Patents Assigned to Engineering
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Patent number: 6735327Abstract: An ultrasonic diagnostic imaging system is provided which aid in the diagnosis of patient conditions by providing access from the ultrasound system to a library of reference ultrasonic images. The image library is cataloged in accordance with an image characteristic such as the type of examination, the part of the body or the type of pathology shown in the image, and the images of the library are accessed in accordance with these characteristics. The image library may he remotely located and accessible by a number of ultrasound systems over a network, or it may be located on the ultrasound system itself such as on a system disk drive. In a preferred embodiment reference images are concurrently displayed with patient images to aid in discerning the patient's condition.Type: GrantFiled: September 15, 2000Date of Patent: May 11, 2004Assignee: Shofner Engineering Associates, Inc.Inventors: Frederick M. Shofner, Christopher K. Shofner
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Patent number: 6734941Abstract: In a liquid crystal display device having a flexible printed circuit board which includes a laminated structure of a pair of flexible films, a plurality of first conductive layers interposed between inner surfaces of the flexible films to be spaced from each other, and a plurality of groups of terminals formed on an outer surface of one of flexible films opposite to the respective first conductive layers, and a liquid crystal display panel which includes a plurality of groups of wirings formed on one of a pair of substrates thereof and connected to the plurality of groups of terminals respectively, the present invention interposes second conductive layers at respective portions spacing the plurality of first conductive layers between the inner surfaces of the flexible films and prevents the one of the pair of substrates from being cracked when the plurality of terminals of the flexible printed circuit board are connected to the groups of wiring of the one of the substrates by compression bonding thereby.Type: GrantFiled: November 5, 2002Date of Patent: May 11, 2004Assignees: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.Inventors: Hiroyuki Yamazaki, Tomio Oosone, Tetsuya Kawamura
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Patent number: 6735683Abstract: A single-chip microcomputer comprising: a first bus having a central processing unit and a cache memory connected therewith; a second bus having a dynamic memory access control circuit and an external bus interface connected therewith; a break controller for connecting the first bus and the second bus selectively; a third bus having a peripheral module connected therewith and having a lower-speed bus cycle than the bus cycles of the first and second buses; and a bus state controller for effecting a data transfer and a synchronization between the second bus and the third bus. The single-chip microcomputer has the three divided internal buses to reduce the load capacity upon the signal transmission paths so that the signal transmission can be accomplished at a high speed. Moreover, the peripheral module required to have no operation speed is isolated so that the power dissipation can be reduced.Type: GrantFiled: October 4, 2002Date of Patent: May 11, 2004Assignees: Hitachi, Ltd., Hitachi ULSI Engineering Corp.Inventors: Shumpei Kawasaki, Yasushi Akao, Kouki Noguchi, Atsushi Hasegawa, Hiroshi Ohsuga, Keiichi Kurakazu, Kiyoshi Matsubara, Akio Hayakawa, Yoshitaka Ito
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Patent number: 6732540Abstract: Provided are an air conditioning plant control method by which an air conditioning plant can be operated in a most desirable state, and an air conditioning plant so controlled. An air conditioning plant is controlled, which has at least one air conditioner, a refrigerating machine supplying cold water to the air conditioner and a cooling tower supplying cooling water to the refrigerating machine. Within an extent satisfying set conditions of air conditioning, setpoints of the draft temperature of the at least one air conditioner, the cold water temperature of the refrigerating machine and the temperature of cooling water from the cooling tower are altered and optimized so as to minimize energy consumption, operating cost or carbon dioxide emission of the air conditioning plant.Type: GrantFiled: December 19, 2002Date of Patent: May 11, 2004Assignee: Hitachi Plant Engineering & Construction Co., Ltd.Inventors: Yoshibumi Sugihara, Yuuji Miyajima, Takumi Sugiura, Hiroo Sakai, Noboru Oshima, Tadakatsu Nakajima, Hiroshige Kikuchi
