Patents Assigned to Engineering
  • Patent number: 11901275
    Abstract: A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: February 13, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
    Inventors: Soonheung Bae, Hyunjoung Kim
  • Publication number: 20240043145
    Abstract: The present disclosure is directed to systems and methods for cooling an electric aircraft. The system comprises an electronic device, a casing, at least one fin, and at least one PHP. The electronic device can generate heat. The electronic device can be housed within the casing. The fin can be attached to the outer wall of the casing. The PHP can be embedded within the fin, such that an evaporator section of the PHP is closest to the heat source and the condenser section of the PHP is furthest from the heat source. The PHP can also be placed within the casing. In some embodiments, the casing can have a plurality of slots. The fin can be shaped such that a single fin may slide into a pair of slots and come to rest adjacent to the casing, wherein a PHP can be embedded within the fin.
    Type: Application
    Filed: October 20, 2023
    Publication date: February 8, 2024
    Applicant: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Shailesh JOSHI, Danny LOHAN
  • Publication number: 20240044185
    Abstract: A back door assembly includes a door; a pair of hinges that rotatably couple the door to a frame of the vehicle, the pair of hinges define an axis of rotation about which the door is rotatable; and a pair of latching mechanisms configured to secure the door to the frame, the pair of latching mechanisms are spaced apart from the pair of hinges in a vehicle vertical direction when the door is in a closed position, the pair of latching mechanisms are aligned with the pair of hinges in the vehicle vertical direction when the door is in the closed position such that an axis extending through the pair of latching mechanisms is substantially parallel to the axis of rotation of the pair of hinges.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 8, 2024
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventor: Blaine C. Benson
  • Publication number: 20240044605
    Abstract: An exemplary embodiment may include a cover which can be secured to an item such as a firearm. The cover may be placed over the lower receiver of a rifle. The cover may connect to and snap over the lower receiver in order to provide protection from outside forces or debris. In some embodiments the cover may include a magnet that can magnetically attach to a metal firearm. In another exemplary embodiment, a cover may be formed from a strap that can wrap around a portion of a firearm and elastically grip over the lower receiver.
    Type: Application
    Filed: August 3, 2022
    Publication date: February 8, 2024
    Applicant: Steeldriver Engineering
    Inventor: Daniel SANDERS
  • Publication number: 20240042939
    Abstract: A vehicle includes a seat assembly includes a seat portion and a back portion connected to the seat portion. The back portion has an opening sized to receive a backpack that extends through both a front-facing surface and a rear-facing surface. A backpack is located in the opening in a stowed configuration. The backpack is accessible at the front-facing surface and the rear-facing surface and is removable from the opening.
    Type: Application
    Filed: August 8, 2022
    Publication date: February 8, 2024
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Paxton S. Williams, Scott L. Frederick, Colby Williams
  • Publication number: 20240043732
    Abstract: A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for conduction of thermal energy between a heat generation part and a heat absorption part.
    Type: Application
    Filed: July 28, 2023
    Publication date: February 8, 2024
    Applicant: KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY
    Inventors: Seung Hyup Lee, Gyeong Ho Yun, Yun Jin Kim, Su Hyeon Cho, Min Ho Nam
  • Publication number: 20240042703
    Abstract: A method for manufacturing panel assemblies is provided. The method includes, placing an outer surface of a panel on a mold. The panel includes a carbon fiber. The method further includes placing a channel on an inner surface of the panel. The channel includes a resin. The inner surface opposes the outer surface. The method further includes welding the channel onto the panel by heating the carbon fiber of the panel and placing a rib in the channel. The rib includes a carbon fiber. The method further include welding the rib onto the channel by heating the carbon fiber of the rib.
    Type: Application
    Filed: August 4, 2022
    Publication date: February 8, 2024
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Nobuya Kawamura, Natsuhiko Katahira, John Geriguis
  • Publication number: 20240043222
    Abstract: This disclosure provides a conveyor system having a track bogie with a pair of continuous tracks. A conveyor chassis is rotatably connected with the track bogie. A pivotal king pin is positioned between the continuous tracks and operable for pivoting between a raised position and a lowered tow position, the raised position allowing for operation of the continuous tracks on a ground surface and the lowered tow position allowing for connection with a tow vehicle.
    Type: Application
    Filed: June 23, 2023
    Publication date: February 8, 2024
    Applicant: MGL Engineering Inc.
    Inventor: GARY LOVE
  • Patent number: 11890599
    Abstract: The present disclosure provides an active material comprising a mixed metal oxide in a hydrotalcite derived rocksalt structure, a processes to convert paraffins to corresponding olefins and or heavier hydrocarbons using the active material, and a method of preparing the active material.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: February 6, 2024
    Assignee: EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY
    Inventors: Kun Wang, Yi Du, Bradley D. Wooler, Jonathan E. Mitchell, Christine E. Kliewer
  • Patent number: 11894611
    Abstract: A dielectric lens device for shaping a radar beam includes a first and a second plano-convex cylindrical dielectric lens member and a plane-parallel dielectric substrate. The two plano-convex cylindrical dielectric lens members are arranged with their plane surfaces towards a same surface of the plane-parallel dielectric substrate. The plano-convex cylindrical dielectric lens members are interconnected to the plane-parallel dielectric substrate in a material fit.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: February 6, 2024
    Assignee: IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.
