Abstract: A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
Type:
Grant
Filed:
March 15, 2021
Date of Patent:
February 13, 2024
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING KOREA, INC.
Abstract: The present disclosure is directed to systems and methods for cooling an electric aircraft. The system comprises an electronic device, a casing, at least one fin, and at least one PHP. The electronic device can generate heat. The electronic device can be housed within the casing. The fin can be attached to the outer wall of the casing. The PHP can be embedded within the fin, such that an evaporator section of the PHP is closest to the heat source and the condenser section of the PHP is furthest from the heat source. The PHP can also be placed within the casing. In some embodiments, the casing can have a plurality of slots. The fin can be shaped such that a single fin may slide into a pair of slots and come to rest adjacent to the casing, wherein a PHP can be embedded within the fin.
Type:
Application
Filed:
October 20, 2023
Publication date:
February 8, 2024
Applicant:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: A back door assembly includes a door; a pair of hinges that rotatably couple the door to a frame of the vehicle, the pair of hinges define an axis of rotation about which the door is rotatable; and a pair of latching mechanisms configured to secure the door to the frame, the pair of latching mechanisms are spaced apart from the pair of hinges in a vehicle vertical direction when the door is in a closed position, the pair of latching mechanisms are aligned with the pair of hinges in the vehicle vertical direction when the door is in the closed position such that an axis extending through the pair of latching mechanisms is substantially parallel to the axis of rotation of the pair of hinges.
Type:
Application
Filed:
August 2, 2022
Publication date:
February 8, 2024
Applicants:
Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
Abstract: An exemplary embodiment may include a cover which can be secured to an item such as a firearm. The cover may be placed over the lower receiver of a rifle. The cover may connect to and snap over the lower receiver in order to provide protection from outside forces or debris. In some embodiments the cover may include a magnet that can magnetically attach to a metal firearm. In another exemplary embodiment, a cover may be formed from a strap that can wrap around a portion of a firearm and elastically grip over the lower receiver.
Abstract: A vehicle includes a seat assembly includes a seat portion and a back portion connected to the seat portion. The back portion has an opening sized to receive a backpack that extends through both a front-facing surface and a rear-facing surface. A backpack is located in the opening in a stowed configuration. The backpack is accessible at the front-facing surface and the rear-facing surface and is removable from the opening.
Type:
Application
Filed:
August 8, 2022
Publication date:
February 8, 2024
Applicants:
Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
Inventors:
Paxton S. Williams, Scott L. Frederick, Colby Williams
Abstract: A heat dissipation material is provided. In the heat dissipation material with a filler, comprising secondary particles in which primary particles are aggregated, the filler in a polymer resin matrix may form a thermal interface layer for conduction of thermal energy between a heat generation part and a heat absorption part.
Type:
Application
Filed:
July 28, 2023
Publication date:
February 8, 2024
Applicant:
KOREA INSTITUTE OF CERAMIC ENGINEERING AND TECHNOLOGY
Inventors:
Seung Hyup Lee, Gyeong Ho Yun, Yun Jin Kim, Su Hyeon Cho, Min Ho Nam
Abstract: A method for manufacturing panel assemblies is provided. The method includes, placing an outer surface of a panel on a mold. The panel includes a carbon fiber. The method further includes placing a channel on an inner surface of the panel. The channel includes a resin. The inner surface opposes the outer surface. The method further includes welding the channel onto the panel by heating the carbon fiber of the panel and placing a rib in the channel. The rib includes a carbon fiber. The method further include welding the rib onto the channel by heating the carbon fiber of the rib.
Type:
Application
Filed:
August 4, 2022
Publication date:
February 8, 2024
Applicants:
Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
Inventors:
Nobuya Kawamura, Natsuhiko Katahira, John Geriguis
Abstract: This disclosure provides a conveyor system having a track bogie with a pair of continuous tracks. A conveyor chassis is rotatably connected with the track bogie. A pivotal king pin is positioned between the continuous tracks and operable for pivoting between a raised position and a lowered tow position, the raised position allowing for operation of the continuous tracks on a ground surface and the lowered tow position allowing for connection with a tow vehicle.
Abstract: The present disclosure provides an active material comprising a mixed metal oxide in a hydrotalcite derived rocksalt structure, a processes to convert paraffins to corresponding olefins and or heavier hydrocarbons using the active material, and a method of preparing the active material.