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Patent number: 6734100Abstract: A conventional method of forming a ruthenium thin film has a problem that conditions for improving a surface morphology are contrary to those for improving a step coverage, with respect to an oxygen fraction, a pressure, a temperature, etc. Accordingly, it is difficult to obtain a thin film having the improved properties in both the surface morphology and the step coverage. This invention provides three methods for improving both the surface morphology and the step coverage. As one method of forming the ruthenium thin film, a ruthenium seed layer is first formed using a PECVD process and then a ruthenium thin film is deposited using a thermal CVD process. As another method, a first ruthenium thin film is deposited using a thermal CVD process and then a second ruthenium thin film is formed on the first ruthenium thin film using a PECVD process.Type: GrantFiled: December 20, 2002Date of Patent: May 11, 2004Assignee: Jusung Engineering Co., Ltd.Inventors: Kyung Woong Park, Jung Hwan Choi, Young Ki Han
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Patent number: 6733663Abstract: A wastewater treatment washer compactor system having in-channel motorized screen for installation in an influent channel and removal of screenings from the influent stream; at least one washer and at least one compactor for washing and dewatering the screenings; and system control means for coordinating and controlling the motor speed of the motorized screen, the washing cycle time and processing rate of the washer(s), and the compacting rate of the compactor(s).Type: GrantFiled: August 1, 2002Date of Patent: May 11, 2004Assignee: Material Systems EngineersInventors: Richard D. Simon, Michael Guthrie
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Patent number: 6732912Abstract: A solder ball attaching process for attaching solder balls to a wafer is provided. First, an under-ball-metallurgy layer is formed on the active surface of the wafer. Patterned masking layers are sequentially formed over the active surface of the wafer. The masking layers together form a step opening structure that exposes the under-ball-metallic layer. A solder ball is placed on the uppermost masking layer and allowed to roll so that the solder ball drops into the step opening structure by gravity. A reflow process is conducted to join the solder ball and the under-ball-metallurgy layer together. Finally, various masking layers are removed to expose the solder ball on the bonding pad of the wafer.Type: GrantFiled: December 30, 2002Date of Patent: May 11, 2004Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen, Ching-Huei Su, Chao-Fu Weng, Yung-Chi Lee, Yu-Chen Chou, Tsung-Hua Wu, Su Tao
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Patent number: 6732592Abstract: A sensor package which is reliable, low cost, simple, robust, and usable to input additional seat occupant information to an airbag controller to control airbag deployment, and which is insensitive to cross axis loading of a seat belt. A second housing member is internally interfaced with the first housing member, wherein a suspension system frictionlessly suspends the first housing member springably with respect to the second housing member. A pressure sensor is mounted to one of the first and second housings, and a biasing spring is mounted to the other of the first and second housings in axial abutment with the pressure sensor.Type: GrantFiled: March 8, 2002Date of Patent: May 11, 2004Assignee: BGM Engineering, Inc.Inventors: Brian K. Blackburn, Louis R. Brown, Edward James Burley
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Patent number: 6733243Abstract: An interbay transportation system includes bays in which process equipment are provided, stockers provided for the individual bays, and a vehicle traveling through the stockers for transporting a semi-processed product from one of the stockers to another. Timing to start transportation is determined according to the operation status of the process equipment and the number of semi-processed products in the stocker.Type: GrantFiled: April 4, 2002Date of Patent: May 11, 2004Assignees: Renesas Technology Corp., Ryoden Semiconductor System Engineering CorporationInventors: Ryoji Ogata, Hirofumi Ohtsuka, Taichi Yanaru
