Abstract: A can lid for a can includes a lid panel with a pouring opening, an actuating element on an upper side of the lid panel, and a closure element disposed on a lower side of the lid panel which faces an interior of the can with the can lid attached thereto. The closure element is shiftable between a closed position, in which the closure element closes the pouring opening in a liquid-tight and/or gas-tight manner, and an open position, in which the pouring opening is at least partially uncovered, along the lid panel substantially translationally in a guided manner by the actuating element. The closure element and the actuating element are made of a metallic material and are fastened to one another by a riveted connection and/or a welded connection that moves along a guide slot in the lid panel during shifting of the closure element.

Abstract: A vehicle is provided that includes a battery management system with an energy storage device configured to power the vehicle. The energy storage device includes a battery module with: at least one sensor, a processor, and an optical transceiver. The battery management system also includes a control unit to control the energy storage device, and a control unit optical transceiver configured for bidirectional free-space optical communication with the battery module optical transceiver via a free-space optical communication link. The battery module processor is configured to receive sensor readings and transmit them to the control unit via the free-space optical communication link. Based on the sensor readings, the control unit sends commands to the battery module processor via the free-space optical communication link.

Abstract: A vehicle bumper assembly includes an adaptive energy absorption module operatively connected to a vehicle bumper body. The adaptive energy absorption module includes a primary deformable impact absorber member defining a primary impact chamber having a shape that is structurally adaptive or otherwise conforms to an impact force received by the bumper body. A secondary deformable impact absorber member is arranged in the primary impact chamber and defines a secondary impact chamber containing a shear thickening fluid that exhibits a decreasing viscosity responsive to the impact force. A plurality of fluidically connected tertiary deformable impact absorber members are arranged in an array the primary impact chamber and defines a plurality of tertiary impact chambers containing a volume of fluid, and has a shape that is structurally adaptive to the impact force.

Abstract: A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interconnector, and a stop layer. The main body has a first surface and a second surface opposite to the first surface. The interconnector is disposed on the first surface and exposed from the top surface of the encapsulant. The stop layer is on the second surface, wherein a bottom surface of the stop layer is lower than the second surface.

Abstract: Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.

Abstract: Provided are an ammonia decomposition catalyst and a method of decomposing ammonia. The ammonia decomposition catalyst includes an activated carbon carrier and a metal loaded on the carrier, wherein a Brunauer, Emmett and Teller (BET) specific surface area of the carrier is about 850 m2/g or more, and the metal includes cerium (Ce).

Abstract: A method and a system for manufacturing a semiconductor package structure are provided. The method includes: (a) measuring an amount of a molding powder; (b) controlling the amount of a molding powder; and (c) dispensing the molding powder on an assembly structure including a carrier and at least one semiconductor device disposed on the carrier.

Abstract: Liftgate assemblies with accessory hooks are disclosed. A liftgate assembly includes a door assembly movable in a vehicle vertical direction to an open position. The door assembly includes an interior surface panel, at least one hook disposed on the interior surface panel, and a controller communicatively coupled to the door assembly. The controller is configured to determine a presence of an item suspended from the hook when the door assembly is in the open position, transmit an alert, and prevent the door assembly from closing.

Abstract: An air inflation device includes an inflation unit having an air outlet channel extending along a first axis, and an insertion channel extending along a second axis transverse to the first axis and partially communicating with the air outlet channel. A pressure gauge unit is rotatably mounted on the inflation unit and includes a pressure gauge, and a shaft extending outwardly from the pressure gauge and inserted into the air outlet channel. The shaft has an annular groove formed in an outer peripheral surface thereof and corresponding to and communicating with the insertion channel. An air guide unit includes a manifold inserted into the insertion channel and engaging the annular groove.

Abstract: Molten carbonate fuel cells (MCFCs) are operated to provide enhanced CO2 utilization. This can increase the effective amount of carbonate ion transport that is achieved. The enhanced CO2 utilization is enabled in part by operating an MCFC under conditions that cause transport of alternative ions across the electrolyte. The amount of alternative ion transport that occurs during enhanced CO2 utilization can be mitigated by using a more acidic electrolyte.

Abstract: The present disclosure provides a thermoplastic resin composition having high rigidity and a low coefficient of linear thermal expansion and a molded article including the same. Specifically, the thermoplastic resin composition includes a polypropylene composite resin including high-crystalline polypropylene and the like, an elastomer, and an inorganic filler.

