Abstract: A thermal enhance multi-chips module (MCM) package mainly comprises a first package, a first carrier, a second package, a second carrier, an intermediate substrate and a cap-like heat spreader. The intermediate substrate has an opening. The first carrier and the second carrier are electrically connected to the first package and the second package respectively. The second package is accommodated in the opening and electrically connected to the first package via the first carrier, the second carrier and the intermediate carrier. The cap-like heat spreader has a supporting portion and an alignment portion wherein the supporting portion is connected to the alignment portion to define a cavity.
Type:
Application
Filed:
December 30, 2003
Publication date:
August 5, 2004
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: In a shared bus connection scheme or an individual path connection scheme, a fault caused at a part of a system affects the same in its entirety. Also, these schemes do not permit the determination of fault locations. Adapters 11, 12 are connected to shared memories 21, 22 with a plurality of individual paths 31 through 38. An address locking unit (not shown) is arranged in each of the shared memories 21, 22 to perform address lock check on memory access operations from the adapters 11, 12. If an address to be accessed is in the locked state, the access is held in the lock wait state until the address is unlocked. The access is made when the address locking is cleared.
Abstract: An advanced modular plug connector assembly incorporating a substantially planar, low profile removable insert assembly with associated substrate disposed in the rear portion of the connector housing, the substrate adapted to optionally receive one or more electronic components. In one embodiment, the connector assembly comprises a single port with a single insert assembly. The conductors and terminals of the connector are retained within respective molded carriers which are received within the insert assembly. A plurality of light sources (e.g., LEDs) are also received within the housing, the conductors of the LEDs mated with conductive traces on the substrate of the insert assembly. In another embodiment, the connector assembly comprises a multi-port “1×N” device. Methods for manufacturing the aforementioned embodiments are also disclosed.
Type:
Grant
Filed:
May 6, 2002
Date of Patent:
August 3, 2004
Assignees:
Pulse Engineering, Full Rise Electronics Co., Ltd.
Abstract: A temperature dependent actuating device for a valve having a closure member which must be moved from a first to a second position to close the valve, the actuating device comprising a body, an actuating member supported by the body and moveable from a first non-actuating position to a second actuating position, a biasing device urging the actuating member toward the second position, and a temperature dependent device for releasably retaining the actuating member in the first position provided the temperature is below a predetermined level. The body is adapted to be mounted such that the actuating member is positioned to engage the valve closure member such that if the temperature in the vicinity of the valve rises above the predetermined temperature, the actuating member is released and moves to its second position, moving the valve closure member to its second position and closing the valve.
Abstract: An ice ball launcher simulates the impact of a storm-generated hailstone falling onto a test specimen or structural component exhibit such as a roofing shingle, skylight, automobile panel, aircraft fuselage panel, aircraft wing panel and the like. The launcher includes a tripod base, a rail, a sled, an ice ball holder cup, a manually operable trigger latch assembly, an elastic band and a laser beam aiming device. The ice ball launcher consistently and repeatably projects ice balls at a predetermined velocity and impact energy onto the component sample. The velocity of each ice ball is measured as it transits from the ice ball launcher to the installation mockup, verifying that the ice ball velocity is within a predetermined velocity tolerance range. The measured velocity and known mass of the ice ball are used to calculate the kinetic impact energy on the component sample material, and to determine whether the calculated impact energy is within a predetermined impact energy tolerance range.
Type:
Grant
Filed:
December 17, 2002
Date of Patent:
August 3, 2004
Assignee:
Haag Engineering Co.
Inventors:
John David Stewart, Scott James Morrison, Johnie Pollard Spruiell, Matthew John Sitzmann, Patrick Thomas Price, Steven Richard Smith
Abstract: A gas injector includes a body, a motor and a chopper. The body is mounted on a reaction chamber in a vertically extending cylinder shape and has a plurality of gas injection tubes and a central hollow portion. The plurality of gas injection tubes pass through a bottom face of the body and the central hollow portion passes through each center of the bottom and top faces of the body. The motor has a rotary shaft inserted into the central hollow portion. The chopper is formed in a circular-plate shape and has a notch on a predetermined portion. The chopper is coupled with an end of the rotary shaft and rotated by a rotation of the rotary shaft in a state that the bottom face of the body is closely attached to the chopper through a magnetic sealing.
