Abstract: A scavenger valve and method of directing gas in a two stroke engine are provided involving poppet elements in a scavenger valve with specific multiple, different flow paths from individual poppet heads.

Abstract: A vehicle seat, such as for a motor vehicle seat, adapted to be transferable from at least one use position, which is suitable for transporting a passenger, into an easy entry position as a non-use position, and back, may have a seat cushion, a backrest, and a seat frame. The seat cushion and the backrest may be coupled to the seat frame, a base and a kinematics for the articulated connection of the seat frame to the base. The kinematics may have at least one link articulated connecting the seat frame to the base. The at least one link may be lockable by a disc shaped fitting or the at least one link may be lockable with the seat frame by a locking device.

Abstract: A substrate, a semiconductor package, and a method of manufacturing the same are provided. The substrate includes an interposer element. The interposer element has a first surface and a second surface opposite to the first surface. At least two rows of pads are disposed adjacent to the first surface of the interposer element. The interposer element includes at least one slot disposed between the two rows of pads and extending from the first surface to the second surface, wherein a projection area extending from an edge of the slot to an edge of the first surface of the interpose element is nonoverlapping at least one pad.

Abstract: In one embodiment, a vehicle defogging system may include a side mirror defogger, one or more other vehicle defoggers, one or more sensors, and a control unit. The side mirror defogger is independently controllable from the one or more other vehicle defoggers. The one or more sensors are configured to output a signal indicative a substance on a side mirror of a vehicle. The control unit is configured to detect the substance on the side mirror based on the signal of the one or more sensors, and activate the side mirror defogger in response to detecting the substance on the side mirror.

Abstract: A semiconductor device package includes a substrate and a shielding layer. The substrate has a first surface, a second surface opposite to the first surface and a first lateral surface extending between the first surface and the second surface. The substrate has an antenna pattern disposed closer to the second surface than the first surface. The shielding layer extends from the first surface toward the second surface of the substrate. The shielding layer covers a first portion of the first lateral surface adjacent to the first surface of the substrate. The shielding layer exposes a second portion of the first lateral surface adjacent to the second surface of the substrate.

Abstract: A thermoplastic resin composition that contains, based on 100 mass parts for a total of (A) and (B), at least 20 mass parts but less than 50 mass parts of (A) a polyalkylene terephthalate resin and more than 50 mass parts and not more than 80 mass parts of (B) a polystyrene resin or a rubber-reinforced polystyrene resin, wherein an intrinsic viscosity (IVA) of the polyalkylene terephthalate resin (A) is 0.3 to 0.8 dl/g and a melt viscosity (?B) of the polystyrene resin or rubber-reinforced polystyrene resin (B) at 250° C. and 912 sec?1 is at least 80 Pa·sec.

Abstract: A semiconductor device package includes a substrate, and interconnection structure and a package body. The interconnection structure is disposed on the substrate. The interconnection structure has a conductive structure and a first dielectric layer covering a portion of the conductive structure. The conductive structure defines an antenna feeding point. The package body is disposed on the substrate and covers the interconnection structure.

Abstract: A solder reflow oven may include a reflow chamber and a plurality of vertically spaced apart wafer-support plates positioned in the reflow chamber. A plurality of semiconductor wafers each including a solder are configured to be disposed in the reflow chamber such that each semiconductor wafer is disposed proximate to, and vertically spaced apart from, a wafer-support plate. Each wafer-support plate may include at least one of liquid-flow channels or resistive heating elements. A control system control the flow of a hot liquid through the channels or activate the heating elements to heat a wafer to a temperature above the solder reflow temperature.

Abstract: The present invention relates to functionalized polymers useful for coating surfaces, such as the internal bore of a column. In particular embodiments, such functionalized polymers provide a selective stationary phase useful for separating and detecting organophosphorous agents. Methods of using such polymers are also described herein.

Abstract: A current-averaging audio amplifier for vehicles. The current averaging audio amplifier is connectable to a DC power source and a load, and may generally comprise a power input to receive a DC electrical power from the DC power source. The system may further include a voltage converter, such as a boost converter, connected to the power input, such that the voltage converter can receive electrical power from the DC power source. The system also includes a rechargeable battery coupled to the voltage converter, such that the voltage converter charges the rechargeable battery. An audio amplifier can be powered by the rechargeable battery and connectable to supply power to the load, wherein the average power supplied by the rechargeable battery to the audio amplifier in a finite time interval differs from the average power supplied by the DC power source to the voltage converter.