Type:
Grant
Filed:
October 18, 2021
Date of Patent:
February 6, 2024
Assignee:
EXXONMOBIL TECHNOLOGY AND
ENGINEERING COMPANY
Inventors:
Kun Wang, Yi Du, Bradley D. Wooler, Jonathan E. Mitchell, Christine E. Kliewer
Abstract: A dielectric lens device for shaping a radar beam includes a first and a second plano-convex cylindrical dielectric lens member and a plane-parallel dielectric substrate. The two plano-convex cylindrical dielectric lens members are arranged with their plane surfaces towards a same surface of the plane-parallel dielectric substrate. The plano-convex cylindrical dielectric lens members are interconnected to the plane-parallel dielectric substrate in a material fit.
Type:
Grant
Filed:
December 5, 2019
Date of Patent:
February 6, 2024
Assignee:
IEE INTERNATIONAL ELECTRONICS & ENGINEERING S.A.
Inventors:
Una Karahasanovic, Andreas Fox, Claude Watgen, Franck Lemoine, Thomas Stifter, Dimitri Tatarinov
Abstract: An optical assembly includes a light-emitting device, a partition structure and a cover. The partition structure defines a first space for accommodating the light-emitting device. The cover is disposed over the partition structure. The cover has a first surface facing the partition structure and a second surface opposite to the first surface. A light emitted by the light-emitting device forms a first irradiance pattern projected on the second surface of the cover, and the first irradiance pattern includes a first dark zone traversing the first irradiance pattern.
Type:
Grant
Filed:
March 20, 2020
Date of Patent:
February 6, 2024
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.
Type:
Grant
Filed:
March 29, 2022
Date of Patent:
February 6, 2024
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: A refrigeration system and a control method of the refrigeration system are provided. The refrigeration system includes a cooling circuit and a compressor, an evaporator assembly, and a condenser assembly sequentially arranged on the cooling circuit, and the refrigeration system further includes: a liquid pump cooling assembly, arranged on the cooling circuit and located between the condenser assembly and the evaporator assembly, the liquid pump cooling assembly includes a housing and a liquid pump arranged in the housing, the housing defines a cavity having a liquid reserving function, a refrigerant inlet, a first outlet connected to the cavity and a second outlet connected to the liquid pump, an outlet of the condenser assembly is in connected with the refrigerant inlet, and both the first and second outlets are connected with an inlet of the evaporator assembly; a control assembly, connected with the compressor and the liquid pump.
Abstract: A performance system can enable an untrained end user to analyze the performance of a vehicle based on performance data that the vehicle's ECU generates. The performance system can include a performance tool that is configured to request performance data from one or more ECUs of a vehicle. The performance system can also include a performance engine that interfaces with the performance tool to create a log of the performance data. The performance engine can be configured to process the performance data log to generate a number of performance values which correspond to performance parameters. The performance engine can then use the performance values to generate performance representations which can then be presented to the end user.
Abstract: Provided herein are methods of novel methods of synthesizing a metal-organic framework system by vapor-phase appending of a plurality of ligands appended to a metal-organic framework. Also, provided are methods of recycling metal-organic framework systems by detaching the ligand and re-appending the same ligand or appending a different ligand to the metal-organic framework to provide a recycled or repurposed metal-organic framework system.
Type:
Grant
Filed:
August 12, 2021
Date of Patent:
February 6, 2024
Assignee:
EXXONMOBIL TECHNOLOGY AND
ENGINEERING COMPANY
Inventors:
Carter W. Abney, Joseph M. Falkowski, Mary S. Abdulkarim, Anna C. Ivashko, Julie J. Seo, Aaron W. Peters, Matthew T. Kapelewski, Gerardo J. Majano Sanchez, Wesley Sattler, Simon C. Weston
Abstract: A package structure includes a wiring structure and a first electronic device. The wiring structure includes at least one dielectric layer and at least one circuit layer in contact with the dielectric layer. The first electronic device is electrically connected to the wiring structure, and has a first surface, a second surface and at least one lateral side surface extending between the first surface and the second surface. The first electronic device includes a first active circuit region and a first protrusion portion. The first protrusion portion protrudes from the at least one lateral side surface of the first electronic device. A portion of the first active circuit region is disposed in the first protrusion portion.
Type:
Grant
Filed:
November 15, 2019
Date of Patent:
February 6, 2024
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.