Abstract: A semiconductor package includes spacers, a chip, bonding wires, contacts, and an encapsulant. The chip is disposed on the spacers. The bonding wires are electrically connected to the chip, and the contacts are electrically connected to the bonding wires. The contacts are electrically connected to an external circuit board. The encapsulant encapsulates the spacers and the active and back surfaces of the chip so as to lower the thermal stress of the chip.

Abstract: In piezoceramic multilayer actuators, the head region and the foot region consist of inactive, that is to say electrode-free, piezoceramic layers. Due to the arrangement of the metallic electrodes and the layers of the piezoceramic materials, the shrinkage of the piezoceramic material, in particular in the passive head region and foot region, is influenced during the sintering process and can cause the formation of cracks. Different expansion behavior of the active and of the passive region during operation also lead to stresses which favor crack formation, in particular at the boundary between both regions. According to the invention, it is therefore proposed that a transition region (11), whose shrinkage and expansion behavior lies between the shrinkage and expansion behavior of the active region (10) and the shrinkage and expansion behavior of an inactive region (8, 9) which are electrode free, adjoins the active region (10) up to the inactive head region (8) and up to the inactive foot region (9).

Abstract: The two-piece upper work tool 20 includes a first body member 22 and a second body member 24 which are generally mirror images of each other. The body members 22, 24 include a plurality of orifices 28 therethrough. One of the body members 22 includes a plurality of elongated slots 26 with a circular shape at one end thereof. The other body member 24 has a plurality of fasteners, posts or dowels 30 extending from a surface thereof which interact and mate with the elongated slots 26 on the opposite body member 22. The body members 22, 24 include a rectangular shaped recess 32 on one end thereof and also include a plurality of pockets or cavities on inner surfaces thereof. One of the pockets includes a diameter for a back-up roller generally encompassing 360° except for a very small top portion thereof.

Abstract: A universal CAD-neutral data management system capable of two-way exchange of information between a CAD-neutral database and any one of a variety of proprietary CAD graphics platforms. An updateable CAD-neutral database includes parameter descriptions arrayed against parameter values and may further include parameter type information.

Abstract: A method and device for checking clearance between a stamping die includes a template representative of relative movement between the stamping die and end tool. A template including a surface representing movement of the end tool relative to the stamping die is positioned relative to the stamping die. The position is indicative of a location of the end tool during operation of the stamping die. Contact between the template and the stamping die along the surface representing movement indicates potential contact between the end tool and the stamping die during operation.

Abstract: A liquid crystal display device has a liquid crystal display panel and a drive circuit for supplying gray scale voltages to pixels in the liquid crystal display panel. The drive circuit selects desired gray scale voltage levels from a gray scale voltage varying with time in a staircase fashion, in accordance with display data, and supplies the selected gray scale voltage levels to the pixels. The drive circuit includes a stabilizer circuit provided to a gray scale voltage line for supplying the gray scale voltage varying with time.

Abstract: Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result.

Abstract: A wafer fabricating method at least includes the steps of providing a wafer having an active surface with a plurality of pads, forming a plurality of bumps on the pad, and forming an organic protective layer on the bump and the active surface. Besides improving the quality of the wafer, the wafer structure according to the invention is oxidation-resistant, thus avoiding the cold-joint problem when soldered to the substrate.

Abstract: A bumping process is provided as following: at first, providing a wafer, then forming a first photo-resist layer on a active surface of the wafer and forming at least a first opening on the first photo-resist layer; and forming a copper pillar in the first opening; then forming a second photo-resist layer on the first photo-resist layer and forming at least a second opening on the second photo-resist layer; finally forming a solder layer in the second opening to attach the solder layer on the copper pillar, and removing the first and second photo-resist layer.

Abstract: A high heat dissipation flip chip package structure including a substrate, a chip, a supporting structure, and a heat spreader is provided. The substrate has a substrate surface. The chip has an active surface with several bumps formed thereon. The bumps are connected to the substrate surface. The supporting structure has an upper part having a first opening and a lower part fixed on the substrate surface. The first opening corresponds to the chip. The heat spreader having at least a second opening is fixed on the upper part. The first opening is connected to outside through the second opening. The heat generated by the chip is not only dissipated to outside through the heat spreader by the heat conduction, but also dissipated to outside by the heat convection at the first opening and the second opening.

Abstract: A substrate testing apparatus with full contact configuration. The apparatus includes a jig and a full-contact probe substrate. The jig has a conductive tape disposed thereon for fully electrically connecting a plurality of first connecting pads disposed on an upper surface of a substrate strip. The full-contact probe substrate has a contact surface and includes a plurality of conductive bumps and contact pads. The conductive bumps are disposed on the contact surface, and are used for individually probing a plurality of corresponding second connecting pads disposed on a lower surface of the substrate strip. The contact pads are electrically connected to the conductive bumps. The substrate strip is fully tested by means of the jig and the full-contact probe substrate.

