Patents Assigned to Engineering
  • Patent number: 7049705
    Abstract: A chip structure can reduce the phenomenon of overcrowding current at the conventional circular opening of the passivation layer and further causing electromigration when the current flows to the bonding pad via the transmission line. The improved structure for the side profile of the opening of the passivation layer is about a circular profile, but the portion near to the transmission line is a straight line or a curving line. When the current flows through this opening, the current density can be uniformly distributed along the straight line or the curving line, and whereby the phenomenon of overcrowding current can be reduced.
    Type: Grant
    Filed: July 8, 2004
    Date of Patent: May 23, 2006
    Assignee: ADVANCED Semiconductor Engineering, Inc.
    Inventor: Min-Lung Huang
  • Patent number: 7049830
    Abstract: A sensor device includes i sensor elements of a first type and j additional sensor elements of a second type, the i sensor elements of the first type being connected in a circuitry (n×m) matrix array with n row conductors and m column conductors, where i, j, n and m are natural numbers other than zero and where 1?i?n*m. Each of the i sensor elements of the first type is connected between one of the n row conductors and one of the m column conductors and each of the j additional sensor elements of the second type is connected between two of the n row conductors.
    Type: Grant
    Filed: September 7, 2000
    Date of Patent: May 23, 2006
    Assignee: I.E.E. International Electronics & Engineering S.ar.l.
    Inventor: Martin Thinnes
  • Patent number: 7049689
    Abstract: A chip on glass package. A glass substrate has a top surface and a corresponding bottom surface. A plurality of chips are flip-chip mounted on the top surface of the glass substrate. The bottom surface of the glass substrate is secured to and electrically connected with a carrier. An encapsulation material is formed around the glass substrate to seal the chips. The encapsulation material has a cavity to expose the contact area of the top surface of the glass substrate. Therefore the chip on glass package is to possess a better protection and electrical connection of the glass substrate.
    Type: Grant
    Filed: September 23, 2004
    Date of Patent: May 23, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Tsai Yeh, Chih-Huang Chang, Yung Li Lu
  • Patent number: 7048428
    Abstract: A light guide plate made of a transparent resin includes a first main surface and a second main surface opposite to the first main surface. The first main surface has a surface portion provided with convex portions having a height in the range of 5×10?7 m to 6×10?5 m each and a pitch in the range of 5×10?7 m to 4×10?4 m. The light guide plate having tip portions of at least 80% of the total convex portions with a radius of curvature of 2×10?6 m or less, or the surface of the convex portions having a surface roughness of 3×10?7 m or less.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: May 23, 2006
    Assignee: Mitsubishi Engineering-Plastics Corp.
    Inventors: Hisashi Tahara, Akimasa Kaneishi
  • Patent number: 7049259
    Abstract: Layers comprising a molecular sieve layer on a porous or non-porous support, having uniform properties and allowing high flux are prepared from colloidal solutions of zeolite or other molecular sieve precursors (particle size less than 100 nm), by deposition, e.g., by spin or dip-coating, or by in situ crystallization.
    Type: Grant
    Filed: April 25, 1994
    Date of Patent: May 23, 2006
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Harry William Deckman, Allan Joseph Jacobson, James Alexander McHenry, Klaas Keizer, Zeger Alexander Eduard Pieter Vroon, Lothar Ruediger Czarnetzki, Frank Wenyih Lai, Antonie Jan Bons, Anthonie Jan Burggraaf, Jannetje Maatje van den Berge, legal representative, Edward William Corcoran, Jr., Wilfred Jozef Mortier, Johannes Petrus Verduijn, deceased
  • Publication number: 20060102657
    Abstract: An apparatus for selective eductive dispensing of multiple chemical fluids from separate fluid containers includes a motive fluid inlet; an eductor in fluid communication with said motive fluid inlet; a selector switch defining at least one inlet and an outlet therein, said inlet and outlet in fluid communication with one another and said outlet in fluid communication with said eductor and wherein said selector switch inlet is in selective fluid communication with said fluid containers depending on the position of the selector switch; and a valve located between said motive fluid inlet and said eductor, said valve selectively opened and closed by movement of said selector switch.
    Type: Application
    Filed: November 15, 2004
    Publication date: May 18, 2006
    Applicant: DEMA Engineering Company
    Inventors: Paul Naslund, James Schlueter
  • Publication number: 20060105087
    Abstract: An apparatus and method for removing skin and fat from meat parts, includes a toothroll assembly. The toothroll assembly includes a first section having an outer surface, and a second section having an outer surface. The first section is adapted to rotate at a first surface speed, and the second section is adapted to rotate at a second surface speed independently from the first surface speed.