    Inventors: Una Karahasanovic, Andreas Fox, Claude Watgen, Franck Lemoine, Thomas Stifter, Dimitri Tatarinov
  • Patent number: 11892570
    Abstract: An optical assembly includes a light-emitting device, a partition structure and a cover. The partition structure defines a first space for accommodating the light-emitting device. The cover is disposed over the partition structure. The cover has a first surface facing the partition structure and a second surface opposite to the first surface. A light emitted by the light-emitting device forms a first irradiance pattern projected on the second surface of the cover, and the first irradiance pattern includes a first dark zone traversing the first irradiance pattern.
    Type: Grant
    Filed: March 20, 2020
    Date of Patent: February 6, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Hsin-Ying Ho
  • Patent number: 11892346
    Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 6, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsin-Ying Ho, Ying-Chung Chen
  • Patent number: 11892216
    Abstract: A refrigeration system and a control method of the refrigeration system are provided. The refrigeration system includes a cooling circuit and a compressor, an evaporator assembly, and a condenser assembly sequentially arranged on the cooling circuit, and the refrigeration system further includes: a liquid pump cooling assembly, arranged on the cooling circuit and located between the condenser assembly and the evaporator assembly, the liquid pump cooling assembly includes a housing and a liquid pump arranged in the housing, the housing defines a cavity having a liquid reserving function, a refrigerant inlet, a first outlet connected to the cavity and a second outlet connected to the liquid pump, an outlet of the condenser assembly is in connected with the refrigerant inlet, and both the first and second outlets are connected with an inlet of the evaporator assembly; a control assembly, connected with the compressor and the liquid pump.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: February 6, 2024
    Assignee: AIRSYS Refrigeration Engineering Technology (Beijing) Co. Ltd.
    Inventors: Yunshui Chen, Fengpo Chen, Xuming Fang, Hongqiu Yin
  • Patent number: 11893839
    Abstract: A performance system can enable an untrained end user to analyze the performance of a vehicle based on performance data that the vehicle's ECU generates. The performance system can include a performance tool that is configured to request performance data from one or more ECUs of a vehicle. The performance system can also include a performance engine that interfaces with the performance tool to create a log of the performance data. The performance engine can be configured to process the performance data log to generate a number of performance values which correspond to performance parameters. The performance engine can then use the performance values to generate performance representations which can then be presented to the end user.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 6, 2024
    Assignee: Integrated Engineering LLC
    Inventors: Peter Blais, David Blais
  • Patent number: 11891407
    Abstract: Provided herein are methods of novel methods of synthesizing a metal-organic framework system by vapor-phase appending of a plurality of ligands appended to a metal-organic framework. Also, provided are methods of recycling metal-organic framework systems by detaching the ligand and re-appending the same ligand or appending a different ligand to the metal-organic framework to provide a recycled or repurposed metal-organic framework system.
    Type: Grant
    Filed: August 12, 2021
    Date of Patent: February 6, 2024
    Assignee: EXXONMOBIL TECHNOLOGY AND ENGINEERING COMPANY
    Inventors: Carter W. Abney, Joseph M. Falkowski, Mary S. Abdulkarim, Anna C. Ivashko, Julie J. Seo, Aaron W. Peters, Matthew T. Kapelewski, Gerardo J. Majano Sanchez, Wesley Sattler, Simon C. Weston
  • Patent number: 11894340
    Abstract: A package structure includes a wiring structure and a first electronic device. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The first electronic device is electrically connected to the wiring structure, and has a first surface, a second surface and at least one lateral side surface extending between the first surface and the second surface. The first electronic device includes a first active circuit region and a first protrusion portion. The first protrusion portion protrudes from the at least one lateral side surface of the first electronic device. A portion of the first active circuit region is disposed in the first protrusion portion.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: February 6, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Syu-Tang Liu, Min Lung Huang, Huang-Hsien Chang, Tsung-Tang Tsai, Ching-Ju Chen
  • Patent number: D1013899
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: February 6, 2024
    Assignee: NSAFE Engineering, Inc.
    Inventors: Chester J. Budziak, Adam P. Budziak, Gregory C. Budziak
  • Patent number: D1014390
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: February 13, 2024
    Assignee: Sharrow Engineering LLC
    Inventor: Gregory C. Sharrow
  • Patent number: D1014391
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: February 13, 2024
    Assignee: Sharrow Engineering LLC
    Inventor: Gregory C. Sharrow
  • Patent number: D1014467
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: February 13, 2024
    Assignee: Teenage Engineering AB
    Inventors: Jesper Kouthoofd, Gustav Funck, Marcus Söderberg Jansson