Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.
Type:
Grant
Filed:
November 29, 2021
Date of Patent:
December 5, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: An air filter device and an operating method thereof. The air filter device comprises an air filter system and a powder distribution system. The air filter system comprises an air filter chamber (1), a clean air chamber (2), and a high-pressure jet pulse powder cleaning device (3). An entrance of the air filter chamber (1) is in communication with an air inlet pipe (4); an exit of the clean air chamber (2) is in communication with an air outlet pipe (6), and the air outlet pipe (6) is in communication with an exhaust fan (9). A plurality of bag filters or filter cartridges (10) are disposed in the air filter chamber (1). An opening end of each of the bag filters or filter cartridges (10) is in communication with the clean air chamber (2), and high-pressure jet pulse powder cleaning devices (3) are disposed above the opening end of the corresponding bag filters or filter cartridges (10).
Type:
Grant
Filed:
August 18, 2016
Date of Patent:
December 5, 2023
Assignee:
FOSHAN HUMAN HABITAT ENVIRONMENTAL PROTECTION ENGINEERING CO., LTD.
Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.
Type:
Grant
Filed:
October 1, 2021
Date of Patent:
December 5, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: A vehicle includes a vehicle structure an airbag deployment location and an external skin layer that covers the airbag deployment location. An object detection sensor is located on or covered by the external skin layer of a vehicle component and located within an object detection zone. The object detection sensor is configured to provide a signal to a controller upon detecting an object within the object detection zone.
Type:
Grant
Filed:
August 3, 2022
Date of Patent:
December 5, 2023
Assignees:
Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
Abstract: A bicycle may include a front triangle and a rear suspension system that couples the front triangle to a rear wheel and is dampened by at least one shock absorber. The rear suspension system includes a six-bar linkage having two ternary links separated from each other by one or more binary links, such that the two ternary links do not share a common joint. One of the ternary links may comprise a chain stay. In some examples, the other ternary link may comprise the front triangle. In some examples, the other ternary link may comprise a rocker arm coupling a seat stay link to the shock absorber.
Abstract: Systems, apparatus, and methods for steering one or more wheels of a flat-towed vehicle moving in reverse. A system may include a power steering mechanism configured to steer the one or more wheels. The system may further include a connector configured to carry one or more signals from a towing vehicle to the flat-towed vehicle. The system may further include an electronic control unit (ECU) coupled to the power steering mechanism and the connector. The ECU may receive a signal that one or more reverse lights of the towing vehicle are lit or on. The ECU may be configured to actuate the power steering mechanism to steer the one or more wheels to a straight position upon receiving the signal.
Type:
Grant
Filed:
March 4, 2021
Date of Patent:
December 5, 2023
Assignee:
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
Abstract: Devices, systems, methods, and techniques for multicast failover handling in a computer communication network are disclosed. The methods herein described are particularly suited to software-defined networks (SDNs), and comply with requirements for assuring delivery of network traffic to each destination from a source engaged in multicast network traffic dissemination, assured delivery of each data packet as introduced into the network by the source device and avoidance of duplicate delivery of data. The methods herein are agile and respond rapidly to changes in a network while traffic is on the network.
Type:
Grant
Filed:
February 24, 2022
Date of Patent:
December 5, 2023
Assignee:
Schweitzer Engineering Laboratories, Inc.
Inventors:
Tristan Lloyd Mullis, Steven D. Herrmann, Robert Meine
Abstract: A method for enhancing anaerobic digestion based on solid-liquid interface renewal in sludge is disclosed. The method includes subjecting sludge to a centrifugation, a thermal baking and a redissolution in softened water in sequence to renew a solid-liquid interface in sludge, and subjecting the sludge to an anaerobic digestion to increase methane production from organic matter in the sludge by anaerobic biotransformation.
Type:
Grant
Filed:
September 24, 2021
Date of Patent:
December 5, 2023
Assignees:
TONGJI UNIVERSITY, SHANGHAI URBAN POLLUTION CONTROL ENGINEERING RESEARCH CENTER CO., LTD.
Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.
Type:
Grant
Filed:
November 23, 2021
Date of Patent:
December 5, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: A method for optimizing a parking spot database is provided including determining a utility score of a candidate route to a candidate parking spot of a plurality of parking spots of a parking spot database based on an availability status of a non-candidate parking spot along the candidate route, and selecting the candidate route from a plurality of candidate routes based on the utility score.
Type:
Grant
Filed:
February 2, 2021
Date of Patent:
December 5, 2023
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: A speed reducer for a gravity roller conveyor system is provided. The speed reducer includes a mounting member and an engagement member rotatably connected to the mounting member and structured to be rotatable to a first rotational position and to a second rotational position. A damper is connected to the mounting member and is structured to bias the engagement member to the first rotational position. A retraction mechanism is operably connected to the engagement member and is structured to be operable to rotate the engagement member to the second rotational position against a biasing force exerted by the damper on the engagement member when an object moving along the conveyor becomes stalled, thereby enabling the object to move along the conveyor past the engagement member. A speed reducer system incorporating the speed reducer is also described.