Abstract: A power supply line is wired in a loop from a battery power supply, and a power supply relay circuit is installed intermediately of the power supply line such that power is supplied from the power supply relay circuit to an electric load connected to a terminal unit of an intensive wiring line. By this arrangement, not only wires for control signal but also wires for power supply can be reduced. The terminal unit may serve also as the power supply relay circuit.
Type:
Grant
Filed:
April 25, 2002
Date of Patent:
August 3, 2004
Assignees:
Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
Abstract: The invention includes a process for preparing an improved melt-strength polyolefin blend by incorporating a polyolefin/clay nanocomposite product. The nanocomposite-modified polyolefin blend is used to form articles through processing operations that involve stretching and/or drawing, such as thermoforming, melt spinning, blow molding and foaming. The addition of the nanocomposite product to the polyolefin blend improves the sag resistance of the polyolefin and broadens the processing window of the operation.
Type:
Grant
Filed:
February 7, 2002
Date of Patent:
August 3, 2004
Assignee:
Solvay Engineered Polymers
Inventors:
Marta Drewniak, Xia Zhao, Satchit Srinivasan
Abstract: A flow rate signal analog-digital conversion circuit 30, an adjustment processing circuit 40 and a chip temperature sensor circuit 60 are disposed a single semiconductor chip 100 to form an integrated circuit, and a chip temperature signal in a form of digital signal outputted from the chip temperature sensor circuit 60 is inputted into the adjustment processing circuit 40 in which correction reducing temperature dependent error in a series of signal processing circuits is performed. Thereby, a board temperature dependent error in a gas flow rate measuring device can be reduced in which adjustment is performed for digital signals.
Type:
Grant
Filed:
April 18, 2002
Date of Patent:
August 3, 2004
Assignees:
Hitachi, Ltd., Hitachi Car Engineering Co., Ltd.
Abstract: An impedance matching circuit for a plasma source includes: a first network including: a first coil; and a RF power supply applying a first voltage to the first coil; and a second network including; a second coil grounded having a second voltage, the second voltage being lower than the first voltage; first and second reactive elements, one end portion of the first and second reactive elements being connected to each end portion of the second coil, respectively; and a load connected to the other end portions of the first and second reactive elements, phases at two end portions of the load being different from each other.
Type:
Grant
Filed:
March 19, 2002
Date of Patent:
August 3, 2004
Assignee:
Jusung Engineering Co., Ltd.
Inventors:
Gi-Chung Kwon, Hong-Sik Byun, Sung-Weon Lee, Hong-Seub Kim, Sun-Seok Han, Bu-Jin Ko, Joung-Sik Kim
Abstract: The object of this invention is to provide a structure of seal ring, and seal structure using the seal ring for flange joints of composite tanks and pipes, that prevents seal surface variations due to differences in thermal contraction between the seal ring and the tank/the flange joint, etc., that improves the resilience of the seal, and that prevents gas leakage due to poor sealing, in order to achieve the stable sealing. The seal ring fits into a ring groove formed in a sealed unit such as a tank unit or a flange joint to provide a tight seal to contain fluids. The heart-shaped seal ring has three curved surface areas that smoothly flow together, comprised of a first curved seal surface which contacts the formed surface of the ring groove, a second curved seal surface which contacts the seal surface of a second member (e.g. manhole cover), and a projecting curved surface on the opposite side.
Type:
Grant
Filed:
November 21, 2002
Date of Patent:
August 3, 2004
Assignees:
Mitsubishi Heavy Industries, Ltd., Eagle Engineering Aerospace Co., Ltd.
