Abstract: Battery exchange system for an electric vehicle, comprising: a battery unit; a battery receiving unit adapted for being fixed at or near a bottom surface of an electric vehicle and comprising a housing with an opening at a bottom side of housing for at least partially receiving the battery unit in the housing through the opening, wherein the battery receiving unit has a central axis which extends through the opening; wherein the battery receiving unit is adapted for allowing movement of the battery unit along its central axis between an unmounted position below the battery receiving unit and a mounted position at least partially within the battery receiving unit, wherein the battery unit comprises first engagement elements and the battery receiving unit comprises second engagement elements, each of the first and second engagement elements being adapted for engaging each other while moving relative to each other along an associated sloping path in order to lift the battery unit from the unmounted position to t

Abstract: A treatment apparatus for treating wastewater produced by purification of an energy gas and containing at least an ammonium ion includes a decompression facility for reducing a pressure of the wastewater, an alkaline agent addition facility for adding an alkaline agent to the wastewater whose pressure has been reduced, and an ammonia stripping facility for stripping ammonia in the wastewater to which the alkaline agent has been added.

Abstract: A semiconductor device package includes a plurality of semiconductor chips and an interposer structure. The interposer structure has a plurality of tiers for accommodating the plurality of semiconductor chips. The interposer structure includes at least one conductive via connecting to a pad of the plurality of semiconductor chips.

Abstract: A semiconductor package structure includes a first substrate, a second substrate, a pad layer and a conductive bonding layer. The first substrate has a first surface and a second surface opposite to the first surface. The second substrate has a first surface and a second surface opposite to the first surface. The second substrate is disposed side-by-side with the first substrate. The pad layer is disposed on the second surface of the first substrate and the second surface of the second substrate. The conductive bonding layer is disposed between the pad layer and the second surfaces of the first substrate and the second substrate.

Abstract: Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

Abstract: An apparatus and methods are provided for an air filter precleaner for an open air filter box. The air filter precleaner includes a filter medium between a base and a grating that are fastened over an opening into an interior of the air filter box. The filter medium comprises a sheet of filter material having a shape and a size suitable for being supported between the base and the grating. The base is a rigid member that supports the filter medium in a sheet configuration, such that the airstream passes through the filter medium before entering the air filter box. The grating is a rigid member comprising a screen portion surrounded by a frame that is configured to be fastened onto the air filter box. The screen portion comprises a shaped lattice that allows the airstream to pass through the filter medium before entering the air filter box.

Abstract: Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

Abstract: A semiconductor package device includes a first conductive wall, a second conductive wall, a first insulation wall, a dielectric layer, a first electrode, and a second electrode. The first insulation wall is disposed between the first and second conductive walls. The dielectric layer has a first portion covering a bottom surface of the first conductive wall, a bottom surface of the second conductive wall and a bottom surface of the first insulation wall. The first electrode is electrically connected to the first conductive wall. The second electrode is electrically connected to the second conductive wall.

Abstract: Systems and methods may mitigate risk of fire caused by an electric power system. In one embodiment, a system may include an intelligent electronic device (IED). The IED includes a communication subsystem to receive a signal from a sensor related to a condition of the electric conductor. A processing subsystem in communication with the communication subsystem may operate in at least two modes comprising a high security mode and a fire prevention mode. In the fire prevention mode, the IED may interrupt a flow of electric current based on the signal from the at least one sensor associated with the electric conductor. In the high security mode, the system may interrupt a flow of electric current based on the signal from the at least one sensor associated with the electric conductor and based on a second condition relating to the electric conductor.

Abstract: A multilayer thin film structure having a reflective core particle, a dielectric layer directly encapsulating the reflective core particle, an absorber layer directly encapsulating the dielectric layer; an outer layer encapsulating the absorber layer. The multilayer thin film structure has a hue shift of less than 30° in the Lab color space when viewed at angles from 0° to 45°.

Abstract: A vehicle seat may have adjustment kinematics with movable rockers. At least one rocker is mounted rotatably about an axis, and a toothed segment which may be connected to the at least one rocker may be provided. The vehicle seat may have a drive for moving the at least one rocker, and the drive may be mounted on a seat frame. A pinion of the drive may mesh with the toothed segment. By aligning the position of the entire drive relative to the side part via a compensating body, the pinion may be positioned relative to the toothed segment in a manner free from play.

Abstract: A dryer for drying a liquid feed into a powder comprises a drying chamber defined by a chamber wall including a bottom wall portion; a feed inlet for receiving the liquid feed and dispersing particulate feed into the drying chamber; at least one air inlet for entering drying air into the drying chamber; and at least one drying chamber outlet for dried powder and/or spend drying air from the drying chamber. The feed inlet comprises a decanter centrifuge with an axis of rotation; a first axial end; a second axial end; and a solid phase outlet at the first axial end.

Abstract: Bismuth-based alloys and the use of plugs made from such alloys to seal wells as well as the plugs themselves are provided. There is provided an alloy of bismuth, tin, and antimony comprising at least about 50% by weight bismuth, about 30 to about 35% by weight tin, and about 1.8 to about 2.8% by weight antimony; and an alloy of bismuth and silver comprising about 91 to about 97% by weight bismuth and about 3 to about 9% by weight silver. There is also provided a method for producing a plug comprising an alloy of bismuth, tin, and antimony; and a method for producing a plug comprising an alloy of bismuth and silver; wherein a length of a well is filled with the molten alloy and the molten alloy is allowed to solidify.

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a first die, a second die, and a thermal dissipation element. The first die has a first surface. The second die is disposed on the first surface. The thermal dissipation element is disposed on the first surface. The thermal dissipation element includes a first portion extending in a first direction substantially parallel to the first surface and partially covered by the second die and a second portion extending in a second direction substantially perpendicular to the first surface to be adjacent to an edge of the second die.

Abstract: An organic solvent-free method for producing a plurality of microsphere having an average diameter of less than 500 ?m in diameter and having average contact angle ?c greater than 140°, consisting essentially of a biocompatible hot-melt carrier vehicle and a payload substance to be delivered, comprising; melting and mixing a polymer carrier vehicle which is solid at room temperature and at least one payload substance, and dispensing microportions of the molten mixture through a droplet-forming space onto a cooled solid superoleophobic surface.

Abstract: Systems, apparatus, methods, and techniques of assembly of discrete modules of a control panel are disclosed. The modules can be independently wired, tested, and installed into a control panel. Module definitions are defined specifying components to perform the electrical function, a mechanical arrangement of the components, electrical connections, and logical interactions of the module. A bill of materials can be generated based on a designation of a set of modules for a control panel and the module definitions. Modularly assembled control panels are disclosed. An assembly frame is described herein for temporarily mounting components of a module for independent assembly of a control module and for eventual removal and installation into a control panel frame. The assembly frame may include a faceplate frame and side frames and temporary mounting features.

Abstract: A semiconductor device package includes a first substrate and a second substrate arranged above the first substrate. A first connector is disposed on the first substrate, and a first conductor passes through the second substrate and connects to the first connector.

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Abstract: Detector module designs for radiographic imaging include first and second layers of scintillator rods or pixel arrays oriented in first and second directions. The first and second directions are transversely oriented to define a light sharing region between the first and second layers. Encoding features may be disposed in, on or between the first and second layers, and configured to modulate propagation of optical signals therealong or therebetween.