Abstract: A laser shock peening apparatus for the surface of a workpiece, said apparatus comprising a resonant cavity. When said apparatus is used to conduct laser shock peening, because of the presence of the resonant cavity, shock waves that would typically escape outward may instead be utilized, and composite shock waves may be formed as a result of the wave reflection and convergence effects of the resonant cavity. Said waves can then be used on the surface of a workpiece twice or multiple times, thereby greatly increasing energy utilization rates. In addition, a fluid-based confinement layer is limited to the inside of the resonant cavity and has a fixed shape, thereby effectively solving the problems of the poor stability of a fluid-based confinement layer and the difficulty with controlling the thickness of such a confinement layer.

Abstract: Disclosed herein are systems and methods for estimating a period and frequency of a waveform. In one embodiment a system may comprise an input configured to receive a signal comprising a representation of the waveform. A period determination subsystem may calculate an estimated period of the signal based on a period determination function. An estimated period adjustment subsystem may determine an adjustment to the estimated period based on a result of the period determination function. A quality indicator subsystem configured to evaluate a measurement quality indictor function based on the estimated period, and to selectively update the period of the waveform based on the measurement quality indicator. A control action subsystem configured to implement a control action based on the period of the waveform.

Abstract: Connector housings and connector assemblies for mechanically connecting a pin to a housing with or without electrical conductivity. A connector housing can be formed by attaching two housing sections together with one or both housing sections formed at least in part by a stamping process. The connector housing can have an outer contour, such as an outer perimeter, with one or more sides and with a joining section connecting two adjacent sides together. The two or more sides can be used for handling, aligning, and/or assembling of the connector housing to a cavity.

Abstract: System, methods, and devices for measuring the performance of a component of a communications network recently installed by a technician using proactive network maintenance parameters, and further assessing the installation performed by the technician.

Abstract: A thermal management assembly is provided for both removing heat and absorbing acoustic energy. The thermal management assembly includes a heat sink base component and a plurality of thermally conductive fins disposed in a sparsely-arranged array in thermal communication with the heat sink base component. Each fin defines a two-sided Helmholtz unit cell disposed in a periodic array extending from the heat sink base component. Each unit cell includes a lossy resonator and a lossless resonator. The lossy resonator includes a first chamber portion bounded by at least one first boundary wall defining a first chamber volume, and a first neck forming an opening in the first chamber portion. The lossless resonator includes a second chamber portion bounded by at least one second boundary wall defining a second chamber volume, and a second neck forming an opening in the second chamber portion.

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor package structure including the same are provided. The substrate structure includes a substrate, a first electronic component, a second electronic component and a plurality of metal layers. The first electronic component is disposed within the substrate. The second electronic component is disposed within the substrate and arranged in a horizontal direction with the first electronic component. The metal layers are disposed above an upper surface of the substrate. The number of metal layers above the first electronic component is greater than the number of metal layers above the second electronic component.

Abstract: A semiconductor package structure and a method for manufacturing the same are provided. The semiconductor package structure includes a substrate, a chip and a dielectric structure. The substrate includes a first portion and a second portion surrounding the first portion. The second portion defines a cavity over the first portion. The chip includes a terminal on an upper surface of the chip. The dielectric structure fills the cavity and laterally encroaches over the upper surface of the chip. The dielectric structure is free from overlapping with the terminal of the chip.

Abstract: A tire-mounting structure, the tire-mounting structure having a laterally extending end wall, two protrusions longitudinally extending from the end wall, the two protrusions spaced apart from one another, and a recess formed between the two protrusions. The recess is dimensioned such that a first distance between the two protrusions at a distal location relative to the end wall is longer than a second distance between the two protrusions at a proximal location relative to the end wall, where the first distance corresponds to a first tire dimension and the second distance corresponds to a second tire dimension, the second tire dimension being narrower than the first tire dimension.

Abstract: Provided are a preamble symbol receiving method and device, characterizing in that the method comprises the following steps: processing a received signal; judging whether the processed signal obtained contains the preamble symbol desired to be received; and if a judgement result is yes, determining the position of the preamble symbol and resolving signalling information carried by the preamble symbol, wherein the received preamble symbol comprises at least one time-domain symbol generated by a transmitting end using a free combination of any number of first three-segment structures and/or second three-segment structures according to a predefined generation rule, the first three-segment structure containing: a time-domain main body signal, a prefix generated based on the entirety or a portion of the time-domain main body signal, and a postfix generated based on the entirety or a portion of a partial time-domain main body signal, and the second three-segment structure containing: the time-domain main body signa

Abstract: A method comprises making initial predictions of whether a first vehicle will perform a lane change at a plurality of future time steps based on sensor data captured by an egovehicle; and in response to making an initial prediction that the first vehicle will perform a lane change at a first one of the future time steps, making final predictions that the first vehicle will perform a lane change at each of a plurality of time steps subsequent to the first one of the future time steps.