Abstract: A print circuit board is demarcated with arbitrary areas. The print circuit board at one area is partly sucked and fixed on an alignment stage. After alignment with a mask, a pattern of the mask is transferred to the board. Next, shift is made to another area to repeat the same operation, thereby sequentially exposing all the areas to light.

Abstract: The invention relates to an apparatus for treating wastewater from catering industry, especially restaurants. Said apparatus comprises a single reactor tank, said reactor tank comprising: an inlet; an outlet; and an oil-tight tank therein an upper oil film zone, an anoxic zone below said oil film zone and an anaerobic zone below said anoxic zone are divided; an upper net and a lower net are respectively located in the anoxic and anaerobic zones; and some plastic suspending media as biocarriers are introduced in the anoxic and anaerobic zones. The apparatus requires minimal space, energy and operation costs.

Abstract: A thermal enhance package mainly comprises a chip, a substrate unit, a heat spreader unit and a plurality of pellets. The chip is disposed above the substrate unit and electrically connected to the substrate unit, and an encapsulation unit encapsulates the chip, the substrate unit, the heat spreader unit and the pellets. Therein the pellets are formed on the substrate unit and connect the substrate unit and the heat spreader unit. Thus the heat arisen out of the chip can be transmitted to the heat spreader unit not only through the encapsulation unit but also the pellets. Moreover, the substrate unit has at least one grounding contact connecting to one of the pellets so as to provide the thermal enhance package a good shielding. In addition, a method for manufacturing the thermal enhance package is also provided.

Abstract: A multi-chip stack flip-chip package comprises a substrate and a chip assembly on the substrate. The chip assembly includes a dummy chip and a flip chip. The dummy chip has a redistribution layer that has a plurality of bump pads for mounting the flip chip, a plurality of peripheral pads for electrically connecting to the substrate, and a plurality of integrated circuit traces connecting the bump pads with the peripheral pads. The dummy chip is disposed between the flip chip and the substrate as an electrically connecting interface between the flip chip and the substrate for multi-chip flip-chip stack and fine pitch flip-chip mounting.

Abstract: A bumping process, which is a method of forming a plurality of bumps over a wafer, is provided. The wafer has an active surface having a passivation layer and a plurality of bonding pads thereon. The passivation layer exposes the bonding pads on the active surface. An adhesion layer is formed over the active surface of the wafer covering both the bonding pads and the passivation layer. A metallic layer is formed over the adhesion layer. The adhesion layer and the metallic layer are patterned so that the adhesion layer and the metallic layer remain on top of the bonding pads. A photoresist layer is formed on the active surface of the wafer. The photoresist layer has a plurality of openings that exposes the metallic layer. Next, solder balls are disposed into each opening and melted partially to bond to the metallic layer temporarily by performing a heating process simultaneously. Then, a process of disposing the flux material in the openings to cover the surfaces of the solder balls is performed.

Abstract: The present invention provides a new drilling tool useful in machining hydraulic port seals for fluid power ports. The drilling tool drills the port hole to size in a solid material for the minor thread diameter in combination with forming the port in a single operation. The drilling tool has a tool holder having a rotational axis, a first drilling insert having cutting surfaces on a first side and a mounting surface on a second side, at least one second drilling insert having a predetermined cutting surface portion and a mounting portion which is mounted on the holder at a location from the rotational axis of the holder. The at least one second drilling insert has first and second portions which engage and machine a work piece in a drilling operation to form a spot face and a seal form.

Abstract: A bumping process, which is a method of forming a plurality of bumps over a wafer, is provided. The wafer has an active surface having a passivation layer and a plurality of bonding pads thereon. The passivation layer exposes the bonding pads on the active surface. An adhesion layer is formed over the active surface of the wafer covering both the bonding pads and the passivation layer. A metallic layer is formed over the adhesion layer. The adhesion layer and the metallic layer are patterned, so that the adhesion layer and the metallic layer remain on top of the bonding pads. A photoresist layer is formed on the active surface of the wafer. The photoresist layer has a plurality of openings that exposes the metallic layer. Next, solder balls with a solidified material on the surface of each solder ball are disposed into each opening. Then, a reflow process is carried out, so that the solder balls bond with the metallic layer. Finally, the photoresist layer is removed.

Abstract: A thermal enhance MCM package mainly comprises a first chip, a second chip, a substrate and a thermally conductive device. The first chip and the second chip are electrically connected to the substrate, and the thermally conductive device is mounted on the substrate. The thermally conductive device is exposed to the outside so as to prevent the heat generated from the first chip and the second chip from being accumulated in the substrate and transmitted to the motherboard. Accordingly, the thermal performance of the MCM package will be upgraded.