    Type: Application
    Filed: November 12, 2004
    Publication date: May 18, 2006
    Applicant: Townsend Engineering Company
    Inventor: Brent Veldkamp
  • Patent number: 7044685
    Abstract: A method and system for attaching a TLP to its tendons using pull-down lines to rapidly submerge the hull to installation draft while compensating for inherent hull instability during submergence and to provide motion arrest and aid in station keeping. The system includes tensioning devices mounted on the TLP, usually one for each tendon. Each tensioning device is equipped with a pull-down line which is connected to the corresponding tendon. The TLP hull is submerged to lock-off draft by applying tensions to the pull-down lines connected to the top of the tensions, or by a combination of applying tensions to the pull-down lines and ballasting the hull. As the tensioners take in pull-down line, the hull submerges, i.e. the draft increases.
    Type: Grant
    Filed: February 27, 2004
    Date of Patent: May 16, 2006
    Assignees: Modec International LLC, Sea Engineering Associates, Inc.
    Inventors: Pieter G. Wybro, Shukai Wu, Johannes J. Treu, David E. Chaplin
  • Patent number: 7045103
    Abstract: The present invention provides a novel means to provide more effective mixing of quench gas and process fluids in a height constrained interbed space of a catalytic reactor without increasing pressure drop. In particular, the device improves the effectiveness of an existing mixing volume in mixing the gas phase of two-phase systems. According to the present invention, the quench zone hardware contained within the reactor includes a substantially vertical continuous perimeter solid baffle attached to the underside of the collection tray.
    Type: Grant
    Filed: January 13, 2003
    Date of Patent: May 16, 2006
    Assignee: ExxonMobil Research and Engineering Company
    Inventors: Neil K. McDougald, Sherri L. Boyd, Gregory P. Muldowney
  • Patent number: 7044433
    Abstract: A valve spring mechanism is provided which is suitable for use with the inlet or exhaust valves of an internal combustion engine, and includes a valve head and a valve stem. The mechanism includes a piston/cylinder arrangement in which the cylinder surrounds a portion of the valve stem to define a chamber. The piston is slidable and sealingly mounted on the valve stem. The mechanism also has force transmitting means for transmitting the force produced on the piston by gas pressure within the chamber to the valve stem, and a spring operating on the piston and the stem of the valve for applying a force to the stem tending to close the valve in the event of failure of chamber gas pressure. The spring is positioned to maintain it in a compressed condition during normal operation of the mechanism as a result of gas pressure within the chamber.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: May 16, 2006
    Assignee: Ilmor Engineering Limited
    Inventors: Graham Langham, Timothy Harrop, Anthony Viccars, Rupert Russell
  • Patent number: 7047231
    Abstract: The index optimization (XOP) program is a method to recommend new or improved performance indexes for use by an IBM mainframe DB2 database server for a given set of SQL statements. The recommendations are calculated based on a single call of the DB2 optimizer for each SQL statement with the existing index set, parsing of the SQL statements, the filter factors of the SQL statement predicates, and the getpage workload of an SQL statement. The getpage workload of an SQL statement is the read/change activity on each table and each index currently used for all invocations of an SQL statement. The XOP program computes new and improved performance indexes based on the getpage workload of all relevant SQL statements and does not use the DB2 optimizer to determine the usefulness of potential indexes.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: May 16, 2006
    Assignee: Software Engineering GmbH
    Inventors: Hans-Peter Grasshoff, Jörg Klosterhalfen, Guido Breuer
  • Patent number: 7045391
    Abstract: A multi-chips bumpless assembly package with a patterned conductive layer, a patterned dielectric layer and an insulation layer interposed between the chips is provided, which can shorten the distance of the electrical connection between the chips so as to upgrade the electrical performance of the assembly package and make the package thinner and thinner. Moreover, a manufacturing method thereof is also provided to form a package with high electrical performance.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: May 16, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Chian-Chi Lin
  • Patent number: 7043827
    Abstract: A device for loading a rivet and the like in a rivet holder belt which can continuously and securely load a large number of rivets and the like to the rivet holder belt includes: a hopper 11 for storing the rivets and the like at random; a chute 14 which is continuous from the hopper 11 to guide the rivets and the like that are contained in the hopper 11 to a delivery position of a rivet wheel 15; the rivet wheel 15 which rotates to receive the rivets and the like from the lower end of the chute 14 and store them one by one in each of plural grooves 29 that are formed in the rims of flange bodies; a pushing member 42 which is provided to face the circumference of the rivet wheel 15 to push the rivets and the like resting in the grooves 29 of the rivet wheel 15 into holding notches 37 of a rivet holder belt 36 that is guided along the rivet wheel 15; and a sprocket 35 which is provided in a trunk 27 of the rivet wheel 15 and feeds the rivet holder belt 36 while engaging with engagement holes 38 that are opened
    Type: Grant
    Filed: July 4, 2003
    Date of Patent: May 16, 2006
    Assignee: Opt Engineering Co., Ltd.
