Abstract: A rotary valve actuator that effects rotary movement of a rotary valve from 0 to 90°, or to 120°, or to 180°, or even more. The actuator includes a heavy plate member coupled with a linear motive source, which reciprocates the plate member between a first position and a second position. First and second coaxial wheels are fastened together on a single shaft and are rotatably supported tangent to one side of the plate member. A first flexible pull connector, such as a length of roller chain, is attached to the end of the plate member farthest from the linear motive source, and wraps around the first wheel. A second flexible pull connector is attached to the end of the plate member closest to the linear motive source, and wraps around the second wheel, in the opposite direction of winding as for the first flexible connector.

Abstract: The present invention provides for a portable light diffusion unit that comprises a casing 10, one or more laser diodes 2 and a series of diffusion screens 8. The diode(s) direct a concentrated beam of light 3 at an approximate perpendicular angle to the series of diffusion screens and the diffusion screens diffuse the concentrated beam of light into a diffuse beam of light.

Abstract: A semiconductor chip package mainly includes a semiconductor chip, a first dielectric layer disposed on the semiconductor chip, a plurality of conductive traces electrically connected to the semiconductor chip, a second dielectric layer disposed on the conductive traces and the first dielectric layer wherein a portion of the conductive traces are exposed from the second dielectric layer, and a plurality of contacts for external connection formed on the exposed portion of the conductive traces. The semiconductor chip has a surface including an active area, a dummy area surrounding the active area, and a plurality of bonding pads disposed on the active area. The bonding pads are electrically connected to the contacts by the conductive traces. The present invention further provides methods for manufacturing the semiconductor chip package.

Abstract: A log merchandising apparatus includes feeding and staging feeders and a plurality of pivoting overhead truss-mounted saws. The saws are travelling saws, reversibly and independently movable along the longitudinal axis of the log by means of a rack and pinion drive and lineal bearings.

Abstract: A refractory brick having a plurality of segments positioned along a longitudinal axis of the refractory brick. Each segment has at least two arcuate recesses and at least two arcuate ridges. The recesses of a first segment of the segments are positioned at a radial offset with respect to the recesses of a second segment which is adjacent the first segment. A plurality of refractory bricks are interlocked with respect to each other to form a refractory construction.

Abstract: A method for use with a vehicle wheel alignment system to detect vehicle roll or elevation change during a vehicle wheel alignment procedure requires the steps of observing individual vehicle wheels, and detecting a substantially simultaneous changes in position or rotational movement associated with each observed wheel. Responsive to detected changes, vehicle rolling movement or a vehicle elevation change is identified, enabling the vehicle wheel alignment system and/or operator to respond accordingly.

Abstract: A method for forming conductive bumps is applied to a wafer. An under-bump-metallurgy structure and a first photo resist layer are subsequently formed on the wafer. The first photo resist layer, such as a dry film, is patterned to have some openings and then a second photo resist layer is filled into the openings, in which the thickness of the second photo resist layer is fewer than or equal to the thickness of the first photo resist layer. The second photo resist layer is then patterned to have some openings. Next, a conductive layer is formed in the openings and then both the first and second photo resist layers are removed. With the conductive layer as a mask, the exposed under-bump-metallurgy structure is removed and then the conductive layer is reflowed to form some conductive bumps. With two kinds of photo resist layers, the conductive bumps can be provided with increased heights and decreased pitches.

Abstract: An oral airway consists of an elongate tubular member having a leading distal end and a proximal end, the leading distal end leading the elongate tubular member as it is inserted into the mouth and pharynx of a patient. An opening at the leading distal end of the elongate tubular member is inclined so that a posterior portion of the distal portion extends beyond an anterior portion of the distal end. A flexible tip portion extends distally beyond the opening to aid in insertion of the oral airway into the mouth and pharynx of a patient. The tip is configured to flex toward the opening as it abuts tissue within the mouth and pharynx of a patient.

Abstract: In a load handling device for use with a load having a lifting attachment, the lifting attachment being so attached to the load that, when the load is suspended by the lifting attachment, the load is free to pivot relative to the lifting attachment about at least one axis. The load handling device engages the lifting attachment raises the load; so that it is suspended by the lifting attachment, and lowers it. The load handling device includes a stabiliser movable between a retracted position in which it is substantially clear of the load and an extended position in which it contacts the load on either side of the said axis to limit or control pivoting movement of the load about that axis. The stabiliser may be moveable by a plurality of hydraulic rams connected in a closed loop system. Restriction of the flow of the hydraulic fluid between the rams acts to damp movement of the load.

Abstract: A heating assembly is provided for heating objects, for example, food items, that comprises a substrate attached to an insulating frame, which may optionally be attached to a metal pan. The complete assembly is attached to a cooking appliance. The substrate may take the form of a glass disk, for example, tempered soda-lime silica glass, having a conductive coating disposed on one of its surfaces. Conductive metal bus bars, for example, sprayed copper, are disposed onto and in electrical contact with the coating. A temperature sensor may be placed in thermal contact with the heating assembly. As a result, the temperature sensor would allow a cooking appliance to control the electric current being conducted through the heating assembly and, consequently, the temperature of the object being heated.