Abstract: Coatings, devices and methods are provided, wherein the contacting surface of a medical device with at least one contacting surface for contacting a bodily fluid or tissue is modified by plasma treatment in a plasma including nitrogen-containing molecules and oxygen-containing molecules and by application of a biologically compatible coating, preferably by plasma treatment in a plasma including polymerized hydrocyclosiloxane monomers. The nitrogen-containing molecules include NH3, (NH4)+, N2O, NO, NO2 and N2O4, and the oxygen-containing molecules include O2 and O3. The plasma-modified contacting surface exhibits decreased adhesion of at least some mammalian cells, such as platelets and leukocytes, decreased restenosis when used with stents, and increased apoptosis. Additional layers may be applied, including amine-providing groups such as N-trimethylsilyl-allylamine, polyoxyalkylene tethers, and bioactive compounds.

Abstract: A valve seal structure enabling the replacement of a metal seal ring, comprising a main body, a metal seat ring prepared separately from the main body to seal a flow channel of the main body, a set ring assembling the metal ring seat to the main body at the periphery of the flow channel in a detachable manner, a first elastomeric ring sheet to seal the boundary between the metal seal ring and the main body and a second ring sheet to seal the boundary between the metal seat ring and the set ring.

Abstract: A system for evaluating the cardiovascular system parameters using indicator dilution and non-invasive or minimally invasive detection methods is disclosed. Intravascular indicators are stimulated, and emission patterns detected for computation of cardiac output, cardiac index, blood volume and other indicators of cardiovascular health.

Abstract: A protection cover integrally formed of plastic by molding ejection is provided. An elastic locking structure is disposed at two sides of the protection cover. An abutting portions having a ‘<’-shaped part and a ‘>’-shaped part is formed on the locking structure to abut against the outer edge wall of the connector so that the protection cover and the connector can be firmly connected together. Reinforcement portions are formed at the inner top face and the link positions at two inner sides of the protection cover.

Abstract: An aqueous cleaning composition fluid foam containing an alkali metal hypochlorite has a particular combination of precursor solution relative viscosity, foam syneresis value, foam horizontal thickness half-life and foam vertical wall clingability, and compared to known hypochlorite-containing cleaning compositions, provides superior cleaning of stubborn mildew, normally without scrubbing. The cleaning composition fluid foam is produced by vigorous agitation of an aqueous hypochlorite solution containing an alkaline builder and a surfactant in the presence of a gas, or by injection of a pressurized propellant into an aerosol dispenser containing such solution and then passing the solution/propellant mix through a mechanical break-up actuator in the valve assembly of the aerosol dispenser.

Abstract: A lumber processor includes slowdown conveyor to transition lumber pieces from one processing device to a subsequent processing device where the movement of lumber pieces changes from lineal to lateral motion; a printer station includes a printer boom which includes a lateral translation device to move a symbol printer over the path of travel of the conveyor to allow the printer to mark pieces of lumber that are passing beneath the printer station.

Abstract: A method for preventing burnt fuse pads from further electrical connection suitable before the formation of bumps on the wafer. A dielectric layer is formed over the active surface of the wafer covering the bump pads and the fuse pads of the wafer, wherein a central region of the fuse pads is burnt to form a gap which allows the material of the dielectric layer to fill up the gap. Afterwards, either a part of the dielectric layer is removed and the part of the dielectric layer covering the fuse pads remainsor a part of the dielectric layer covering the bump pads is removed. Then, an under ball metallurgy layer is formed on the bump pads of the wafer so that the material of the under ball metallurgy layer does not cover the two sides of the fuse pad at the same time, or fill into the gap. As a result, the electrical isolation still remains.

Abstract: The invention relates to a method for treating naphtha, such as catalytically cracked naphtha, in order to remove acidic impurities, such as mercaptans. In particular, the invention relates to a method for mercaptans having a molecular weight of about C4 (C4H10S=90 g/mole) and higher, such as recombinant mercaptans.

Abstract: The present invention allows detection in short time while maintaining the level of the resolving power as high as when a capillary is utilized. The entire surface of an electrophoresis board 10, which is provided with a two-dimensional tubular electrophoresis pathway, is irradiated with excitation light so as to pick up fluorescence or luminescence from a sample with a two-dimensional sensor. By reading the entire electrophoresis pathway, the separated state of the sample may be confirmed during the electrophoresis. As a result, the electrophoresis may be ended when the sample is sufficiently separated and a molecular weight thereof may be determined based on the migration distance.

Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.

Abstract: A Process for the treatment or removal of impurities, such as arsenic, antimony or bismuth, generated as by-products during smelting and refining of copper concentrates, comprises subjecting the by-products to pressure oxidation along with a copper concentrate in a hydrometallurgical copper extraction process or the treatment of impurities when present in a concentrate by subjecting the concentrate to a hydrometallurgical extraction process.

Abstract: The present invention aims to provide an electric vehicle which provides good usability for a user and is economical and to provide a control device for an electric vehicle, which is high in reliability. An AC motor is used as a motor for driving running or driving wheels, and DC motors are respectively used as a steering auxiliary motor and a motor for driving a forklift device. Further, in order to achieve the above aim, an inverter circuit and chopper circuits are connected in parallel with a battery, and an electrolytic capacitor is connected in parallel with the inverter circuit, whereas an electrolytic capacitor is connected in parallel with the chopper circuit.