Patents Assigned to Engineering
  • Patent number: 6981583
    Abstract: A roller for centering a conveyor belt thereon. The roller includes opposite end portions associated with fluid pressurized bladders that are squeezed and distorted as the roller assumes a skewed position as the conveyor belt moves off center on the roller. The roller is urged back to its original position by the bladders along with belt tension recentering the belt.
    Type: Grant
    Filed: August 3, 2004
    Date of Patent: January 3, 2006
    Assignee: Ultra Design and Engineering LLC
    Inventor: James J. Donnenhoffer
  • Patent number: 6982630
    Abstract: A vibrating push button station to be associated with a standard traffic signal of the kind used to control vehicular traffic at an intersection so that visually impaired pedestrians will be alerted when the pedestrian WALK signal is illuminated after first pressing a push button. The push button station includes an electromagnetic assembly that is adapted to generate a changing magnetic field following the depression of the push button. A magnet coupled to the push button by way of a flexible diaphragm is either pulled towards and repelled or simply released by the electromagnetic assembly as the magnetic field changes. The opposite movements of the magnet relative to the electromagnetic assembly is transmitted to the push button as a vibration so that the hand of a user will receive a tactile indication at the push button when vehicular traffic has been halted.
    Type: Grant
    Filed: January 2, 2004
    Date of Patent: January 3, 2006
    Assignee: Polara Engineering, Inc.
    Inventors: Leslie A. Beckwith, Wayne L. Russell
  • Patent number: 6982060
    Abstract: An object of the present invention is to provide a chemical decontamination liquid decomposing system having a catalyst tower which has a mesh filter capable of certainly preventing catalyst from flowing out and a mechanism of pushing-down the catalyst capable of preventing convection of the catalyst caused by decomposition gas. The catalyst tower in accordance with the present invention used for decomposing a chemical decontamination liquid comprises an inlet pipe, a catalyst for decomposing the chemical decontamination liquid, an outlet mesh filter for preventing the catalyst from flowing out, an outlet pipe, a catalyst charging port for charging the catalyst, a catalyst pushing-down mechanism for preventing occurrence of convection of the catalyst caused by a decomposed gas and so on. The outlet mesh filter is arranged so as to closely attached to the inner surface of the catalyst tower and to the inner surface of the catalyst charging port.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: January 3, 2006
    Assignees: Hitachi, Ltd., Hitachi Engineering Co., Ltd.
    Inventors: Motoaki Sakashita, Katsuo Yokota, Yasushi Kobayashi, Kazumi Anazawa
  • Patent number: 6982653
    Abstract: An improved automotive vehicle service system incorporating an RFID interrogator to exchange data with one or more RFID transponders or tags associated with a vehicle undergoing service, or with a component of a vehicle undergoing service. The automotive vehicle service system is configured to utilize data received through the RFID interrogator from the RFID transponders or tags during a vehicle service procedure. Optionally, the automotive vehicle service system is configured to store data associated with a vehicle service procedure in an RFID transponder or tag associated with a vehicle undergoing service, or with a component of a vehicle undergoing service.
    Type: Grant
    Filed: October 14, 2004
    Date of Patent: January 3, 2006
    Assignee: Hunter Engineering Company
    Inventors: David A. Voeller, Joel Clasquin
  • Patent number: 6981521
    Abstract: The Invention relates to an exhaust valve for a semiconductor manufacturing process, which can improve sealability of the exhaust valve, prevent leakage of exhaust gas, and increase the cleaning period, more concretely, The exhaust valve includes a valve body having a chamber formed at the center thereof; a rotary cylinder rotatably coupled to the chamber of the valve body; a protective cover coupled to the outer circumferential surface of the rotary cylinder; an exhaust guide member coupled to the lower portion of the valve body; an adapter seated on the upper portion of the valve body and surrounding the shaft portion of the rotary cylinder; an actuator coupled to the upper portion of the adapter for rotating the rotary cylinder; and sensing means mounted at the upper portion of the valve body, wherein a first sealing member is mounted between the rotary cylinder and the protective cover.
    Type: Grant
    Filed: February 18, 2004
    Date of Patent: January 3, 2006
    Assignee: Daemyung Engineering Co., Ltd.
    Inventor: Tae-Yeol Joung
  • Patent number: 6983457
    Abstract: A compiler, that generates an object program file from a source program in which a plurality of procedures are written, compiles procedures, by regarding the procedures as source-program compile units, to generate corresponding object-program compile units. A plurality of object-program compile units generated are output to a memory together with the corresponding source-program compile units. When compiling a source program in which one procedure has been changed, the compiler compiles only the source-program compile unit corresponding to the changed procedure.
    Type: Grant
    Filed: March 19, 2001
    Date of Patent: January 3, 2006
    Assignees: Hitachi, Ltd., Hitachi Software Engineering Co., Ltd.