Abstract: A closure system for a beverage container includes a lid with upper and lower sides, a drinking orifice, a closure member for closing the drinking orifice, and an operating member for manually opening the drinking orifice by a user. The closure member is positioned at the lower side of the lid and fixedly connected with the operating member on the upper side of the lid, the closure member configured to overlap the drinking orifice in a closed position. A movement of the operating member in a first direction along a first axis substantially parallel to the upper side of the lid causes movement of the closure member from the closed position and opening of the drinking orifice, and a movement of the operating member along the first axis in a second direction causes movement of the closure member into the closed position and reclosure of the drinking orifice.

Abstract: A metal cored wire for submerged arc welding, the wire comprising a steel sheath with a core comprising powders of: carbon in a range of about 0.3 wt. % to about 1.2 wt. %; silicon in a range of about 0.1 wt. % to about 3.0 wt. %; manganese in a range of about 9.0 wt. % to about 30 wt. %; chromium in an amount less than about 8 wt. %; nickel in an amount less than about 6 wt. %; molybdenum in an amount less than about 6 wt. %; tungsten in an amount less than about 5 wt. %; copper in an amount less than about 4 wt. %; niobium in an amount less than about 2 wt. %; vanadium in an amount less than about 2 wt. %; titanium in an amount less than about 2 wt. %; nitrogen in an amount less than about 0.4 wt. %; boron in an amount less than about 1 wt. %; at least one of: (i) sulfur in an amount less than about 0.3 wt. %; (ii) phosphorous in an amount less than about 0.03 wt. %; or a combination thereof; and the balance with iron.

Abstract: A recessed portion in a semiconductor substrate and a method of forming the same are provided. The method comprises: forming a mask on the semiconductor substrate; forming a protection layer on a top surface of the mask and on at least one sidewall of the mask, and on at least one surface of the semiconductor substrate exposed by the mask; performing a first etching process to remove the protection layer on the top surface of the mask and on a bottom surface of the semiconductor substrate exposed by the mask; and performing a second etching process to remove the remaining protection layer and to etch the semiconductor substrate to form the recessed portion. In this way, a recessed portion with relatively smooth and vertical sidewalls can be realized.

Abstract: A semiconductor device package includes a substrate, a connection structure, a first package body and a first electronic component. The substrate has a first surface and a second surface opposite to the first surface. The connection structure is disposed on the firs surface of the substrate. The first package body is disposed on the first surface of the substrate. The first package body covers the connection structure and exposes a portion of the connection structure. The first electronic component is disposed on the first package body and in contact with the portion of the connection structure exposed by the first package body.

Abstract: The present disclosure provides an electronic package. The electronic package includes an antenna structure having a first antenna and a second antenna at least partially covered by the first antenna. The electronic package also includes a directing element covering the antenna structure. The directing element has a first portion configured to direct a first electromagnetic wave having a first frequency to transmit via the first antenna and a second portion configured to direct a second electromagnetic wave having a second frequency different from the first frequency to transmit via the second antenna. A method of manufacturing an electronic package is also provided.

Abstract: A tool pack assembly having sensor plates to measure the temperature of a tool pack forming die and the forces exerted on the forming dies during can production. Each sensor plate may include at least one temperature sensor and at least one strain sensor for reading and transmitting temperature and strain data relating to the dies of a tool pack assembly. The data read and transmitted may be used to determine the concentricity of the punch of a tool pack assembly during operation making can bodies.

Abstract: Systems and methods of collision detection are provided which combine the concept of collaborative support with common/existing in-vehicle imaging and proximity sensor technologies. In particular, an “intermediary” vehicle may signal one or more objects (e.g. other vehicles, pedestrians, etc.) which are within the line of sight of the intermediary vehicle (and thus its imaging and proximity sensors), but not within the line of sight of each other, to a potential collision between the two objects.

Abstract: A capacitor structure includes a first metal layer, a first metal oxide layer, a second metal oxide layer, a first conductive member, a second conductive member and a metal composite structure. The first metal layer has a first surface and a second surface opposite the first surface. The first metal oxide layer is formed on the first surface of the first metal layer. The second metal oxide layer is formed on the second surface of the first metal layer. The first conductive member penetrates through the capacitor structure and is electrically isolated from the first metal layer. The second conductive member is electrically connected to the first metal layer. The metal composite structure is disposed between the second conductive member and the first metal layer.