Abstract: A thermal enhance package mainly comprises a chip, a substrate unit, a heat spreader unit and a plurality of pellets. The chip is disposed above the substrate unit and electrically connected to the substrate unit, and an encapsulation unit encapsulates the chip, the substrate unit, the heat spreader unit and the pellets. Therein the pellets are formed on the substrate unit and connect the substrate unit and the heat spreader unit. Thus the heat arisen out of the chip can be transmitted to the heat spreader unit not only through the encapsulation unit but also the pellets. Moreover, the substrate unit has at least one grounding contact connecting to one of the pellets so as to provide the thermal enhance package a good shielding. In addition, a method for manufacturing the thermal enhance package is also provided.

Abstract: A device for the preparation of plastics material, in particular thermoplastic plastics material, has a receiving container (1) for the material, the interior of the said receiving container (1) having tools (21) provided therein which are arranged on a carrier disc (9). The tools are driven by a shaft (4) for rotation about the, in particular vertical, axis (8) of the shaft (4). At least one screw (17) is provided for the removal of the material out of the receiving container (1). The screw housing (16) has a feed opening (27) which is connected with respect to flow to a discharge opening (15) in the container (1), which discharge opening (15) is situated at a lower level than the carrier disc (9) and the tools (21) carried by it. Further moved tools (12), which convey the material into the discharge opening (15), are provided in the receiving container (1) below the carrier disc (9).

Abstract: A bumping process is provided. The bumping process comprises the steps of: firstly, providing a wafer; next forming an under bump metallurgy (UBM) on the active surface of the wafer; then, forming a photo-resist layer on the active surface of the wafer and forming at least an opening in the photo-resist layer; then, sequentially forming a copper post, a barrier and a copper layer; then removing the photo-resist layer; finally reflowing the solder layer in the opening. The barrier layer is made of the materials such as nickel, lest the copper post and the solder layer might contact directly, causing the copper to diffuse fast and lose accordingly. Therefore, the quality of bumping process and structure can be enhanced according to the present invention.

Abstract: A dividing device, comprising at least one vane-type rotor comprising a hub provided with continuous vanes which are slidable through the hub along their longitudinal axis and almost perpendicular to the axis of the hub, the hub being provided with axial grooves for holding the continuous vanes which grooves partially divide the hub in sections, a part of the sections being provided with an aperture axially through the hub, for providing a means for connecting several vane-type rotors to each other, the apertures being unround.

Abstract: A train control system includes a control module that determines a position of a train using a positioning system and consults a database to determine when the train is approaching a portion of track monitored by a track circuit. When the train is near a track circuit, but while the train is still far enough away from the track circuit such that the train can be stopped before reaching the portion of track monitored by the track circuit, the train transmits an interrogation message to a transceiver associated with the track circuit. When the track circuit receives the interrogation message, a test is initiated. The test results are transmitted back to the train. The train takes corrective action if the track circuit fails to respond or indicates a problem.

Abstract: A method for the placement of subterranean electrodes is disclosed and which includes the steps of providing an earth engaging drill; forming a bore hole in the surface of the earth with the earth engaging drill; providing an electrode; and delivering the electrode into the bore hole by employing the earth engaging drill.

Abstract: A transducer is designed and fabricated using stretched rolled electroactive polymers. The invention includes the design, fabrication, and integration of a stretched rolled actuator system with corresponding sensing, control and power subsystems. The invention presented is based on the improved performance of electroactive polymer transducers that can be achieve by prestretching the polymeric material. In this invention, the preferred stretch is maintained in a rolled configuration by introducing structural elements to the transducer. The structural elements facilitate fabrication of the transducer as well as provide a compact and efficient means of maintaining stretch and the desired boundary conditions on the electroactive polymer during operation. These conditions together are used to improve and tailor the strain response of the transducer.

Abstract: A package of a roll, particularly a paper web roll comprising a wrapper, particularly a paper web wrapper wound stagewise into at least two wrappings about the roll in an overlap fashion. The paper web wrapper is wound about the roll in a slightly helical manner so that the edges of the wrapper layers overlap in a staggered fashion. The staggered edges of the overlap wrapping are formed so that each superposed wrapper layer conceals the underlying wrapper layer, whereby in a finished wrapping of a product only one wrapper edge remains visible.

Abstract: A method of manufacturing a package is disclosed. The manufacturing method includes the steps of providing a substrate having an opening, disposing a metal slice on a bottom surface of the substrate to cover the opening and bond pads on the bottom surface of the substrate, disposing a die on the metal slice inside the opening or above the top surface of the substrate outside the opening, forming a number of bond wires between the top surface of the die and the top surface of the substrate to electrically connect the die to the substrate, forming an encapsulating mold compound to cover the die, the bond wires, and a part of the top surface of the substrate, removing a part of the metal slice to form a metal heat slug thermally connected to the die and to expose the bond pads, and forming a number of solder balls on the exposed bond pads.