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Publication number: 20040087118Abstract: Activation of impurities is achieved without involving creation of a crystal defect or deformation by using phonon absorption. A laser beam (42) having a wavelength in a range of 16 to 17 &mgr;m is irradiated onto silicon, to cause phonon absorption. Before an energy supplied from the laser beam (42) diffuses around a portion which is irradiated with the laser beam (42), solid phase epitaxy in the portion finishes. Accordingly, crystallization occurs only in the portion which is irradiated with the laser beam (42), and does not occur in a portion which is not irradiated with the laser beam (42). Hence, heat is not excessively absorbed. Also, local phase change such as melting and solidification is not caused.Type: ApplicationFiled: June 30, 2003Publication date: May 6, 2004Applicants: Renesas Technology Corp., Ion Engineering Research Institute, Corporation, Natsuro TsubouchiInventors: Shigeto Maegawa, Takashi Ipposhi, Kazunobu Ohta, Yasuo Inoue, Masanobu Kohara, Takashi Eura, Natsuro Tsubouchi
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Publication number: 20040087137Abstract: A barrier metal layer constituted of a TiN layer and a Ti layer is formed on a surface of an interlayer insulating film and on an inside surface of an interconnection recess formed in the interlayer insulating film while a substrate is maintained at a temperature of at least 200° C. and lower than 300° C. The interconnection recess is filled with a conductive layer and an extra part of the conductive layer that is deposited on the interlayer insulating film is removed through such a polishing process to form a conductive plug. In the process of forming the barrier metal layer, as the substrate is maintained at the temperature, the residual stress in the deposited barrier metal layer can be reduced. Accordingly, it is achieved to suppress peeling which occurs at the interface between the barrier metal layer and the interlayer insulating film in the polishing process.Type: ApplicationFiled: April 4, 2003Publication date: May 6, 2004Applicants: Mitsubishi Denki Kabushiki Kaisha, Ryoden Semiconductor System Engineering CorporationInventors: Hiroki Takewaka, Takashi Yamashita, Takeshi Masamitsu
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Publication number: 20040086398Abstract: A diaphragm pump which overcomes the problem of diaphragm failure due to overfill of the oil transfer chamber and the inability to self-prime. A notch is provided in the upper portion of the surface of the cylinder so that air can be forced back to the reservoir. In addition, the bias spring connected to the diaphragm and supported by the piston is made stiff with a spring constant that produces a bias pressure that can overcome abnormal suction pressures.Type: ApplicationFiled: October 31, 2002Publication date: May 6, 2004Applicant: Wanner Engineering, Inc.Inventors: Kenneth Eugene Lehrke, Richard D. Hembree
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Publication number: 20040085148Abstract: In response to changes in an input binary digital signal, a 3rd order cosine pulse waveform, which, when it is changed in the increasing direction, has “0” level in a first period of T/12 (T corresponding to one-half cycle of the binary digital signal), is changed as a waveform of (h/2)(1+cos (3&pgr;t/T)+&pgr;/4) in the next period of 4T/12 (−5T/12≦t≦−T/12) and has an h (constant) level in the remaining period of T/12, and when it is changed in the reducing direction, has the h level in the first period of T/12, is changed as a waveform of (h/2)(1+cos(3&pgr;t/T)−&pgr;/4) in the next period of 4T/12 (T/12≦t≦5T/12) and also has “0” level in the remaining period of T/12. By using this pulse wave, a flat part is generated in a time width of T/12 with respect to a judgment point.Type: ApplicationFiled: June 11, 2003Publication date: May 6, 2004Applicant: NEC Engineering, Ltd.Inventors: Noboru Kusama, Katsuya Kitada, Masahiro Akiyama, Takashi Nakagawa, Noriko Sato
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Publication number: 20040085690Abstract: An integrated circuit formed on a semiconductor chip includes voltage regulators for stepping down an externally-supplied power voltage to produce an internal power voltage, and internal circuits which operate based on the internal power voltage. The voltage regulators are laid in the area of the buffers and protective elements for the input/output signals and power voltages so that the overhead area due to the on-chip provision of the voltage regulators is minimized. The internal power voltage is distributed to the internal circuits through a looped main power line, with an electrode pad for connecting an external capacitor for stabilizing the internal power voltage being provided on it, so that the internal power voltage is stabilized and the power consumption of the integrated circuit is minimized.Type: ApplicationFiled: October 27, 2003Publication date: May 6, 2004Applicants: Hitachi, Ltd., Hitachi Device Engineering Co., Ltd.Inventors: Takayasu Ito, Mitsuru Hiraki, Koichi Ashiga