    Inventors: Masato Mitsumori, Shinji Asaka, Hiroyuki Hosotani
  • Patent number: 6982155
    Abstract: The present invention provides a method for producing a fatty acid ester inexpensively and efficiently by reacting a lipase or an intact mircroorganism containing a lipase, an oil and fat, and a linear lower alcohol in a system containing little or no solvent in the presence of water. The intact microorganism has not been treated with a solvent or the like, and is used as such, so that a fatty acid ester can be prepared in a simple manner. An oil and fat, a natural oil and fat such as a vegetable oil and fat, an animal oil and fat, as well as a waste oil thereof can be used. According to the method of the present invention, a reaction proceeds even in the presence of water, so that waste oils containing a large amount of water can be used as a raw material. Therefore, the waste oil to be dumped into the environment can be recycled, and a biodiesel fuel, which hardly pollutes the environment, can be provided at the same time.
    Type: Grant
    Filed: November 20, 2000
    Date of Patent: January 3, 2006
    Assignee: Kansai Chemical Engineering Co., Ltd.
    Inventors: Hideki Fukuda, Hideo Noda
  • Patent number: 6981912
    Abstract: A method for filling a natural hollow elongated casing with meat emulsion that involves placing a natural casing on an elongated meat emulsion stuffing tube and longitudinally pumping meat emulsion through the stuffing tube for expansive discharge into the natural casing at a sufficient volume and velocity to provide the primary energy within the natural casing. The method also involves providing a casing hopper that can be pivoted from a forward operating position to a rearward inoperative position.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: January 3, 2006
    Assignee: Townsend Engineering Company
    Inventors: Stephen H. Cate, Marcellinus F. Ottow, Steven P. Hergott, Vincent L. Basile, II, Michael S. Simpson, David Hamblin, Kenneth L. Lebsack, Rudolf P. T. Enklaar, Jay D. Thomas
  • Patent number: 6981365
    Abstract: The disclosed device is directed toward a periodic combustion propulsion system. The periodic combustion propulsion system comprises at least one periodic combustion chamber configured to contain periodic combustion and at least one supersonic exhaust nozzle coupled to the at least one periodic combustion chamber. The supersonic exhaust nozzle is configured with a variable exhaust expansion ratio.
    Type: Grant
    Filed: December 26, 2002
    Date of Patent: January 3, 2006
    Assignee: Sierra Engineering Incorporated
    Inventor: Curtis William Johnson
  • Patent number: 6981425
    Abstract: This invention defines improvements in dynamic force measuring instruments, which allow for the acquisition of data, such as depth driven and force applied, from the driven pile with the sensor being designed to make it easier to place the sensor with respect to the pile to be driven. In particular, the invention comprehends the use of a foil sensor, which is covered with insulation. An inductive belt sensor can be wrapped around the pile anytime during the driving of the pile. The signal from the belt sensor in response to stress in the pile from the pile driver is fed to a computer in the same manner as for the coil. The belt consists of a metallic strip of aluminum or copper or other conductive metallic material covered on both sides and ends by insulation material. At one end of the metallic strip an electric cable is connected which leads through a connector to a computer. The metallic strip picks up the magnetostriction signal, which is proportional to the resistance the pile encounters during driving.
    Type: Grant
    Filed: May 12, 2003
    Date of Patent: January 3, 2006
    Assignee: Frederick Engineering, Co.
    Inventor: Leonard L. Frederick
  • Patent number: 6981572
    Abstract: An access device for providing access between a lower level and an upper level, the access device including a main body which includes a first body section and a body section pivotally connected to the first body section, said first section being mounted for pivotal movement about a main body fixed pivot mounting between an access position and a stowed position, a drive mechanism operable to cause movement of the first body section between the access and stowed positions, the first and second body sections being pivotally movable between an extended position in which they are disposed generally end to end and a retracted position in which they disposed generally side by side, and a control link assembly for controlling the movement of the first and second body sections between the extended and retracted positions.
    Type: Grant
    Filed: February 7, 2003
    Date of Patent: January 3, 2006
    Assignee: Hedweld Engineering Pty Ltd.
    Inventor: Robert Ian Hedley
  • Publication number: 20050287710
    Abstract: A leadless semiconductor package mainly includes a plurality of inner leads, a chip pad, a semiconductor chip and a molding compound. A non-conductive ink is filled between every two of the inner leads, and couples the inner leads to the chip pad so as to be in replacement of the conventional tie bars. The semiconductor chip is disposed on the chip pad and electrically connected to the inner leads. Moreover, the molding compound is formed on the inner leads and the non-conductive ink for encapsulating the semiconductor chip. The non-conductive ink prevents the exposed bottom surfaces of the inner leads from contamination by the molding compound without attaching an external tape during molding. Also the inner leads can be in a multi-row arrangement and the chip pad can be disposed in an optional location.
    Type: Application
    Filed: June 3, 2005
    Publication date: December 29, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yao-Ting Huang, Chih-Te Lin
  • Publication number: 20050286979
    Abstract: Offshore structures such as wind turbines, wave machines and tidal stream turbines are mounted in a previously located foundation including a socket. The foundation includes an upper body with a conical inner surface which acts as a guide for inserting a leading end of the structure into the socket. The conical surface also provides a reaction surface for alignment means for setting the vertical alignment of the structure when inserted in the socket. Clamp means are provided supported by an A frame for controlled lowering of the structure into the socket.
