielectric coefficient of the second dielectric layer.

Abstract: A lead-bond type chip package includes a multilayer substrate for supporting and electrical interconnecting a semiconductor chip. The multilayer substrate has a slot defined therein. The multilayer substrate comprises an interlayer circuit board having prepregs disposed thereon, a plurality of leads on the prepreg on the upper surface of the interlayer circuit board, and a plurality of solder pads for making external electrical connection on the prepreg on the lower surface of the interlayer circuit board. The leads of the multilayer substrate are bonded to corresponding bonding pads formed on the semiconductor chip. A package body is formed on the multilayer substrate around the semiconductor chip and in the slot of the multilayer substrate. The multilayer substrate is capable of providing a power or ground plane formed therein for enhancing the electrical performance of the package, and providing a high wiring density for packaging a chip with high I/O connections.

Abstract: The present invention provides an air flow measuring device comprising a housing with a sub-passage having an inlet and an outlet for air flow formed in the housing, the sub-passage further having a predefined curvature with a maximum downstream point and a flow measuring element located in the sub-passage at a position at least further downstream from the point.

Abstract: A workpiece support provides enhanced reliability of operation and enhanced durability. The workpiece support comprises a rod, a sleeve body, a case member, a scraper, an external peripheral hydraulic chamber, and oil passages, and is further provided with an air passage formed between the rod and the internal peripheral surface of the sleeve body, and connected to the small gap between the rod and the scraper, and an air input port for supplying compressed air to the air passage; wherein compressed air is supplied from the air input port to the air passage and expelled from the small gap between the rod and the scraper when the rod is retracted.

Abstract: A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding conductive traces layer. The via is filled with the insulator so that each of the metal layers is electrically isolated from each other. In addition, this invention also provides a fabrication method of the circuit substrate.

Abstract: The present invention provides a chip package structure and the manufacturing method thereof, which affords higher heat dissipation efficiency and is suitable to fabricate the stack type package structure with a higher integration. The chip package structure comprises a carrier, at least a chip, a heat sink and a mold compound. The chip is disposed on the carrier, while the bonding pads of the chip are electrically connected to the leads of the carrier. The heat sink is disposed over the chip and includes at least a body and a plurality of connecting portions. The connecting portions are disposed around a periphery of the body and are electrically connected to the leads. By using a specially designed heat sink, the chip package structure can afford better heat dissipation and be suitable to form stack type package structures.

Abstract: The present solution relates to a 2D/3D data projector, which comprises: A data projector, the data projector comprising: at least one micro display having an image to be projected, at least one source unit comprising at least one light source chip and at least one beam forming component, each beam forming component comprising at least one diffractive element, and each source unit being designed to preserve etendue as far as possible, to minimize photon loss, to provide a desired projection shape and a uniform illumination onto the micro display, and a focusing optical unit for projecting the image of the micro display on a target.

Abstract: A system and method for centered mounting of a rotating body upon a spindle shaft. The system includes a set of double low-tapers cones arranged and identified according to size. A guide is provided to identify an appropriate cone from the set for a given rotating body pilot hole diameter.

Abstract: A semiconductor integrated circuit includes a memory circuit, an oscillator circuit which generates an internal clock signal, based on control information held in the memory circuit, and a logic circuit which generates control information that causes the frequency of the internal clock signal to coincide with the frequency of an external clock signal. The internal clock signal is used for a synchronous operation of an internal circuit. Even if an error (undesired variation) occurs in the oscillation characteristic of the oscillator circuit due to process variations, it is possible to cause an internal clock signal frequency to coincide with an external clock signal frequency corresponding to a target frequency without the need for external attachment of a crystal oscillator and the input of an external clock signal.

Abstract: The present invention comprises a method of attaching plastic to a metal substrate and a part made by the method. A hydroformed metal section having top and bottom openings is provided. A plastic component is molded about the metal component and through the bottom opening. The plastic component includes a flange on one side thereof to secure the plastic component with the metal component.

Abstract: A proton conductor gas sensor whose durability at high temperature is enhanced by using gel not converted to sol even at high temperature in a water reservoir. Fine particles of silica are gelled by adding water thereto and agitating the mixture under shear force. The thus obtained gel (34) is placed in a water reservoir of proton conductor gas sensor (2) and fed through steam introduction port (30) to MEA (10).

Abstract: A method for removing metal contaminants from water uses lignin derivatives, such as lignosulfonates and kraft lignin, a coagulant, such as a metal salt, and a pH-increasing composition. The lignin derivative is dispersed in the contaminated water, the coagulant is added and the pH is adjusted as required to cause flocculation. A sludge is formed that contains the metals and that is separated from the treated water by filtration. Related methods are used to reduce the leachable metal content of contaminated soils. The invention also provides a composition for stabilizing the metal contaminants in soil, comprising lignin derivatives, a coagulant and a composition for increasing the pH. The mixture is blended with the contaminated soil, reducing its leachable metal content.

Abstract: At least one installation plate is mounted on a base frame, every installation plate having at least one movable plate segment and means for changing the position of every movable plate segment. In order to exactly position the sealing strip to be bonded relative to the installation surface of the vehicle door, every movable plate segment is associated with a reference plunger that is mounted on the base frame so as to be displaceable in the axial direction. The reference plunger extends from the base frame in the direction of the movable plate segment and can be locked relative to the base frame. The reference plunger has on one end an adjustable cam that can be brought into the released from engagement with the vehicle part. At a distance from the earn projection, the reference plunger is provided with a stationary stop against which the associated plate segment can be moved.

Abstract: A system for drying a gas, such as air, includes a source of gas to be dried, a multistage compressor having an inlet connected to the source, and a dryer connected interstage to the compressor and to the outlet of the compressor. The dryer is connected interstage to the compressor between a compression stage and a heat exchanger of one of the compressor stages for regenerating a first desiccant filled tower. The dryer is also connected to the outlet of the compressor for drying the gas using a second desiccant filled tower. A communication structure can be activated to connect the first tower to the outlet of the compressor for drying the gas using the first tower, and to connect the second tower interstage to the compressor for regeneration of the second tower.