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Publication number: 20040084763Abstract: A thermal enhance semiconductor package with a universal heat spreader mainly comprises a carrier, a semiconductor chip and a universal heat spreader. The semiconductor chip is electrically connected to the carrier in a flip-chip fashion and the universal heat spreader is mounted on the back surface of the semiconductor chip. Therein the universal heat spreader has a plurality of through holes for upgrading the efficiency of heat transmission. Moreover, a heat transmission pin is provided in one of the through holes to increase the areas for heat dissipation so as to enhance the thermal performance of the package.Type: ApplicationFiled: September 9, 2003Publication date: May 6, 2004Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Ching-Hsu Yang
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Publication number: 20040083663Abstract: An apparatus and method for coupling separate series or stacks of structural or shear walls of a multistory building are disclosed. The method comprises constructing a plurality of stacks of shear walls and attaching a rigid coupling member to the top of at least two of the stacks of shear walls between the stacks such that the walls are connected to the rigid coupling member and move together with the coupling member. The apparatus is a rigid coupling member, which may be a beam, such as an I-beam or rectangular beam, made from poured concrete and reinforcing steel. The coupling member may also be a wall of poured concrete and reinforcing steel. The attached rigid member acts to connect the tops of independent stacks of shear walls typically used to build multistory buildings, thereby creating a flexural moment at the top of the building that helps the building resist lateral loads.Type: ApplicationFiled: October 14, 2003Publication date: May 6, 2004Applicants: Englekirk Partners Consulting, Structural Engineers, Inc.Inventors: Robert E. Englekirk, Afshin Ghodsi, Walter H. Mawby
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Publication number: 20040084172Abstract: A distributor device for use in aluminium casting includes a rigid, substantially bowl-shaped receptacle (2) of a refractory material having a base member (4) and a peripheral wall (6) that extends upwards from the base. The receptacle has an inlet opening (8) towards the upper end thereof and a pair of outlet openings (14) towards the base thereof. The device is constructed and arranged such that, in use, molten aluminium poured into the distributor device through the inlet opening (8) is redirected by the distributor device and flows outwards into the mould through the outlet openings (14).Type: ApplicationFiled: October 24, 2003Publication date: May 6, 2004Applicant: Pyrotek Engineering Materials LimitedInventors: Mark Vincent, Sylvain Tremblay
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Patent number: 6730138Abstract: The present invention relates to emulsion compositions for starting a reformer of a fuel cell system. In particular, the invention includes emulsion compositions comprising hydrocarbon fuel, water and alkyl polyglycerol surfactants for starting a reformer of a fuel cell system.Type: GrantFiled: December 20, 2002Date of Patent: May 4, 2004Assignee: ExxonMobil Research and Engineering CompanyInventors: Ramesh Varadaraj, Paul Joseph Berlowitz
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Patent number: 6729702Abstract: A drawer pedestal including a structural support for reinforcing working surfaces of the pedestal. The drawer pedestal includes a shell and a substructure that define a cavity. The shell includes a panel that forms the top surface of the pedestal. A first structure, preferably defining a compartment, projects into the cavity. The support includes first and second side panels connected to one another by a top support panel. In a preferred embodiment, the support is frictionally fit between the first structure and the top panel of the shell to reinforce that top panel. In a more preferred embodiment, the support is constructed from expanded polystyrene foam. The support optionally includes openings that accept guide tabs on the substructure or shell of the drawer pedestal.Type: GrantFiled: April 17, 2002Date of Patent: May 4, 2004Assignee: Cascade Engineering, Inc.Inventors: Brian G. Parker, Tanya A. Best
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Patent number: 6730638Abstract: A lubricating composition for internal combustion engines especially useful with fuels having less than 350 ppm sulfur comprises a lubricating oil basestock, a boron containing ashless dispersant, a molybdenum containing friction reducing agent, a metal type detergent and zinc dithiophosphate.Type: GrantFiled: January 24, 2003Date of Patent: May 4, 2004Assignee: ExxonMobil Research and Engineering CompanyInventors: Liehpao O. Farng, Andrew Jackson, Willie A. Givens, Jr., Douglas E. Deckman, William H. Buck