    Type: Application
    Filed: October 20, 2003
    Publication date: December 29, 2005
    Applicant: The Engineering Business Limited
    Inventor: Michael Watchorn
  • Publication number: 20050287705
    Abstract: A flip chip on leadframe package includes a leadframe, a non-flow underfilling material and a flip chip. The leadframe has a plurality of inner leads. Each inner lead has an upper surface and a lower surface. A coating region is defined on the upper surfaces. The non-flow underfilling material is formed on the coating region. The chip has an active surface with a plurality of bumps. The bumps pass through the non-flow underfilling material to be connected to the coating region of the upper surfaces. Only the leadframe inside the coating region are wettable with the bumps for controlling the collapse of the bumps.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 29, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Chaur-Chin Yang
  • Publication number: 20050285245
    Abstract: A substrate strip for a transparent package has a top surface, a bottom surface and an injection region through the top and bottom surface. The top surface includes a plurality of package regions and a plurality of runner regions. The injection region is disposed between the package regions and is coupled to the runner regions. The injection region has a sidewall with a releasing layer for preventing the residual of clear compound from remaining at the injection region of the substrate strip.
    Type: Application
    Filed: May 24, 2005
    Publication date: December 29, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jen-Chieh Kao, Kuo-Hua Chen
  • Publication number: 20050287700
    Abstract: A leadframe with a chip pad for two-sided stacking including a chip pad and a plurality of leads is disclosed. A dielectric adhesive layer is formed on the lower surface of the chip pad and is adhered onto a first trace layer, which has a connecting pad. At least a through hole passes through the chip pad, the dielectric adhesive layer and the first trace layer. An electrically-conductive material is formed inside the through hole for electrically connecting the connecting pad of the first trace layer to the chip pad. When an electronic component is mounted on the lower surface of the chip pad, a plurality of bonding wires having one ends on the upper surface of the chip pads can electrically connect the electronic component to the leads for achieving two-sided stacking of the chip pad.
    Type: Application
    Filed: May 24, 2005
    Publication date: December 29, 2005
    Applicant: Advanced Semiconductor Engineering. Inc.
    Inventor: Yao-Ting Huang
  • Publication number: 20050285490
    Abstract: The present invention relates to a door capable of preventing the door from being warped or bent and also from being damaged due to the penetration of moisture. The door of the present invention comprises front and rear panels which define front and rear surfaces of the door, respectively; a pair of horizontal frames which are fixed to upper and lower ends of the front and rear panels between the front and rear panels, respectively; and a pair of vertical frames which are fixed to right and left ends of the front and rear panels between the front and rear panels, respectively. Each of the vertical frames includes an inner frame which is fixed to an innermost position and made of wood, a middle frame which is fixed to an outer side of the inner frame and made of metal, and an outer frame which is fixed to an outer side of the middle frame and made of a synthetic resin. Further, a foaming agent is filled in an inner space formed between the front and rear panels by the frames to form a foam layer.
    Type: Application
    Filed: April 19, 2005
    Publication date: December 29, 2005
    Applicant: Capstone Engineering Co., LTD
    Inventor: Peter Sibbett
  • Publication number: 20050287701
    Abstract: A leadframe for multi-chip package (MCP) including a die pad and a plurality of leads. A dielectric layer is formed on the lower surface of the die pad, so that the die pad is etched to form an interconnecting conductor with a bonding region. An insulation layer is formed on the interconnecting conductor and exposes the bonding region, so that a chip or a passive component can be electrically connected to the leads via the interconnecting conductor.
    Type: Application
    Filed: May 27, 2005
    Publication date: December 29, 2005
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Yao-Ting Huang
  • Patent number: 6980189
    Abstract: In a liquid crystal display device which inputs analogue video signals after phase development, the deterioration of display quality due to the irregularities of circuit can be reduced. To correct the irregularities due to a plurality of analogue circuits, the liquid crystal display device includes look up tables for a plurality of analogue circuits in the inside of a digital signal processing circuit. The liquid crystal display device performs the correction of irregularities of the analogue circuits based on data set in the look up tables.
    Type: Grant
    Filed: May 10, 2002
    Date of Patent: December 27, 2005
    Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.
    Inventors: Yoshio Maruoka, Toshiki Misonou, Toshio Maeda, Akihiro Watanabe, Hideki Nakagawa
  • Patent number: 6978725
    Abstract: The invention relates to a process and apparatus for treating biogenic residues, particularly sludges, preferably in the area of a clarification plant. Biogenic residues with a variable dry substance are subjected to aerobic drying until an energy-independent thermal treatment can be carried out. During the drying process, evaporated water is discharged in an odor-free condition without releasing freely volatile components, the dried sludge is intermediately stored a number of times and then utilized in preferably a number of successive thermal treatment steps. The two-stage cleaning of the stream of waste gas includes a dust collection unit and an adsorption unit. The waste heat is recycled through a heat exchanger to generate heat and electricity.
    Type: Grant
    Filed: May 7, 2004
    Date of Patent: December 27, 2005
    Assignee: Tecon Engineering GmbH
    Inventors: Peter Michael Ramharter, Harald Bayer