Abstract: A flexible substrate mounting the light sources thereon realizes a shape which can eliminate a largely projecting portion and a liquid crystal display device which uses such a flexible substrate is obtained. A strip-like portion is formed by providing an elongated cut in a flexible substrate and light sources are mounted on the strip-like portion. Due to such a constitution, the strip-like portion mounting the light sources 5 thereon has a shape which is substantially arranged parallel to the shape of the main portion 8 which occupies a most portion of the flexible substrate land hence, it is possible to eliminate a largely projecting portion. Then, the light sources 5 are arranged such that the strip-like portion is folded back at least once such that light from the light sources is incident on a light guide body 4.
Abstract: Abrasive sheet materials, abrasive sheet materials with island distributions of abrasive particles, processes for manufacture of abrasive sheet materials with minimized abrasive content (with monolayers and as few as four layers of abrasive particles), processes for using the abrasive sheeting in high speed lapping/abrading processes, and apparatus for using the abrasive sheeting are described. The process for manufacturing the abrasive sheeting provides an economical method for providing improved quality sheeting, while also allowing for greater control over the shape and distribution of abrasive islands on the sheet than is available from present processes of manufacture.
Abstract: Disclosed is a semiconductor package characterized by having at least one cavity defined in a substrate and at least one buffer pad disposed in the at least one cavity. The semiconductor package includes a semiconductor chip disposed on the substrate, at least one conductive trace connecting with the buffer pad and at least one bonding wire electrically connecting the semiconductor chip to the buffer pad. The buffer pad has a thickness larger than the thickness of the conductive trace.
Type:
Grant
Filed:
March 24, 2003
Date of Patent:
August 3, 2004
Assignee:
Advanced Semiconductor Engineering Inc.
Inventors:
Chi Tsung Chiu, Ted Wang, Samuel Wu, Jenny Chen
Abstract: A light detecting device, particularly one which indicates illumination by a laser, and methods for its use. The device includes at least two light detectors which each comprise a light sensor and a light control filter. The light control filter includes microlouvers arranged so that the microlouvers of the two different light detectors are at different angles. The light detecting device may be used to determine the direction to the source of the light detected. Further, two or more devices may be combined into a system that allows for a user to determine the distance to the source of light, particularly laser light emitted by a laser rangefinder. The system is designed to be functional under combat or other battlefield conditions and relatively simple and inexpensive to manufacture.
Abstract: An integrated air filtration unit includes a support structure for mounting a V-shaped filter bank to an air passage of an air handling system. The V-shaped filter bank may be moved from a working position in which the air is filtered to a service position in which a pair of filter pads in the filter bank can be accessed for service or replacement. The integrated air filter unit may include an ultraviolet irradiation system for destroying airborne micro-organisms trapped by the pair of filter pads.
Type:
Application
Filed:
January 27, 2003
Publication date:
July 29, 2004
Applicant:
Engineering Dynamics Ltd.
Inventors:
Forwood Cloud Wiser, George Robert Summers
Abstract: The invention relates to an apparatus for receiving downhole acoustic signals, processing the signals into electric signals, then transmitting the signals wirelessly to a remote above-surface monitoring station. The apparatus is mountable to an above-surface rotatable component used in borehole application. The apparatus includes an instrument housing, and a clamping assembly attached to the housing and having sufficient length and flexibility to enable the apparatus to surround the perimeter of the rotatable component.
Type:
Application
Filed:
January 28, 2003
Publication date:
July 29, 2004
Applicant:
Extreme Engineering Ltd.
Inventors:
Anthony R. Dopf, Paul L. Camwell, Wendall L. Siemens, Derek W. Logan
Abstract: A method for reading beads comprising the steps of: introducing into a flow path functional beads having a coating layer on the surface thereof and having nanoparticles present in the coating layer; enabling the functional beads to emit light specific to the nanoparticles by applying a voltage to the functional beads in the flow path; and identifying the functional beads based on the emission. A bead-reading apparatus employing the method is also disclosed. Since conventional fluorescent beads are excited with a laser for reading fluorescence, light leakage occurs, so that the influence of noise cannot be ignored. The invention eliminates this drawback.