Type:
Application
Filed:
May 31, 2022
Publication date:
November 30, 2023
Applicants:
Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
Abstract: Systems and methods of lifting and installing a fuel tank on a vehicle are provided. In particular, a lifting apparatus may (1) receive fasteners and fuel tank bands prior to lifting, the fasteners secured/extended through fastener openings of the fuel tank bands; (2) lift, in a first lifting stage, the received fuel tank bands to a ground-facing surface of a fuel tank (the fuel tank may be resting on a pedestal or a similar support structure) such that the fuel tank bands cradle the fuel tank; and (3) lift, in a second lifting stage, the received fuel tank bands and the cradled fuel tank to the underside of a vehicle for installation.
Type:
Application
Filed:
May 25, 2022
Publication date:
November 30, 2023
Applicants:
Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
Inventors:
Ronald Scott Friend, Robert Aaron Allex, Brian McElroy, David L. Brock, Christopher L. Rexroat
Abstract: A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at least one first electronic component embedded in the substrate, and a first circuit layer disposed on the substrate and electrically connected to the first electronic component. The first circuit layer includes a conductive wiring pattern. The stress buffering layer is disposed on the substrate. The conductive wiring pattern of the first circuit layer extends through the stress buffering layer. The second conductive structure is disposed on the stress buffering layer and the first circuit layer.
Type:
Application
Filed:
August 8, 2023
Publication date:
November 30, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Inventors:
Chien-Mei HUANG, Shih-Yu WANG, I-Ting LIN, Wen Hung HUANG, Yuh-Shan SU, Chih-Cheng LEE, Hsing Kuo TIEN
Abstract: A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.
Type:
Application
Filed:
August 8, 2023
Publication date:
November 30, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: The present invention relates to an apparatus for reducing greenhouse gas emission in a vessel and a vessel including the same, which are capable of constantly maintaining a concentration of a greenhouse gas absorbing liquid to prevent a decrease in absorption performance of an absorption tower, and applying a pressurization system to prevent the loss of an absorbent liquid due to the natural evaporation of a high-concentration absorbent liquid. Or which are capable of cooling exhaust gas with fresh water by a heat exchange method, thereby preventing a decrease in concentration of an absorbent liquid, and controlling the concentration of the absorbent liquid to constantly maintain the concentration of the absorbing liquid, thereby preventing a decrease in absorption performance.
Abstract: A collator device for receiving finished ammunition cartridges in a non-oriented condition and orienting them into a stream of aligned ammunition cartridges for downstream manufacturing or packaging processes. The device incorporates a flat, circular collator plate which rotates inside a collator can with an upstanding circular sidewall. The collator plate upper surface forms a series of radially orienting vanes. Ammunition apertures are formed around the perimeter of the collator plate interleaved between the vanes. As the collator plate is rotated, the apertures receive ammunition cartridges aligned in either a radially inward or radially outward position. Features of the apertures cause the cartridges to drop in an aligned condition as the apertures pass over a slot in the collator can backing plate. Numerous features are provided to enhance throughput and reduce damage to the components as they are handled and processed in the device.
Type:
Application
Filed:
May 24, 2022
Publication date:
November 30, 2023
Applicant:
MECTRON ENGINEERING COMPANY, INC.
Inventors:
Mark L. HANNA, Michael A. HALL, Robert J. PEREZ, Alexander T. VANIAS
Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.
Type:
Application
Filed:
August 8, 2023
Publication date:
November 30, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: A system, method and storage medium for providing an emergency vehicle (EV) alert includes generating a geofence by varying a size or shape of the geofence according to a working mode of an EV and transmitting the generated geofence to another vehicle.
Abstract: A wiring structure and a method for manufacturing the same are provided. The wiring structure includes a lower conductive structure, an upper conductive structure and a conductive via. The lower conductive structure includes a first dielectric layer and a first circuit layer in contact with the first dielectric layer. The upper conductive structure is attached to the lower conductive structure. The upper conductive structure includes a plurality of second dielectric layers, a plurality of second circuit layers in contact with the second dielectric layers, and defines an accommodating hole. An insulation material is disposed in the accommodating hole. The conductive via extends through the insulation material, and electrically connects the lower conductive structure.
Type:
Application
Filed:
August 15, 2023
Publication date:
November 30, 2023
Applicant:
Advanced Semiconductor Engineering, Inc.
Abstract: Proposed are an electrically conductive contact pin, a method for manufacturing the same, an inspection apparatus, a method for manufacturing a molded product, and a molded product manufactured thereby. More specifically, proposed are: a method for manufacturing an electrically conductive contact pin, the method including the steps of providing an anodic aluminum oxide mold made of an anodic aluminum oxide film and having openings formed by etching at least partial regions of the anodic aluminum oxide mold to correspond to a shape of electrically conductive contact pins, forming a metal filler in each of the openings, and removing the anodic aluminum oxide mold; an electrically conductive contact pin including at least one micro-convex portion and a plurality of fine trenches; an inspection apparatus; a method for manufacturing a molded product; and a molded product manufactured thereby.
Type:
Application
Filed:
October 7, 2021
Publication date:
November 30, 2023
Applicant:
POINT ENGINEERING CO., LTD.
Inventors:
Bum Mo AHN, Seung Ho PARK, Sung Hyun BYUN