    Inventors: Masatoshi Ohuchi, Hirokatsu Kobayashi
  • Patent number: 7045041
    Abstract: The invention provides an ion exchange membrane electrolyzer. An electric current is passed through at least one electrode while the electrode is in contact with a plurality of comb-like flat leaf spring tags extending at an angle from a flat leaf spring form of retainer member located on an electrode partition provided in an electrode chamber. Each pair of comb-like flat leaf spring tags are arranged in such a way that adjacent flat leaf spring tags extend in mutually opposite directions.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: May 16, 2006
    Assignee: Chlorine Engineers Corp. Ltd.
    Inventor: Shinji Katayama
  • Patent number: 7045902
    Abstract: A circuitized substrate has contact pads for mounting a Surface Mount Device (SMD). First and second contact pads are located on a surface of the substrate corresponding to a first terminal and a second terminal of the SMD. The first and the second contact pads have a plurality of expanded portion or diminished portions to form bead receptacles at the facing corners thereof. When solder paste is reflowed to electrically connect the SMD, solder beads formed from the solder paste can be fixed on the bead receptacles. Therefore, there is no free solder bead on the substrate causing short circuit for semiconductor packages.
    Type: Grant
    Filed: October 15, 2004
    Date of Patent: May 16, 2006
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventor: Sheng-Tsung Liu
  • Patent number: 7044149
    Abstract: A pipe fitting with a body adapted for connection at a first end thereof to a supply pipe and at a second end thereof to a distribution pipe so as to permit fluid communication between the supply pipe and the distribution pipe. The body is provided with first valve device by which said fluid communication can be interrupted. The body is provided with an upstream port and a downstream port, respectively upstream and downstream, in use, of the first valve device. The upstream port and said downstream port permitting the first valve device to be by-passed and fluid from the supply pipe to be introduced to the distribution pipe.
    Type: Grant
    Filed: November 21, 2001
    Date of Patent: May 16, 2006
    Assignee: Hy-Ram Engineering Company Ltd.
    Inventors: Peter John Hallam, Robert Philip Lennard
  • Patent number: 7045553
    Abstract: The invention provides a method for producing liquid hydrocarbons by first generating in a pressure swing reformer a synthesis gas stream having a mole ratio of H2:CO greater than 2:1. Then, a portion of the hydrogen is separated to produce a synthesis gas stream having a mole ratio of H2:CO of about 2:1 which steam is then introduced into a hydrocarbon synthesis reactor for conversion to liquid products.
    Type: Grant
    Filed: February 4, 2004
    Date of Patent: May 16, 2006
    Assignee: ExxonMobil Research and Engineering Company
    Inventor: Frank Hershkowitz
  • Patent number: 7043971
    Abstract: A system 10 for detecting sliding of a wheel 12 on a rail 14 includes a roller 16 disposed adjacent the rail 14 so that a wheel 12 travelling along the rail 14 can engage the roller 16, and a tachometer 18 coupled with the roller 16 for providing a rotation signal representative of the degree of rotation of the roller. The system 10 includes a computer 20 which receives the rotation signal from the tachometer 18 and by using an appropriate rotation algorithm calculates the degree of rotation of the roller 16. The computer 20 then compares the degree of rotation with a predetermined range of roller rotations and, if the calculated degree of rotation of the roller is less than predicted by analysis, the apparatus 10 provides a signal indicative of the wheel 12 sliding.
    Type: Grant
    Filed: September 26, 2003
    Date of Patent: May 16, 2006
    Assignee: JRB Engineering Pty Ltd.
    Inventor: Jim Blair
  • Publication number: 20060096915
    Abstract: The method for treating microcystin-containing water which detoxifies microcystin in the microcystin-containing water, the method comprises the step of: bringing the microcystin-containing water into contact with a Sphingomonas bacterium to degrade biologically the microcystin in the microcystin-containing water, wherein: the Sphingomonas bacterium is a strain FERM P-19480 which is deposited as strain MDB1 with International Patent Organism Depositary, National Institute of Advanced Industrial Science and Technology.
    Type: Application
    Filed: November 10, 2005
    Publication date: May 11, 2006
    Applicant: Hitachi Plant Engineering & Construction Co., Ltd.
    Inventors: Tatsuo Sumino, Takako Ogasawara, Ho-Dong Park
  • Patent number: D520949
    Type: Grant
    Filed: April 6, 2005
    Date of Patent: May 16, 2006
    Assignee: WirthCo Engineering, Inc.
    Inventor: Steven E. Wirth