Abstract: A lead zirconate titanate-based thin film is an epitaxial crystal thin film and has a chemical composition represented by the general formula Pb1-xLnxZryTi1-yO3 (wherein Ln represents any one selected from the group consisting of lanthanum, lanthanoid elements, niobium, calcium, barium, strontium, iron, manganese and tin; and 0?x<1, 0.43?y?0.65) and whose orientation is {111} (including orientations whose tilt angle from the direction perpendicular to the substrate surface is within 15°).

Abstract: In a serial bus network, an environment is provided, in which the serial bus is divided to two local buses and a specific terminal connected to one of the local buses can reliably occupy other terminals connected to the other local bus without influence on the terminals connected to the local buses. A specific terminal is connected to a local bus 101, to which an inner portal 3 is connected, and an ID information thereof is preliminarily recorded in a ROM 8. After a power source is turned on, the specific terminal connected to the side of the inner portal 3 is detected according to the ID information from the ROM 8. An ID information of all of nodes connected to a local bus 104, to which an outer portal 4 is connected, is read out and stored in a control portion 5. A bus reset is generated on the local bus 101. In order to give a connection information of the local bus 104, a self-ID packet is generated by the control portion 5 and transmits it through a dedicated PHY 6.

Abstract: A method for preparing a graphic on a sheet of material which also includes at least one registration mark at and about the graphic in predetermined positions. The method involves the steps of applying the graphic and at least one registration mark on a sheet of material in positions according to layout data, transferring the layout data to a processing controller, placing the sheet of material on a sheet-receiving surface, sensing the position of the registration mark on the sheet of material, and utilizing the layout data and the position of the registration mark to precisely narrow-path-process around the graphic on the sheet of material. Certain embodiments use either (a) a subset of marks which is applied on one side of graphic or certain reference features, such as edges and corners of the sheet and elements of the graphic, to ascertain the position and orientation of the sheet on the apparatus.

Abstract: Disclosed is a method for preparing a corrugated sandwich panel including the steps of: extruding melted polyethylene resin by use of an extruder and a slit nozzle; molding the extruded polyethylene resin to a vertically corrugated inner sheet by use of a plurality of molding rolls; supplying a lower sheet from the lower portion of the inner sheet and an upper sheet from the upper portion thereof; forming a plurality of melting grooves by use of heaters each provided between the upper sheet and the inner sheet and between the lower sheet and the inner sheet such that the melting and bonding between the upper sheet and the inner sheet and between the lower sheet and the inner sheet is conducted; and pressing the upper sheet, the inner sheet and the lower sheet each having the plurality of melting grooves formed thereon by use of a plurality of press rolls.

Abstract: The application relates to a method of obtaining silk feedstock solution from a gland of a silkworm or another silk-producing arthropod in which the body of the silkworm or the other silk-producing arthropod is cut open and the gland removed. The silk feedstock solution is subsequently extracted from the gland and used for extrusion, spinning or moulding of objects.

Abstract: A child safety overcap is provided for a hermetically sealed container with a twist-off access closure having a unitary grip tab. The overcap has a top portion defining at least one slot adapted to engage the tab on the access closure when the overcap is pushed toward the container and a skirt portion that terminates in an expandable rim, e.g., provided with dentils adapted to flex away from the container when the overcap is pushed toward the container. Beads extending inwardly from a distal end of each of the dentils are adapted to snap into a circumferentially groove formed in a neck portion of the container for removably securing the overcap to the container.

Abstract: A method and apparatus for guiding an operator in the alignment of the wheels of an automotive vehicle which has been either modified from a original manufacturer configuration, or for which no previously established alignment settings are known. Initially, the operator identifies known information about the vehicle and selects a desired characteristic of the vehicle for which the vehicle alignment is to be optimized. A set of initial alignment settings are presented to the operator, based upon the selected characteristic for the vehicle, and the vehicle alignment is adjusted thereto. One or more subsequent measurements of the vehicle are acquired. Alignment adjustments to further improve the selected characteristic, identified in response to the vehicle measurements are presented to the operator. The process of alignment adjustment, measurement, and presented adjustments is repeated until an optimal alignment setting for the selected characteristic is reached.

Abstract: A method of fabricating a flip chip ball grid array (FC-BGA) package is provided. First, a substrate including a first surface and a second surface is provided, wherein the first surface includes a plurality of cavities. Then, a plurality of flip chips is adhered in the cavities of the substrate. Thereafter, an underfill filling step is performed to fill an underfill between the substrate the flip chips. Then, a ball placement step is performed to attach a plurality of solder balls to a second surface of the substrate. Thereafter, the substrate is divided to separate a portion of the substrate adhering to the flip chips from a sidewall of the cavities.

Abstract: Disclosed is an apparatus for moving passengers between an airport terminal building and a doorway of an aircraft located rearward of a wing of the aircraft. The apparatus includes a first passageway member pivotally coupled at an inboard end thereof to a rotunda and supported close to an outboard end thereof by a ground support member. The apparatus also includes a telescopic passageway member that is pivotally mounted to the passageway member via a flexible connection disposed therebetween. The telescopic passageway member is for being supported in a cantilever-like fashion such that the telescopic passageway member is extensible over the wing of the aircraft, for servicing the doorway located rearward of the wing.